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SPC560P40L3BEFBR

STMicroelectronics

SPC560P40L3BEFBR by STMicroelectronics

STMicroelectronics SPC560P40L3BEFBR is a 32-bit microcontroller with 262144 ROM words, 20480 RAM bytes, and 64 I/O lines. It operates at up to 40 MHz, has CAN(3), LIN, UART connectivity, and is suitable for industrial applications requiring high-speed processing and multiple peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,022 parts In-Stock

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8,022

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Digiode

USA . 1,154 parts In-Stock

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1,154

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Anansix

USA . 336 parts In-Stock

1+ parts

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336

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,962 parts In-Stock

1+ parts

$15.105

100+ parts

-

1k+ parts

$13.594

10k+ parts

-

1,962

$15.105

-

$13.594

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AZTECH Wire

Italy . 608 parts In-Stock

1+ parts

$18.580

100+ parts

-

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608

$18.580

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MKK Technologies

India . 682 parts In-Stock

1+ parts

$28.403

100+ parts

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682

$28.403

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DigiPath Technology Company

USA . 682 parts In-Stock

1+ parts

$28.403

100+ parts

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682

$28.403

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Microchip USA

USA . 12,048 parts In-Stock

1+ parts

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12,048

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QUARKTWIN TECHNOLOGY LTD

USA . 6,894 parts In-Stock

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6,894

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Vigor

Singapore . 2,960 parts In-Stock

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2,960

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Parana Technologies

USA . 1,065 parts In-Stock

1+ parts

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$18.060

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1,065

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$18.060

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Corphita

USA . 957 parts In-Stock

1+ parts

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957

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Overview

Unlock limitless possibilities with the SPC560P40L3BEFBR microcontroller by STMicroelectronics. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. Whether you're designing automotive systems, industrial machinery, or consumer electronics, this microcontroller delivers exceptional value, efficiency, and innovation. Elevate your projects with the SPC560P40L3BEFBR and experience the seamless integration, advanced features, and top-notch quality that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and light weight, making the product easy to handle and suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly, saving space and simplifying production processes.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is versatile and can be used in a wide range of electronic systems.

Address Bus Width: 32

A wide address bus width of 32 bits allows for efficient memory addressing and data processing capabilities.

Package Shape: SQUARE

The square package shape offers uniformity in design and facilitates consistent mounting in electronic PCBs.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and process large amounts of data efficiently.

Power Supplies (V): 3.3

Operates on a stable power supply of 3.3V ensuring reliable performance and compatibility with standard power sources.

No. of Terminals: 100

Having 100 terminals provides versatility in connectivity options and allows for integration with various peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style offers space-saving benefits and ease of integration into compact electronic designs.

Minimum Supply Voltage: 3 V

Can operate at a minimum supply voltage of 3V, making it suitable for low-power applications and energy-efficient designs.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, this microcontroller can withstand harsh environmental conditions and high temperature environments.

CPU Family: E200Z0H

Belonging to the E200Z0H CPU family ensures compatibility with existing software and tools, streamlining development processes.

Minimum Operating Temperature: -40 °C

Capable of operating at temperatures as low as -40 °C, making it suitable for use in extreme cold environments or industrial settings.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing and conversion, increasing the microcontroller's functionality in sensor-based applications.

DMA Channels: YES

Integration of DMA channels enables efficient data transfer operations, reducing CPU load and improving system performance.

Terminal Position: QUAD

Quad terminal position offers better mechanical stability and improved signal integrity during operation, enhancing overall reliability.

ROM Words: 262144

Large ROM capacity of 262144 words provides ample space for storing program instructions and data, accommodating complex applications.

Width: 14 mm

Compact width of 14mm allows for easy integration into space-constrained designs without compromising on performance.

External Data Bus Width: 32

Wide external data bus width of 32 bits facilitates high-speed data transfer between the microcontroller and external devices.

Peripherals: DMA(16), PWM, TIMER(6)

Various peripherals such as DMA, PWM, and timers enhance the microcontroller's capabilities, enabling versatile functionality for diverse applications.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40 MHz allows for rapid processing speeds and efficient execution of operations in real-time applications.

Length: 14 mm

Compact length of 14mm contributes to the overall small form factor of the microcontroller, making it suitable for compact electronic designs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliable operation in harsh environments and demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture, it offers reduced instruction set computing for efficient performance and lower power consumption.

No. of Timers: 6

Having 6 timers allows for precise timing control and scheduling of tasks, enhancing the microcontroller's versatility in time-critical applications.

RAM Bytes: 20480

Generous RAM capacity of 20480 bytes provides ample space for temporary data storage and processing, improving overall system performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and reliable performance, making it suitable for various battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and reliable electrical connections, ensuring robust PCB assembly and stable operation.

Maximum Supply Current: 65 mA

With a maximum supply current of 65 mA, the microcontroller operates efficiently within specified power limits, reducing energy consumption.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures stable and consistent power delivery, essential for reliable operation and system performance.

No. of DMA Channels: 16

Having 16 DMA channels allows for parallel data transfers and efficient handling of multiple data streams, optimizing system throughput.

PWM Channels: YES

Availability of PWM channels enables precise control of pulse-width modulation signals, essential for various control and automation applications.

Connectivity: CAN(3), CRC, LIN, UART

Multiple connectivity options such as CAN, CRC, LIN, and UART facilitate communication with external devices and network integration, enhancing versatility.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for updating firmware and applications, enabling quick and easy device customization and maintenance.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for compact PCB layout and high-density mounting, optimizing space utilization in electronic designs.

Speed: 64 rpm

Operates at a speed of 64 rpm, suitable for real-time control applications and motor speed regulation, ensuring precise and reliable operation.

No. of I/O Lines: 64

Having 64 I/O lines provides sufficient input/output capabilities for interfacing with external devices and peripherals, enhancing system connectivity.

Technical Specifications

Microcontrollers SPC560P40L3BEFBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z0H

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

16

No. of I/O Lines:

64

No. of Terminals:

100

No. of Timers:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

CAN(3), CRC, LIN, UART,

Peripherals:

DMA(16), PWM, TIMER(6)

Trade Compliance

SPC560P40L3BEFBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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