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SPC560P50L3BEABR

STMicroelectronics

SPC560P50L3BEABR by STMicroelectronics

SPC560P50L3BEABR microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w -40 °C to 105 °C, and supports up to 16 MHz clock frequency. With 67 I/O lines and integrated ADC/DMA channels, it's ideal for industrial applications. Its compact flatpack design ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,912 parts In-Stock

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5,912

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Digiode

USA . 2,012 parts In-Stock

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2,012

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Anansix

USA . 1,704 parts In-Stock

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1,704

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Vigor

Singapore . 3,698 parts In-Stock

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$4.570

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-

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3,698

$4.570

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AZTECH Wire

Italy . 245 parts In-Stock

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$8.940

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245

$8.940

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Microchip USA

USA . 2,107 parts In-Stock

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$14.599

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2,107

$14.599

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IDEA Electronic Components Group

UK . 2,015 parts In-Stock

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$32.997

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$29.697

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2,015

$32.997

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$29.697

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MKK Technologies

India . 1,895 parts In-Stock

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$62.048

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1,895

$62.048

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DigiPath Technology Company

USA . 1,895 parts In-Stock

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$62.048

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$62.048

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Kepictronics

USA . 184,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,697 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Corphita

USA . 906 parts In-Stock

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Parana Technologies

USA . 482 parts In-Stock

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$39.453

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482

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$39.453

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Overview

Unlock the potential of your projects with the SPC560P50L3BEABR microcontroller from STMicroelectronics. Renowned for their reliability and innovation, STMicroelectronics delivers a robust solution designed for industrial applications that demand precision and efficiency. With enhanced performance in extreme conditions, this versatile microcontroller ensures seamless integration, empowering developers to create smarter, more efficient systems while enjoying unmatched support and quality assurance. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that enhances reliability in various environments.

Surface Mount: YES

Allows for compact design and automated assembly, which reduces manufacturing costs.

Maximum Supply Voltage: 3.465 V

Ensures compatibility with a range of power supply configurations.

Address Bus Width: 32

Enables access to a larger memory space, enhancing performance for applications requiring high data processing.

Package Shape: SQUARE

Facilitates efficient use of PCB space, allowing for more compact designs.

Bit Size: 32

Provides better data handling and processing capabilities compared to lower bit sizes.

No. of Terminals: 100

Offers multiple connectivity options for peripherals and sensors, enhancing functionality.

Package Style (Meter): FLATPACK

Saves space on PCBs and simplifies placement using surface mount technology.

Minimum Supply Voltage: 2.97 V

Allows operation in lower voltage applications, increasing flexibility in design.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications with high thermal requirements, ensuring reliability.

Minimum Operating Temperature: -40 °C

Enables operation in extreme environments, making it versatile for various applications.

ADC Channels: YES

Integrates analog-to-digital conversion capabilities, essential for sensor-based applications.

DMA Channels: YES

Allows for efficient data transfers without CPU intervention, improving system performance.

Terminal Position: QUAD

Provides multiple connection points for enhanced PCB design flexibility.

Width: 14 mm

Compact size fits well in space-constrained applications.

External Data Bus Width: 32

Supports efficient communication with external devices, enhancing overall system capability.

Maximum Clock Frequency: 16 MHz

Ensures adequate processing speed for most embedded applications.

Length: 14 mm

Contributes to a compact footprint, optimizing usage of board space.

Temperature Grade: INDUSTRIAL

Designed for durability and reliability in harsh industrial conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficiency and speed, which is crucial for embedded applications.

Technology: CMOS

Ensures low power consumption while maintaining high performance.

Terminal Form: GULL WING

Facilitates easy soldering and assembly, promoting efficient manufacturing.

Nominal Supply Voltage: 3.3 V

Standard operating voltage for many applications, ensuring compatibility.

PWM Channels: YES

Supports advanced control functionalities for motors and other devices.

ROM Programmability: FLASH

Flexibility to update firmware easily, enhancing product longevity.

Terminal Pitch: 0.5 mm

Enables a high number of connections in a compact design.

Speed: 64 rpm

Provides necessary performance for applications requiring moderate-speed processing.

No. of I/O Lines: 67

Offers extensive connectivity, making it suitable for a wide range of applications.

Technical Specifications

Microcontrollers SPC560P50L3BEABR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

ROM Programmability:

FLASH

Speed:

64 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC560P50L3BEABR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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