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SPC560P44L5CEFBY

STMicroelectronics

SPC560P44L5CEFBY by STMicroelectronics

SPC560P44L5CEFBY from STMicroelectronics is a 32-bit automotive microcontroller with a max temp of 125 °C and 144 terminals. It features 16 DMA channels, 13 ADCs, and supports CAN/LIN connectivity. Ideal for automotive applications requiring robust performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,654 parts In-Stock

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8,654

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Anansix

USA . 2,612 parts In-Stock

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2,612

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Digiode

USA . 483 parts In-Stock

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483

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Distributors (Availability)

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Microchip USA

USA . 923 parts In-Stock

1+ parts

$10.300

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923

$10.300

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AZTECH Wire

Italy . 1,116 parts In-Stock

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$18.570

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1,116

$18.570

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IDEA Electronic Components Group

UK . 2,198 parts In-Stock

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$55.557

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$50.001

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2,198

$55.557

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$50.001

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MKK Technologies

India . 2,015 parts In-Stock

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$104.471

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2,015

$104.471

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DigiPath Technology Company

USA . 2,015 parts In-Stock

1+ parts

$104.471

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2,015

$104.471

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Vigor

Singapore . 2,185 parts In-Stock

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2,185

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Parana Technologies

USA . 901 parts In-Stock

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$66.427

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901

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$66.427

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Corphita

USA . 701 parts In-Stock

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701

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Overview

Unlock your next innovation with the SPC560P44L5CEFBY microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for automotive applications, this versatile chip delivers robust performance and reliability under extreme conditions. Experience seamless connectivity with multiple protocols, ensuring your projects are future-ready. Elevate your designs while benefiting from ST's renowned expertise—where quality meets cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures longevity and resistance to environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for higher density integration and is ideal for space-constrained designs.

Address Bus Width: 32

A 32-bit address bus enables access to a larger memory space, enhancing the functionality and performance of the microcontroller.

Package Shape: SQUARE

Square package shape allows for efficient layout and space utilization on PCBs.

Bit Size: 32

The 32-bit architecture provides increased processing power and efficiency in handling complex tasks.

No. of Terminals: 144

With 144 terminals, this microcontroller supports a wide range of peripherals and provides ample connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style reduces space requirements on PCBs and facilitates easier soldering processes.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C makes this microcontroller suitable for high-temperature environments.

CPU Family: SPC56

Being part of the SPC56 CPU family ensures high performance and reliability necessary for automotive applications.

No. of External Interrupts: 32

32 external interrupts allow for extensive event handling, making it versatile for various real-time applications.

Minimum Operating Temperature: -40 °C

This microcontroller can operate in extremely low temperatures, ensuring reliability in harsh environments.

ADC Channels: YES

Built-in ADC channels are essential for interfacing with analog sensors, enhancing its capacity for diverse applications.

DMA Channels: YES

Dedicated DMA channels improve data transfer efficiency, reducing CPU load and speeding up operations.

Terminal Position: QUAD

Quad terminal arrangement facilitates better signal integrity and allows for improved routing on PCBs.

ROM Words: 393216

With substantial ROM, this microcontroller can support complex programs and extensive data storage.

Width: 20 mm

Compact size makes it suitable for space-constrained designs while still offering high functionality.

Data EEPROM Size: 64K

A generous EEPROM size enables the storage of critical data settings and values for permanent retention.

Boundary Scan: YES

Boundary scan support facilitates easier debugging and testing of circuits, leading to higher production quality.

External Data Bus Width: 32

A wider external data bus allows for more efficient communication with external devices, enhancing system versatility.

Peripherals: DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Diverse peripherals provide significant versatility in application development, allowing for complex functionality.

Maximum Clock Frequency: 40 MHz

A high clock frequency translates to better performance, enabling faster processing of tasks and lower response times.

Length: 20 mm

The 20 mm length, combined with the compact design, is ideal for applications with spatial constraints.

Temperature Grade: AUTOMOTIVE

Specifically rated for automotive use, this microcontroller ensures reliability and safety in vehicle applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient instruction processing and low power consumption.

RAM Bytes: 32768

A decent amount of RAM ensures smooth execution of tasks and efficient data handling during operations.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals allow for ease of PCB mounting and ensure effective soldering, improving assembly reliability.

Analog To Digital Converters: 13-Ch 10-Bit (2)

Multiple ADC channels with good resolution enable accurate digital readings from analog sensors, enhancing application capabilities.

Nominal Supply Voltage: 5 V

Standard 5 V supply voltage availability allows for easy integration with other devices and power systems.

No. of DMA Channels: 16

The presence of multiple DMA channels enhances data transfer efficiency without burdening the CPU.

PWM Channels: YES

Support for PWM channels allows for precise control over motor speeds and other processes, facilitating various applications.

Connectivity: CAN, LIN(2), SPI(4)

Rich connectivity options enable seamless communication with multiple devices, perfect for automotive networking and control systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and software modifications, ensuring the microcontroller remains adaptable.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for denser circuit configurations and improved performance in compact designs.

Format: FIXED POINT

The fixed-point format supports efficient calculations, making it suitable for real-time processing in applications.

Speed: 60 rpm

Ability to handle 60 RPM applications adds versatility for various motor control use cases.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows effective program execution using compact memory, enhancing performance in small footprint applications.

No. of I/O Lines: 108

A high number of I/O lines enables extensive interfacing capabilities with sensors, actuators, and other devices.

Technical Specifications

Microcontrollers SPC560P44L5CEFBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

32

No. of I/O Lines:

108

No. of Serial I/Os:

0

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

60 rpm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN, LIN(2), SPI(4)

Peripherals:

DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Analog To Digital Convertors:

13-Ch 10-Bit (2)

Trade Compliance

SPC560P44L5CEFBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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