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SPC560P40L1BEFBR

STMicroelectronics

SPC560P40L1BEFBR by STMicroelectronics

STMicroelectronics SPC560P40L1BEFBR microcontroller features 32-bit CPU, 3.3V power supply, and 262144 ROM words. Ideal for industrial applications requiring CAN, LIN, UART connectivity and operating temperature range of -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,130 parts In-Stock

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Anansix

USA . 2,015 parts In-Stock

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Digiode

USA . 613 parts In-Stock

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613

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Distributors (Availability)

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AZTECH Wire

Italy . 899 parts In-Stock

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$8.460

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899

$8.460

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IDEA Electronic Components Group

UK . 1,904 parts In-Stock

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$66.045

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-

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$59.440

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1,904

$66.045

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$59.440

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MKK Technologies

India . 402 parts In-Stock

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$124.193

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402

$124.193

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DigiPath Technology Company

USA . 402 parts In-Stock

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$124.193

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402

$124.193

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A-Z Elektronik GmbH

Germany . 6,242 parts In-Stock

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Vigor

Singapore . 5,000 parts In-Stock

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Microchip USA

USA . 4,662 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,436 parts In-Stock

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Parana Technologies

USA . 1,936 parts In-Stock

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$78.967

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Corphita

USA . 1,711 parts In-Stock

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Perfect Parts

USA . 1,204 parts In-Stock

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Metaverse IC Inc.

Canada . 1,095 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Overview

Experience the next level of performance and efficiency with the SPC560P40L1BEFBR microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality products for a wide range of applications. This microcontroller offers unparalleled value with its advanced features and capabilities, providing customers with reliable performance and innovative solutions. Whether you are working on automotive, industrial, or consumer electronics projects, this microcontroller is designed to meet your needs and exceed your expectations. Upgrade your designs today with the SPC560P40L1BEFBR and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a long lifespan.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Suitable for a wide range of applications while still providing a safe operating range for the microcontroller.

Address Bus Width: 32

Enables the microcontroller to access a large memory space, allowing for more complex operations and calculations.

Bit Size: 32

Provides high processing power and efficiency, making it suitable for demanding tasks and applications.

Power Supplies (V): 3.3

Operates on a common and widely available voltage, making it compatible with various power sources and systems.

No. of Terminals: 64

Offers a sufficient number of connections for interfacing with external devices and peripherals.

Maximum Clock Frequency: 40 MHz

Provides high-speed operation, allowing for quick data processing and response times in real-time applications.

RAM Bytes: 20480

Offers ample memory for data storage and manipulation, supporting multitasking and complex algorithms.

Technology: CMOS

Utilizes low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Technical Specifications

Microcontrollers SPC560P40L1BEFBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z0H

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of DMA Channels:

16

No. of I/O Lines:

37

No. of Terminals:

64

No. of Timers:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN(3), CRC, LIN, UART,

Peripherals:

DMA(16), PWM, TIMER(6)

Trade Compliance

SPC560P40L1BEFBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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