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SPC560P44L5CEFBR

STMicroelectronics

SPC560P44L5CEFBR by STMicroelectronics

SPC560P44L5CEFBR by STMicroelectronics is a 32-bit automotive microcontroller featuring a 40 MHz max clock, 144 terminals, and -40 °C to 125 °C operating temp range. It supports CAN/LIN connectivity and includes ADC/DMA channels for efficient data processing. Ideal for automotive applications requiring robust performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,990 parts In-Stock

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7,990

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Digiode

USA . 4,132 parts In-Stock

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4,132

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Anansix

USA . 1,619 parts In-Stock

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1,619

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,253 parts In-Stock

1+ parts

$11.614

100+ parts

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1,253

$11.614

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AZTECH Wire

Italy . 1,057 parts In-Stock

1+ parts

$15.340

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1,057

$15.340

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IDEA Electronic Components Group

UK . 319 parts In-Stock

1+ parts

$23.093

100+ parts

-

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$20.784

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319

$23.093

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$20.784

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MKK Technologies

India . 2,083 parts In-Stock

1+ parts

$43.425

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2,083

$43.425

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DigiPath Technology Company

USA . 2,083 parts In-Stock

1+ parts

$43.425

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2,083

$43.425

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Component Stockers USA

USA . 488 parts In-Stock

1+ parts

$99.990

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488

$99.990

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Vigor

Singapore . 9,820 parts In-Stock

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9,820

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Corphita

USA . 1,585 parts In-Stock

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1,585

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Parana Technologies

USA . 852 parts In-Stock

1+ parts

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100+ parts

$27.611

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852

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$27.611

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Overview

Unlock unparalleled performance with the SPC560P44L5CEFBR microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for automotive applications, this robust solution ensures reliability even in extreme conditions, making it perfect for demanding environments. Benefit from advanced features like multiple communication interfaces and efficient processing capabilities, giving your projects the edge they need to thrive. Choose excellence and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of space on printed circuit boards (PCBs).

Address Bus Width: 32

A 32-bit address bus enables a larger memory space, allowing for more complex applications and greater data handling capabilities.

Package Shape: SQUARE

The square package shape provides a uniform thermal and mechanical performance, making it stable under varying operational conditions.

Bit Size: 32

With a 32-bit architecture, this microcontroller can process more data simultaneously, improving performance in computational tasks.

No. of Terminals: 144

A high terminal count allows for more connections and flexibility in interfacing with various components, enhancing integration capabilities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack style aids in efficient space utilization and is suited for high-density PCB designs.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this microcontroller ideal for automotive and industrial environments where heat may be a concern.

CPU Family: SPC56

The SPC56 family offers specialized features tailored for automotive applications, emphasizing reliability and performance.

No. of External Interrupts: 32

A high number of external interrupts allows for responsive system designs that can handle multiple events efficiently.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 125 °C) ensures reliability in extreme environments, making it suitable for outdoor and automotive applications.

ADC Channels: YES

Built-in Analog-to-Digital Converters (ADC) enable the microcontroller to interface with analog sensors, expanding its application range.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency, reducing CPU load and improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning allows for better thermal dispersion and improves soldering quality during manufacturing.

ROM Words: 393216

A large ROM capacity of 393216 words enables the microcontroller to store complex programs and applications.

Width: 20 mm

Compact dimension allows for ease of integration in space-constrained applications.

Data EEPROM Size: 64K

The onboard EEPROM provides non-volatile storage for critical data, ensuring that information is retained even when power is removed.

Boundary Scan: YES

Boundary scan support simplifies testing and debugging processes, enhancing reliability during manufacturing and maintenance.

External Data Bus Width: 32

A 32-bit external data bus enhances data throughput, improving performance in applications that require fast processing.

Peripherals: DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Comprehensive peripheral support allows for diverse application scenarios from motor control to environmental monitoring.

Maximum Clock Frequency: 40 MHz

A high clock frequency of 40 MHz ensures rapid processing, suitable for real-time applications.

Length: 20 mm

The compact length aids in various circuit designs and form-factor requirements.

Temperature Grade: AUTOMOTIVE

Automotive-grade standards ensure robustness and compatibility with the stringent requirements of automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture promotes efficient instruction execution, ensuring high performance for demanding tasks.

RAM Bytes: 32768

32 KB of RAM allows for complex computations and buffering, essential for performance in multitasking environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, increasing overall efficiency.

Terminal Form: GULL WING

The gull wing design facilitates easy soldering and assembly, improving production efficiency.

Analog To Digital Converters: 13-Ch 10-Bit (2)

Multiple ADC channels allow for simultaneous sensor readings, enhancing data acquisition capabilities.

Nominal Supply Voltage: 5 V

A standard 5V supply voltage simplifies design considerations and promotes compatibility with commonly used components.

No. of DMA Channels: 16

A rich number of DMA channels allows efficient data transfer processes, optimizing system performance.

PWM Channels: YES

Built-in PWM channels are perfect for applications requiring control over speed, position, or power.

Connectivity: CAN, LIN(2), SPI(4)

Robust connectivity options provide flexibility for communication with a wide range of devices, enhancing application versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in application development.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting, which is valuable for advanced, compact electronic designs.

Format: FIXED POINT

Fixed-point format simplifies computations for certain applications, making it efficient in environments where performance is key.

Speed: 60 rpm

The specified speed (60 rpm) indicates potential for precise control in applications such as motors, enhancing efficiency.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for a compact instruction set, optimizing memory usage and computational efficiency.

No. of I/O Lines: 108

A high number of I/O lines provides ample interface options for various peripherals, enhancing versatility in design.

Technical Specifications

Microcontrollers SPC560P44L5CEFBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

32

No. of I/O Lines:

108

No. of Serial I/Os:

0

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

60 rpm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN, LIN(2), SPI(4)

Peripherals:

DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Analog To Digital Convertors:

13-Ch 10-Bit (2)

Trade Compliance

SPC560P44L5CEFBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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