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SPC560P40L3BEFBY

STMicroelectronics

SPC560P40L3BEFBY by STMicroelectronics

STMicroelectronics SPC560P40L3BEFBY is a 32-bit microcontroller with 32-bit address and data bus width. It operates at up to 40 MHz, has 20480 bytes of RAM, and features DMA(16), PWM, TIMER(6) peripherals. Ideal for industrial applications requiring CAN, LIN, UART connectivity and operating in temperatures ranging from -40 °C to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,039 parts In-Stock

1+ parts

-

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7,039

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Digiode

USA . 2,793 parts In-Stock

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2,793

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Anansix

USA . 1,079 parts In-Stock

1+ parts

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1,079

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,797 parts In-Stock

1+ parts

$6.720

100+ parts

-

1k+ parts

-

10k+ parts

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2,797

$6.720

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AZTECH Wire

Italy . 619 parts In-Stock

1+ parts

$21.620

100+ parts

-

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-

619

$21.620

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IDEA Electronic Components Group

UK . 390 parts In-Stock

1+ parts

$72.467

100+ parts

-

1k+ parts

$65.220

10k+ parts

-

390

$72.467

-

$65.220

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Component Stockers USA

USA . 750 parts In-Stock

1+ parts

$99.990

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750

$99.990

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MKK Technologies

India . 605 parts In-Stock

1+ parts

$136.269

100+ parts

-

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605

$136.269

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DigiPath Technology Company

USA . 605 parts In-Stock

1+ parts

$136.269

100+ parts

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605

$136.269

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Vigor

Singapore . 6,000 parts In-Stock

1+ parts

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6,000

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Corphita

USA . 3,649 parts In-Stock

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3,649

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Parana Technologies

USA . 2,012 parts In-Stock

1+ parts

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$86.645

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2,012

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$86.645

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Overview

The SPC560P40L3BEFBY by STMicroelectronics is a high-quality microcontroller that offers top-notch performance and reliability. With a wide range of applications in various industries, this product stands out for its advanced features and efficient design. STMicroelectronics, known for its innovative solutions, delivers a cutting-edge microcontroller that provides value and benefits to customers looking for a reliable and versatile component for their projects. Whether you are working on automotive systems, industrial automation, or consumer electronics, the SPC560P40L3BEFBY is sure to meet your needs with its excellent performance and functionality. Trust STMicroelectronics for quality you can depend on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for long-term use and protection of internal components.

Surface Mount: YES

Ease of installation and integration into electronic systems.

Maximum Supply Voltage: 3.6 V

Support for high voltage applications.

Address Bus Width: 32

Efficient memory addressing capabilities for complex operations.

Bit Size: 32

High-bit processing for fast and accurate data handling.

Power Supplies (V): 3.3

Suitable voltage level for reliable performance.

No. of Terminals: 100

Sufficient connectivity options for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Space-saving design for compact electronic devices.

Minimum Supply Voltage: 3 V

Flexible voltage range for diverse power sources.

Maximum Operating Temperature: 105 °C

High operating temperature range for use in industrial environments.

CPU Family: E200Z0H

Efficient and reliable processing capabilities.

ADC Channels: YES

Analog-to-digital conversion for sensor integration.

DMA Channels: YES

Direct memory access for efficient data transfer.

ROM Words: 262144

Large memory capacity for program storage.

External Data Bus Width: 32

High-speed data transfer between components.

Maximum Clock Frequency: 40 MHz

Fast processing speed for real-time applications.

Temperature Grade: INDUSTRIAL

Built to withstand harsh environmental conditions.

No. of Timers: 6

Versatile timer functions for precise timing control.

RAM Bytes: 20480

Sufficient memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Secure terminal connection for reliable performance.

Maximum Supply Current: 65 mA

Efficient power usage for energy savings.

No. of DMA Channels: 16

Multiple DMA channels for simultaneous data handling.

PWM Channels: YES

Pulse-width modulation for precise control of motors and actuators.

Connectivity: CAN(3), CRC, LIN, UART

Various communication options for system integration.

ROM Programmability: FLASH

Flexible ROM programming for quick updates and modifications.

Terminal Pitch: 0.5 mm

Fine pitch for compact and efficient board layout.

Speed: 64 rpm

Fast processing speed for quick response times.

No. of I/O Lines: 64

Sufficient input/output options for device connectivity.

Technical Specifications

Microcontrollers SPC560P40L3BEFBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z0H

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

16

No. of I/O Lines:

64

No. of Terminals:

100

No. of Timers:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

CAN(3), CRC, LIN, UART,

Peripherals:

DMA(16), PWM, TIMER(6)

Trade Compliance

SPC560P40L3BEFBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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