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SPC560P40L3CEFAY

STMicroelectronics

SPC560P40L3CEFAY by STMicroelectronics

STMicroelectronics SPC560P40L3CEFAY microcontroller features 32-bit CPU, 262144 ROM words, and 20480 RAM bytes. Ideal for automotive applications with CAN, LIN, UART connectivity and operating temperature range of -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,519 parts In-Stock

1+ parts

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8,519

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Digiode

USA . 4,033 parts In-Stock

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4,033

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Anansix

USA . 451 parts In-Stock

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451

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Distributors (Availability)

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AZTECH Wire

Italy . 239 parts In-Stock

1+ parts

$13.150

100+ parts

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239

$13.150

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IDEA Electronic Components Group

UK . 1,356 parts In-Stock

1+ parts

$36.698

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-

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$33.028

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1,356

$36.698

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$33.028

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MKK Technologies

India . 1,874 parts In-Stock

1+ parts

$69.008

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1,874

$69.008

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DigiPath Technology Company

USA . 1,874 parts In-Stock

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$69.008

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1,874

$69.008

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QUARKTWIN TECHNOLOGY LTD

USA . 18,753 parts In-Stock

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18,753

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Microchip USA

USA . 4,935 parts In-Stock

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4,935

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Vigor

Singapore . 4,566 parts In-Stock

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4,566

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Corphita

USA . 4,398 parts In-Stock

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4,398

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 900 parts In-Stock

1+ parts

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$43.878

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900

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$43.878

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Overview

Experience the next level of performance and reliability with the SPC560P40L3CEFAY by STMicroelectronics. As a leading manufacturer in the field of microcontrollers, STMicroelectronics ensures top-notch quality and innovation in every product. Ideal for automotive applications, this microcontroller offers unparalleled value with its advanced features and capabilities. From its high-speed clock frequency to its extensive connectivity options, the SPC560P40L3CEFAY delivers unmatched benefits and advantages to customers looking for cutting-edge solutions. Trust STMicroelectronics to provide the best-in-class performance you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging helps in reducing the weight of the microcontroller, making it suitable for portable and lightweight applications.

Maximum Supply Voltage: 3.6 V

The higher supply voltage allows for greater flexibility in powering the microcontroller, making it compatible with a wider range of power sources.

Bit Size: 32

32-bit architecture provides high processing capabilities, enabling the microcontroller to handle complex tasks efficiently and quickly.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program data, making it suitable for applications requiring extensive memory storage.

Maximum Clock Frequency: 40 MHz

High clock frequency enables the microcontroller to execute instructions at a faster rate, improving overall performance.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures the microcontroller can withstand harsh environmental conditions, making it ideal for automotive applications.

RAM Bytes: 20480

Generous RAM capacity allows for efficient data processing and manipulation, enhancing overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller enhances processing speed and efficiency, making it a suitable choice for real-time applications.

External Data Bus Width: 32

Wide external data bus width ensures fast data transfer between the microcontroller and external devices, improving system responsiveness.

Connectivity: CAN(3), CRC, LIN, UART

Multiple connectivity options such as CAN, LIN, and UART enable seamless communication with various devices and peripherals, making the microcontroller versatile.

Technical Specifications

Microcontrollers SPC560P40L3CEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z0H

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

16

No. of I/O Lines:

64

No. of Terminals:

100

No. of Timers:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

CAN(3), CRC, LIN, UART,

Peripherals:

DMA(16), PWM, TIMER(6)

Trade Compliance

SPC560P40L3CEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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