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SPC560B64L5C6E0X

STMicroelectronics

SPC560B64L5C6E0X by STMicroelectronics

SPC560B64L5C6E0X by STMicroelectronics is a 32-bit microcontroller with 144 terminals, 64K data EEPROM, and 16 MHz clock frequency. Ideal for automotive applications, it features 34-Ch ADC, 24-Ch PWM, CAN(6), I2C, LIN(8), SPI(5) connectivity options. Operating temperature ranges from -40 to 125 °C.

Median Price

$9.685

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$9.685

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$9.685

-

-

-

Digiode

USA . 4,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,875

-

-

-

-

Chip Stock

USA . 3,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,870

-

-

-

-

Vyrian

USA . 3,270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,270

-

-

-

-

Anansix

USA . 447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

447

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,974 parts In-Stock

1+ parts

$8.500

100+ parts

-

1k+ parts

-

10k+ parts

-

5,974

$8.500

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$9.491

100+ parts

-

1k+ parts

$9.111

10k+ parts

-

100

$9.491

-

$9.111

-

Continental Prestige Electronics

USA . 1,912 parts In-Stock

1+ parts

$9.685

100+ parts

-

1k+ parts

-

10k+ parts

$9.491

1,912

$9.685

-

-

$9.491

Corohmni

South Africa . 47 parts In-Stock

1+ parts

$10.080

100+ parts

-

1k+ parts

-

10k+ parts

-

47

$10.080

-

-

-

IDEA Electronic Components Group

UK . 1,836 parts In-Stock

1+ parts

$14.675

100+ parts

-

1k+ parts

$13.207

10k+ parts

-

1,836

$14.675

-

$13.207

-

AZTECH Wire

Italy . 275 parts In-Stock

1+ parts

$16.283

100+ parts

-

1k+ parts

-

10k+ parts

-

275

$16.283

-

-

-

Ampacity Inc.

Singapore . 293 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

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293

$20.000

-

-

-

Microchip USA

USA . 3,168 parts In-Stock

1+ parts

$27.118

100+ parts

-

1k+ parts

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10k+ parts

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3,168

$27.118

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-

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MKK Technologies

India . 1,817 parts In-Stock

1+ parts

$27.595

100+ parts

-

1k+ parts

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10k+ parts

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1,817

$27.595

-

-

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DigiPath Technology Company

USA . 1,817 parts In-Stock

1+ parts

$27.595

100+ parts

-

1k+ parts

-

10k+ parts

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1,817

$27.595

-

-

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Semicontronic

India . 1,587 parts In-Stock

1+ parts

$31.000

100+ parts

$30.225

1k+ parts

$30.070

10k+ parts

-

1,587

$31.000

$30.225

$30.070

-

Aztec Data Supply Inc.

USA . 252 parts In-Stock

1+ parts

$82.810

100+ parts

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252

$82.810

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-

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Lixinc

USA . 3,515 parts In-Stock

1+ parts

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3,515

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Argo Parts USA

USA . 2,556 parts In-Stock

1+ parts

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2,556

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-

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Corphita

USA . 1,802 parts In-Stock

1+ parts

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1,802

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-

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Kepictronics

USA . 533 parts In-Stock

1+ parts

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533

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Perfect Parts

USA . 448 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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448

-

-

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Parana Technologies

USA . 29 parts In-Stock

1+ parts

-

100+ parts

$17.546

1k+ parts

-

10k+ parts

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29

-

$17.546

-

-

Overview

Discover the cutting-edge SPC560B64L5C6E0X microcontroller by STMicroelectronics, a leading manufacturer known for top-quality components. Designed for automotive applications, this powerful 32-bit device offers an array of advanced features like ADC channels, DMA capabilities, and extensive peripheral options. With a compact package style and wide temperature range, it's the ideal solution for demanding projects. Trust in STMicroelectronics to provide reliability, efficiency, and innovation with the SPC560B64L5C6E0X microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller offers compatibility with a wide range of power sources, enhancing its versatility.

Package Shape: SQUARE

The square package shape ensures efficient use of space on the circuit board, making it suitable for compact designs.

Bit Size: 32

The 32-bit architecture of this microcontroller provides high processing power and performance for complex applications.

No. of Terminals: 144

With a high number of terminals, this microcontroller allows for seamless connectivity to various external components, enhancing its functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style simplifies integration into tight spaces, making it suitable for space-constrained designs.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures efficient power consumption, making it an energy-efficient choice for electronic devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this microcontroller can withstand harsh environmental conditions, ensuring reliable performance in extreme settings.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C to 125°C makes this microcontroller suitable for use in both hot and cold environments.

Technical Specifications

Microcontrollers SPC560B64L5C6E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

121

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

98304

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6), I2C, IRDA, LIN(8), SCI(8), SPI(5)

Peripherals:

DMA(16), POR, PWM(64), RTC, TIMER(64), WDT

Analog To Digital Convertors:

34-Ch 10-Bit, 24-Ch 12-Bit

Trade Compliance

SPC560B64L5C6E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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