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SPC560P40L3CEAAR

STMicroelectronics

SPC560P40L3CEAAR by STMicroelectronics

STMicroelectronics SPC560P40L3CEAAR microcontroller features 32-bit CPU with 262144 ROM words, 20480 RAM bytes, and 64 I/O lines. Ideal for automotive applications, it offers CAN, LIN, UART connectivity and operates at up to 40 MHz clock frequency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,776 parts In-Stock

1+ parts

-

100+ parts

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3,776

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Anansix

USA . 2,395 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,395

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Vyrian

USA . 2,193 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,193

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,976 parts In-Stock

1+ parts

$4.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,976

$4.900

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-

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Microchip USA

USA . 3,803 parts In-Stock

1+ parts

$15.662

100+ parts

-

1k+ parts

-

10k+ parts

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3,803

$15.662

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AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$15.780

100+ parts

-

1k+ parts

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10k+ parts

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520

$15.780

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IDEA Electronic Components Group

UK . 1,128 parts In-Stock

1+ parts

$33.315

100+ parts

-

1k+ parts

$29.984

10k+ parts

-

1,128

$33.315

-

$29.984

-

MKK Technologies

India . 927 parts In-Stock

1+ parts

$62.647

100+ parts

-

1k+ parts

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10k+ parts

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927

$62.647

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DigiPath Technology Company

USA . 927 parts In-Stock

1+ parts

$62.647

100+ parts

-

1k+ parts

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10k+ parts

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927

$62.647

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Corphita

USA . 2,392 parts In-Stock

1+ parts

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2,392

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Parana Technologies

USA . 1,945 parts In-Stock

1+ parts

-

100+ parts

$39.833

1k+ parts

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10k+ parts

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1,945

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$39.833

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Overview

Elevate your designs with the high-quality SPC560P40L3CEAAR microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch products for various applications. With its advanced technology and innovative features, this microcontroller offers unmatched value and benefits to customers. Whether you're working on automotive systems, industrial automation, or consumer electronics, the SPC560P40L3CEAAR is the perfect choice for your project. Experience superior performance and reliability with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for the product, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Operating within a maximum supply voltage of 3.6V ensures safe and stable performance of the microcontroller.

Address Bus Width: 32

A wide address bus width of 32 allows for efficient memory addressing and access, enabling smooth operation of the device.

Package Shape: SQUARE

The square package shape offers compact and space-saving design, making it easier to integrate the microcontroller into various applications.

Bit Size: 32

With a bit size of 32, this microcontroller can process data and instructions in 32-bit chunks, improving overall performance and efficiency.

Power Supplies (V): 5

Having a power supply of 5V ensures sufficient power for the microcontroller to function effectively and reliably.

No. of Terminals: 100

The abundance of terminals (100) allows for versatile connectivity options and interfaces, enhancing the flexibility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style provides a compact and space-efficient form factor, suitable for applications where space is limited.

Minimum Supply Voltage: 3 V

Operating within a minimum supply voltage of 3V ensures that the microcontroller can still function effectively even under low power conditions.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this microcontroller can withstand high-temperature environments, making it suitable for demanding applications.

CPU Family: E200Z0H

Belonging to the E200Z0H CPU family indicates that this microcontroller offers a specific set of features and performance characteristics tailored to meet certain requirements.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C ensures that the microcontroller can operate reliably even in extremely cold conditions.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital data, enabling it to interface with various sensors and input devices.

DMA Channels: YES

Direct Memory Access (DMA) channels provide efficient data transfer mechanisms, reducing the workload on the CPU and improving overall system performance.

Terminal Position: QUAD

The quad terminal position offers a standard and easily recognizable terminal layout, simplifying the connection process during installation.

ROM Words: 262144

With a ROM capacity of 262144 words, this microcontroller can store a large amount of program instructions, enabling complex functionalities and applications.

Width: 14 mm

Measuring 14mm in width, this microcontroller is compact and can be easily integrated into space-constrained designs.

External Data Bus Width: 32

A wide external data bus width of 32 bits allows for fast and efficient data transfer between the microcontroller and external devices.

Peripherals: DMA(16), PWM, TIMER(6)

Having peripherals such as DMA, PWM, and timers enhances the capabilities of the microcontroller, enabling it to perform a wide range of functions and tasks.

Maximum Clock Frequency: 40 MHz

Operating at a maximum clock frequency of 40 MHz allows the microcontroller to execute instructions quickly and efficiently, enhancing overall performance.

Length: 14 mm

Measuring 14mm in length, this microcontroller maintains a compact form factor, making it suitable for applications where size is a critical factor.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets the stringent requirements and standards of the automotive industry, ensuring reliability and durability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and energy efficiency, making it suitable for applications that require fast processing and low power consumption.

No. of Timers: 6

Having 6 timers allows the microcontroller to manage and schedule various tasks and events, improving system efficiency and functionality.

RAM Bytes: 20480

With a RAM capacity of 20480 bytes, this microcontroller can store and access data quickly, facilitating efficient operation and execution of tasks.

Technology: CMOS

Utilizing CMOS technology, this microcontroller offers low power consumption and high noise immunity, ensuring reliable operation in various environments.

Terminal Form: GULL WING

The gull wing terminal form provides robust and secure connections, ensuring stable operation of the microcontroller in challenging conditions.

Maximum Supply Current: 65 mA

Operating within a maximum supply current of 65mA ensures that the microcontroller does not draw excessive power, helping to optimize energy efficiency.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures stable and consistent power supply to the microcontroller, enabling reliable performance.

No. of DMA Channels: 16

With 16 DMA channels, the microcontroller can efficiently manage data transfers, reducing CPU overhead and improving system efficiency.

PWM Channels: YES

PWM channels enable the microcontroller to generate precise and variable pulse-width modulation signals, making it suitable for applications that require accurate control of output signals.

Connectivity: CAN(3), CRC, LIN, UART

Supporting connectivity options such as CAN, CRC, LIN, and UART allows the microcontroller to communicate with a wide range of devices and systems, enhancing its versatility.

ROM Programmability: FLASH

Flash ROM programmability enables easy and convenient updating of firmware and software, ensuring that the microcontroller can adapt to changing requirements and functionalities.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller offers precise and compact terminal connections, facilitating installation and connection to external devices.

Speed: 64 rpm

Operating at a speed of 64rpm, this microcontroller can process instructions and data efficiently, enabling it to meet the performance demands of various applications.

No. of I/O Lines: 64

With 64 I/O lines, the microcontroller offers a sufficient number of input/output options, allowing for versatile connectivity and interaction with external devices.

Technical Specifications

Microcontrollers SPC560P40L3CEAAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z0H

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

16

No. of I/O Lines:

64

No. of Terminals:

100

No. of Timers:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

CAN(3), CRC, LIN, UART,

Peripherals:

DMA(16), PWM, TIMER(6)

Trade Compliance

SPC560P40L3CEAAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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