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SPC560P40L1CEFAY

STMicroelectronics

SPC560P40L1CEFAY by STMicroelectronics

STMicroelectronics' SPC560P40L1CEFAY microcontroller features 32-bit CPU, 262144 ROM words, and 20480 RAM bytes. Ideal for automotive applications with CAN, LIN, UART connectivity and operating temperature range of -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,193 parts In-Stock

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Digiode

USA . 2,785 parts In-Stock

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2,785

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Anansix

USA . 2,034 parts In-Stock

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2,034

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ComSIT Distribution GmbH

Germany . 1,110 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 1,916 parts In-Stock

1+ parts

$6.523

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1,916

$6.523

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AZTECH Wire

Italy . 1,103 parts In-Stock

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$8.570

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$8.570

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IDEA Electronic Components Group

UK . 2,350 parts In-Stock

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$64.629

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$58.166

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2,350

$64.629

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$58.166

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MKK Technologies

India . 609 parts In-Stock

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$121.531

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609

$121.531

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DigiPath Technology Company

USA . 609 parts In-Stock

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$121.531

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QUARKTWIN TECHNOLOGY LTD

USA . 23,847 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Vigor

Singapore . 6,000 parts In-Stock

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Corphita

USA . 4,961 parts In-Stock

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Parana Technologies

USA . 1,479 parts In-Stock

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$77.274

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Perfect Parts

USA . 1,075 parts In-Stock

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Overview

Elevate your projects with the SPC560P40L1CEFAY microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers top-quality products that guarantee reliability and performance. Ideal for automotive applications, this microcontroller offers a wide range of features including DMA channels, PWM channels, and multiple connectivity options like CAN and UART. With its advanced technology and robust design, the SPC560P40L1CEFAY provides unparalleled value and efficiency for your electronic designs. Experience innovation at its finest with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Provides a safe operating range for the microcontroller, preventing damage from overvoltage.

Address Bus Width: 32

Allows for efficient memory addressing and data transfer within the microcontroller.

Package Shape: SQUARE

Facilitates compact and space-saving circuit board designs.

Bit Size: 32

Enables the microcontroller to process data in 32-bit chunks, enhancing efficiency and performance.

Power Supplies (V): 5

Provides sufficient power to support the operations of the microcontroller and its peripherals.

No. of Terminals: 64

Offers ample connectivity options for external devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a low-profile design while providing fine pitch for space-efficient mounting.

Minimum Supply Voltage: 3 V

Ensures reliable operation even at lower voltage levels.

Maximum Operating Temperature: 125 °C

Suitable for automotive applications where high temperature resistance is required.

CPU Family: E200Z0H

Belongs to a powerful CPU family known for its performance and reliability.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, making it suitable for diverse operating environments.

ADC Channels: YES

Allows for analog-to-digital conversion, essential for interfacing with sensors and external analog signals.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

Provides a convenient layout for connecting external devices and components.

ROM Words: 262144

Offers ample non-volatile memory for program storage, ensuring the microcontroller can run complex programs.

Width: 10 mm

Compact size enables integration into space-constrained designs.

External Data Bus Width: 32

Efficient data transfer between the microcontroller and external devices with a 32-bit data bus.

Peripherals: DMA(16), PWM, TIMER(6)

Includes essential peripherals for data transfer, signal modulation, and precise timing functions.

Maximum Clock Frequency: 40 MHz

High clock frequency for fast processing and response times in real-time applications.

Length: 10 mm

Compact dimensions for space-efficient board layout and system integration.

Temperature Grade: AUTOMOTIVE

Designed to operate reliably in automotive environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Based on RISC architecture for efficient and optimized performance in embedded applications.

No. of Timers: 6

Offers multiple timer channels for scheduling tasks, generating interrupts, and precise timing control.

RAM Bytes: 20480

Provides sufficient random-access memory for data storage and program execution.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Facilitates easy soldering and ensures reliable connections in the PCB assembly process.

Maximum Supply Current: 65 mA

Efficient power consumption with low current draw for extended battery life in portable applications.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance and reliability of the microcontroller.

No. of DMA Channels: 16

Multiple DMA channels for parallel data transfer and efficient peripheral communication.

PWM Channels: YES

Supports pulse-width modulation for precise control of motor speed, LED brightness, and other applications.

Connectivity: CAN(3), CRC, LIN, UART

Supports various communication protocols for interfacing with other devices and systems.

ROM Programmability: FLASH

Flash memory allows for easy reprogrammability of the ROM for firmware updates and enhancements.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and space-saving PCB designs.

Speed: 64 rpm

Capable of controlling devices or processes with a speed of up to 64 revolutions per minute.

No. of I/O Lines: 37

Sufficient I/O lines for interfacing with external devices and peripherals, making the microcontroller versatile.

Technical Specifications

Microcontrollers SPC560P40L1CEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z0H

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of DMA Channels:

16

No. of I/O Lines:

37

No. of Terminals:

64

No. of Timers:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN(3), CRC, LIN, UART,

Peripherals:

DMA(16), PWM, TIMER(6)

Trade Compliance

SPC560P40L1CEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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