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SPC560P34L1CEFBR

STMicroelectronics

SPC560P34L1CEFBR by STMicroelectronics

STMicroelectronics SPC560P34L1CEFBR is a 32-bit microcontroller with 3.3V power supply, operating at up to 40MHz. Ideal for automotive applications, it features 16 DMA channels, 6 timers, and CAN connectivity. With a temperature range of -40 to 125 °C, this RISC-based MCU offers 196608 ROM words and 12288 RAM bytes for efficient processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,947 parts In-Stock

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5,947

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Digiode

USA . 1,912 parts In-Stock

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1,912

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Anansix

USA . 1,223 parts In-Stock

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1,223

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 416 parts In-Stock

1+ parts

$5.720

100+ parts

-

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416

$5.720

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AZTECH Wire

Italy . 229 parts In-Stock

1+ parts

$21.510

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229

$21.510

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IDEA Electronic Components Group

UK . 1,218 parts In-Stock

1+ parts

$49.008

100+ parts

-

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$44.108

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1,218

$49.008

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$44.108

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MKK Technologies

India . 1,253 parts In-Stock

1+ parts

$92.157

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1,253

$92.157

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DigiPath Technology Company

USA . 1,253 parts In-Stock

1+ parts

$92.157

100+ parts

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1,253

$92.157

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Vigor

Singapore . 4,752 parts In-Stock

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4,752

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Parana Technologies

USA . 1,956 parts In-Stock

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$58.597

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1,956

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$58.597

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Corphita

USA . 1,118 parts In-Stock

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1,118

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Overview

Elevate your projects with the SPC560P34L1CEFBR microcontroller by STMicroelectronics. This high-quality product is designed to offer reliable performance and versatility for a wide range of applications. With advanced features like multiple ADC and DMA channels, this microcontroller provides unparalleled value and efficiency. Whether you're working on automotive, industrial, or consumer electronics projects, this microcontroller's impressive capabilities will help you bring your ideas to life. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the microcontroller suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows the microcontroller to handle a wide range of input voltages, increasing its versatility.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex calculations and tasks efficiently.

CPU Family: E200Z0H

The E200Z0H CPU family is known for its performance and reliability, making it a suitable choice for demanding applications.

ROM Words: 196608

The large ROM capacity allows for storing a significant amount of program data, enabling the microcontroller to run complex applications.

RAM Bytes: 12288

With a decent amount of RAM, the microcontroller can efficiently store and retrieve data during operation.

Maximum Clock Frequency: 40 MHz

The high clock frequency allows for fast processing speeds, making the microcontroller suitable for real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Connectivity: CAN(3), CRC, LIN, UART

The multiple connectivity options make it easy to interface the microcontroller with other devices and systems, increasing its versatility.

Technical Specifications

Microcontrollers SPC560P34L1CEFBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z0H

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of DMA Channels:

16

No. of I/O Lines:

37

No. of Terminals:

64

No. of Timers:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

196608

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN(3), CRC, LIN, UART,

Peripherals:

DMA(16), PWM, TIMER(6)

Trade Compliance

SPC560P34L1CEFBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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