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SPC560P40L3BEABY

STMicroelectronics

SPC560P40L3BEABY by STMicroelectronics

SPC560P40L3BEABY by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words and 20480 RAM bytes. It operates at a max clock frequency of 40 MHz, suitable for industrial applications requiring CAN, LIN, UART connectivity. The package style is flatpack with low profile and fine pitch, making it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,600 parts In-Stock

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7,600

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Digiode

USA . 4,075 parts In-Stock

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4,075

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Anansix

USA . 114 parts In-Stock

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114

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 976 parts In-Stock

1+ parts

$9.490

100+ parts

-

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976

$9.490

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Microchip USA

USA . 1,584 parts In-Stock

1+ parts

$10.438

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1,584

$10.438

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IDEA Electronic Components Group

UK . 2,075 parts In-Stock

1+ parts

$46.326

100+ parts

-

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$41.693

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2,075

$46.326

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$41.693

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MKK Technologies

India . 192 parts In-Stock

1+ parts

$87.112

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192

$87.112

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DigiPath Technology Company

USA . 192 parts In-Stock

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$87.112

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192

$87.112

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QUARKTWIN TECHNOLOGY LTD

USA . 7,364 parts In-Stock

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7,364

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Vigor

Singapore . 6,400 parts In-Stock

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6,400

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A-Z Elektronik GmbH

Germany . 5,451 parts In-Stock

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5,451

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Corphita

USA . 2,686 parts In-Stock

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2,686

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Parana Technologies

USA . 1,961 parts In-Stock

1+ parts

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100+ parts

$55.389

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1,961

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$55.389

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Kepictronics

USA . 108 parts In-Stock

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108

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Overview

Unlock the power of innovation with the SPC560P40L3BEABY microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics brings you a high-quality product with a wide range of applications, from automotive to industrial control systems. With its advanced technology and reliable performance, this microcontroller offers unparalleled value and benefits to customers, providing seamless connectivity, efficient data processing, and superior functionality. Trust STMicroelectronics to deliver cutting-edge solutions for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and lightweight, ideal for portable applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power supply options and compatibility with a variety of systems.

Address Bus Width: 32

32-bit address bus width allows for efficient memory addressing and data handling in complex applications.

Package Shape: SQUARE

Square package shape enables easy placement on circuit boards and efficient use of space in compact designs.

Bit Size: 32

32-bit architecture offers high processing power and precision in data manipulation tasks.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable operation and compatibility with standard voltage levels in electronic systems.

No. of Terminals: 100

Ample terminals provide connectivity options for peripherals and interfaces, making the microcontroller versatile in different applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile design with fine pitch terminals allows for compact and high-density PCB layouts, saving space and enhancing design flexibility.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105 °C enables reliable performance in harsh industrial environments with elevated temperatures.

CPU Family: E200Z0H

Belonging to the E200Z0H CPU family ensures compatibility with existing software and development tools, streamlining the integration process.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C allows for reliable operation in cold environments or conditions.

ADC Channels: YES

Integrated ADC channels enable analog signal processing and conversion within the microcontroller, expanding its sensor interface capabilities.

DMA Channels: YES

DMA channels enhance data transfer efficiency and reduce CPU workload, improving overall system performance.

Terminal Position: QUAD

Quad terminal position offers a reliable and secure connection to the PCB, ensuring stable operation even under vibration or shock.

ROM Words: 262144

Large ROM capacity of 262144 words allows for extensive program storage and firmware customization in sophisticated applications.

Width: 14 mm

Compact width of 14mm facilitates space-saving PCB designs and allows for integration in small form factor devices.

External Data Bus Width: 32

32-bit external data bus width enables high-speed data transfer and efficient communication with external peripherals.

Peripherals: DMA(16), PWM, TIMER(6)

Support for DMA, PWM, and timers enhances the microcontroller's capabilities in managing data, generating precise output signals, and executing timed operations.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40 MHz provides fast processing speed and responsiveness in real-time applications.

Length: 14 mm

Short length of 14mm complements the compact design of the microcontroller, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding environments with wide temperature variations, such as factory floors or outdoor installations.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient instruction execution, low power consumption, and high-performance computing capabilities.

No. of Timers: 6

Six timers provide precise timing functions and event scheduling, essential for controlling actions and coordinating processes in complex applications.

RAM Bytes: 20480

Generous RAM capacity of 20480 bytes supports efficient data storage and processing, enabling multitasking and data-intensive operations.

Technology: CMOS

CMOS technology ensures low power consumption, high noise immunity, and reliable operation in various digital systems.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and robust mechanical stability, suitable for reliable PCB assembly and soldering processes.

Maximum Supply Current: 65 mA

Low maximum supply current of 65 mA results in efficient power usage and compatibility with battery-powered devices or energy-efficient applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance and compatibility with standard voltage levels in electronic systems.

No. of DMA Channels: 16

Sixteen DMA channels allow for efficient data transfer and processing between peripherals and memory, reducing CPU overhead and improving system efficiency.

PWM Channels: YES

Support for PWM channels enables precise control of output signals, such as motor speed modulation or LED brightness adjustment, in applications requiring accurate analog voltage levels.

Connectivity: CAN(3), CRC, LIN, UART

Various connectivity options including CAN, CRC, LIN, and UART enable seamless communication with external devices, network interfaces, and sensors, expanding the microcontroller's integration capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates, customization, and reprogramming of the microcontroller, enhancing its versatility and adaptability to evolving application requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm facilitates precise soldering and reliable connectivity on densely populated PCBs, ensuring secure electrical connections and signal integrity.

Speed: 64 rpm

Operating speed of 64 rpm enables fast data processing, efficient task execution, and real-time responsiveness in time-critical applications.

No. of I/O Lines: 64

Sixty-four I/O lines offer versatile input and output options for connecting external devices, sensors, and actuators, enhancing the microcontroller's interfacing capabilities in diverse applications.

Technical Specifications

Microcontrollers SPC560P40L3BEABY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z0H

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

16

No. of I/O Lines:

64

No. of Terminals:

100

No. of Timers:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

CAN(3), CRC, LIN, UART,

Peripherals:

DMA(16), PWM, TIMER(6)

Trade Compliance

SPC560P40L3BEABY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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