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SPC560P44L3CEFAY

STMicroelectronics

SPC560P44L3CEFAY by STMicroelectronics

SPC560P44L3CEFAY from STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 3.465V and operates b/w -40 °C to 125 °C. It features 100 terminals, 25 external interrupts, and supports CAN/LIN connectivity. Ideal for automotive applications requiring robust performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,637 parts In-Stock

1+ parts

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7,637

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Digiode

USA . 4,769 parts In-Stock

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4,769

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Anansix

USA . 1,895 parts In-Stock

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1,895

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,680 parts In-Stock

1+ parts

$5.380

100+ parts

-

1k+ parts

-

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7,680

$5.380

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AZTECH Wire

Italy . 1,043 parts In-Stock

1+ parts

$11.440

100+ parts

-

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1,043

$11.440

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IDEA Electronic Components Group

UK . 818 parts In-Stock

1+ parts

$59.622

100+ parts

-

1k+ parts

$53.660

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-

818

$59.622

-

$53.660

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Component Stockers USA

USA . 536 parts In-Stock

1+ parts

$86.380

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-

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536

$86.380

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MKK Technologies

India . 502 parts In-Stock

1+ parts

$112.116

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502

$112.116

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DigiPath Technology Company

USA . 502 parts In-Stock

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$112.116

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502

$112.116

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QUARKTWIN TECHNOLOGY LTD

USA . 14,978 parts In-Stock

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14,978

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Corphita

USA . 3,907 parts In-Stock

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3,907

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Metaverse IC Inc.

Canada . 2,700 parts In-Stock

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2,700

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Assy Fe

Spain . 2,700 parts In-Stock

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2,700

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Microchip USA

USA . 2,578 parts In-Stock

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2,578

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Parana Technologies

USA . 1,609 parts In-Stock

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$71.288

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1,609

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$71.288

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Overview

Unleash the power of innovation with the SPC560P44L3CEFAY microcontroller from STMicroelectronics, a trusted leader in high-performance solutions. Designed for automotive applications, this robust controller offers exceptional reliability and versatility, ensuring seamless integration into your projects. With advanced features like multiple DMA channels and extensive connectivity options, it empowers engineers to create cutting-edge designs efficiently, enhancing performance and reducing time-to-market. Experience the quality and value that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and reliability in various environments.

Surface Mount: YES

Allows for increased integration density and automated assembly processes.

Maximum Supply Voltage: 3.465 V

Supports a wide voltage range for compatibility with various power supply designs.

Address Bus Width: 32

Enables addressing of a larger memory space, enhancing performance in data-intensive applications.

Package Shape: SQUARE

Optimal shape for efficient PCB layout and space utilization.

Bit Size: 32

Provides significant computing power for complex calculations and processing.

No. of Terminals: 100

Offers ample connection points for peripherals, expanding functionality.

Package Style (Meter): FLATPACK

Suitable for surface mount technology, aiding in compact designs.

Minimum Supply Voltage: 2.97 V

Ensures functionality in low-power environments, improving efficiency.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature conditions, ideal for automotive applications.

CPU Family: SPC56

Designed for high-performance applications, specifically targeting automotive markets.

No. of External Interrupts: 25

Allows for numerous external signals, enhancing responsiveness in real-time applications.

Minimum Operating Temperature: -40 °C

Ensures reliability in extreme cold environments, suitable for various outdoor applications.

ADC Channels: YES

Incorporates ADC capabilities for processing analog signals, enabling versatile sensor integration.

DMA Channels: YES

Supports Direct Memory Access for improved data transfer efficiency, boosting overall performance.

Terminal Position: QUAD

Facilitates effective connectivity, ensuring robust electrical connections.

ROM Words: 393216

Provides substantial memory for program storage, accommodating complex applications.

Width: 14 mm

Compact design allows for space-saving implementations in various projects.

Data EEPROM Size: 64K

Offers enough non-volatile memory for saving critical parameters and data.

Boundary Scan: YES

Facilitates testing and debugging of circuit boards, enhancing reliability.

External Data Bus Width: 32

Supports high-speed data transfers for demanding applications.

Peripherals: DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Rich peripheral set enhances versatility, making it suitable for diverse applications.

Maximum Clock Frequency: 16 MHz

Delivers sufficient processing speed for a variety of control tasks.

Length: 14 mm

Compact size beneficial for embedded system designs with limited PCB space.

Temperature Grade: AUTOMOTIVE

Built to withstand automotive environment, ensuring reliability in critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes efficient architecture for optimized performance, great for resource-constrained designs.

RAM Bytes: 32768

Adequate RAM for executing programs and supporting multitasking applications.

Technology: CMOS

Offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Ensures reliable connections and ease of soldering during PCB assembly.

Analog To Digital Convertors: 13-Ch 10-Bit (2)

Provides multiple channels for accurate analog signal conversion, enhancing data acquisition capabilities.

Nominal Supply Voltage: 3.3 V

Standard voltage level supports efficient power management in microcontroller applications.

No. of DMA Channels: 16

Offers multiple channels enhancing data handling capabilities in high-performance systems.

PWM Channels: YES

Integrated PWM allows for motor control and other applications requiring duty cycle modulation.

Connectivity: CAN, LIN(2), SPI(4)

Multi-protocol support ensures versatility in communications across different systems.

ROM Programmability: FLASH

Allows firmware updates, providing flexibility in functionality over the product's lifetime.

Terminal Pitch: 0.5 mm

Fine pitch allows for high-density packing on PCBs, maximizing space.

Format: FIXED POINT

Optimized for arithmetic operations, enhancing performance in real-time tasks.

Speed: 64 rpm

Suitable for applications requiring controlled motion or processes at low speeds.

On Chip Program ROM Width: 8

Facilitates efficient data handling and computation within the microcontroller.

No. of I/O Lines: 67

Generous number of I/O lines enhances interaction with external components, increasing design flexibility.

Technical Specifications

Microcontrollers SPC560P44L3CEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

25

No. of I/O Lines:

67

No. of Serial I/Os:

0

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

64 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN, LIN(2), SPI(4)

Peripherals:

DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Analog To Digital Convertors:

13-Ch 10-Bit (2)

Trade Compliance

SPC560P44L3CEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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