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SPC560C50L3B4E0X

STMicroelectronics

SPC560C50L3B4E0X by STMicroelectronics

STMicroelectronics SPC560C50L3B4E0X is a 32-bit microcontroller with 100 terminals, operating at a max clock frequency of 16 MHz. Featuring ADC and DMA channels, it has 79 I/O lines and PWM support. Ideal for applications requiring high-speed processing and precise control in automotive electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,157

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-

-

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Anansix

USA . 2,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,775

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-

-

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Digiode

USA . 1,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,239

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,956 parts In-Stock

1+ parts

$5.710

100+ parts

-

1k+ parts

-

10k+ parts

-

3,956

$5.710

-

-

-

Microchip USA

USA . 2,609 parts In-Stock

1+ parts

$18.203

100+ parts

-

1k+ parts

-

10k+ parts

-

2,609

$18.203

-

-

-

AZTECH Wire

Italy . 456 parts In-Stock

1+ parts

$21.610

100+ parts

-

1k+ parts

-

10k+ parts

-

456

$21.610

-

-

-

IDEA Electronic Components Group

UK . 382 parts In-Stock

1+ parts

$23.935

100+ parts

-

1k+ parts

$21.541

10k+ parts

-

382

$23.935

-

$21.541

-

MKK Technologies

India . 1,828 parts In-Stock

1+ parts

$45.008

100+ parts

-

1k+ parts

-

10k+ parts

-

1,828

$45.008

-

-

-

DigiPath Technology Company

USA . 1,828 parts In-Stock

1+ parts

$45.008

100+ parts

-

1k+ parts

-

10k+ parts

-

1,828

$45.008

-

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Component Connect

USA . 337,265 parts In-Stock

1+ parts

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337,265

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Perfect Parts

USA . 38,080 parts In-Stock

1+ parts

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38,080

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Kepictronics

USA . 22,000 parts In-Stock

1+ parts

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22,000

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RC Electronics

USA . 7,238 parts In-Stock

1+ parts

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100+ parts

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7,238

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Corphita

USA . 4,437 parts In-Stock

1+ parts

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4,437

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Parana Technologies

USA . 1,056 parts In-Stock

1+ parts

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100+ parts

$28.618

1k+ parts

-

10k+ parts

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1,056

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$28.618

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Overview

Elevate your projects to the next level with the SPC560C50L3B4E0X microcontroller by STMicroelectronics. Boasting top-notch quality and reliability from a trusted manufacturer, this versatile device is perfect for a wide range of applications. With its advanced features and high performance, this microcontroller offers unparalleled value, ensuring smooth operation and seamless integration. Experience the benefits of cutting-edge technology and unleash the full potential of your designs with the SPC560C50L3B4E0X.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, making the product suitable for applications where space is limited.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage provides flexibility and compatibility with various power sources, ensuring stable operation.

Package Shape: SQUARE

Square package shape allows for easy handling and placement on the PCB, aiding in assembly and manufacturing processes.

Bit Size: 32

The 32-bit architecture enables high-performance computing and processing capabilities, making the product suitable for complex applications.

No. of Terminals: 100

Having a high number of terminals allows for connectivity to multiple external devices and peripherals, enhancing the product's functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers improved thermal conductivity and signal integrity, making the product reliable and efficient.

Minimum Supply Voltage: 4.5 V

The lower minimum supply voltage ensures compatibility with a wide range of power sources, allowing for energy-efficient operation.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability of the product.

ADC Channels: YES

Having ADC channels allows the product to interface with analog sensors and signals, making it suitable for applications that require analog-to-digital conversion.

DMA Channels: YES

DMA channels enable efficient data transfer between memory and peripherals, enhancing the product's overall performance and speed.

Terminal Position: QUAD

Quad terminal position offers secure and reliable connections, reducing the risk of signal interference and improving the product's robustness.

Width: 14 mm

The compact width of 14 mm allows for space-saving integration in small form factor devices, making the product ideal for portable and lightweight applications.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz enables fast processing speed and real-time operation, making the product suitable for time-sensitive applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures reliable solder joints during assembly and rework processes, enhancing the product's durability.

Length: 14 mm

The compact length of 14 mm allows for space-efficient placement on the PCB, contributing to a streamlined and optimized device design.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller allows the product to integrate CPU, memory, and peripherals on a single chip, simplifying system design and reducing component count.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability, ensuring secure connections and robust performance of the product.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a standard and widely compatible voltage level, ensuring interoperability with various components and systems.

PWM Channels: YES

Having PWM channels allows for precise control of analog signals and modulation, making the product suitable for applications that require accurate voltage and frequency control.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density PCB layout, facilitating compact and miniaturized device design with optimized interconnectivity.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage practices to maintain the product's reliability and performance.

Speed: 48 rpm

The high speed of 48 rpm allows for fast data processing and communication, enabling quick response times and efficient operation of the product.

No. of I/O Lines: 79

Having a high number of I/O lines allows for versatile connectivity and interface options, making the product suitable for diverse input/output configurations and applications.

Technical Specifications

Microcontrollers SPC560C50L3B4E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

79

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

48 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC560C50L3B4E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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