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SPC560B64L3B6E0X

STMicroelectronics

SPC560B64L3B6E0X by STMicroelectronics

SPC560B64L3B6E0X by STMicroelectronics is a 32-bit microcontroller with 100 terminals, 64K data EEPROM, and 26-Ch 10-Bit ADC. It operates at up to 16 MHz clock frequency and has various peripherals like DMA(16) and PWM(37). Ideal for industrial applications requiring high-speed processing and multiple connectivity options such as CAN, I2C, LIN, SCI, IRDA, and SPI.

Median Price

$12.410

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 307 parts In-Stock

1+ parts

$12.410

100+ parts

$8.350

1k+ parts

$6.320

10k+ parts

-

307

$12.410

$8.350

$6.320

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$7.994

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$7.994

-

-

-

Digiode

USA . 4,772 parts In-Stock

1+ parts

$10.592

100+ parts

-

1k+ parts

-

10k+ parts

-

4,772

$10.592

-

-

-

Vyrian

USA . 8,643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,643

-

-

-

-

Anansix

USA . 2,141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,141

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,245 parts In-Stock

1+ parts

$6.770

100+ parts

-

1k+ parts

-

10k+ parts

-

1,245

$6.770

-

-

-

Continental Prestige Electronics

USA . 4,874 parts In-Stock

1+ parts

$7.994

100+ parts

-

1k+ parts

-

10k+ parts

$7.834

4,874

$7.994

-

-

$7.834

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.994

100+ parts

-

1k+ parts

$7.595

10k+ parts

$7.435

1,000

$7.994

-

$7.595

$7.435

Ampacity Inc.

Singapore . 123 parts In-Stock

1+ parts

$9.480

100+ parts

-

1k+ parts

-

10k+ parts

-

123

$9.480

-

-

-

Semicontronic

India . 62 parts In-Stock

1+ parts

$9.480

100+ parts

$9.243

1k+ parts

$9.196

10k+ parts

-

62

$9.480

$9.243

$9.196

-

Corphita

USA . 2,628 parts In-Stock

1+ parts

$10.035

100+ parts

-

1k+ parts

-

10k+ parts

-

2,628

$10.035

-

-

-

AZTECH Wire

Italy . 309 parts In-Stock

1+ parts

$15.029

100+ parts

-

1k+ parts

-

10k+ parts

-

309

$15.029

-

-

-

Aztec Data Supply Inc.

USA . 185 parts In-Stock

1+ parts

$20.350

100+ parts

-

1k+ parts

-

10k+ parts

-

185

$20.350

-

-

-

Microchip USA

USA . 3,776 parts In-Stock

1+ parts

$21.668

100+ parts

-

1k+ parts

-

10k+ parts

-

3,776

$21.668

-

-

-

Corohmni

South Africa . 30 parts In-Stock

1+ parts

$22.920

100+ parts

-

1k+ parts

-

10k+ parts

-

30

$22.920

-

-

-

IDEA Electronic Components Group

UK . 1,468 parts In-Stock

1+ parts

$71.611

100+ parts

-

1k+ parts

$64.450

10k+ parts

-

1,468

$71.611

-

$64.450

-

MKK Technologies

India . 1,062 parts In-Stock

1+ parts

$134.660

100+ parts

-

1k+ parts

-

10k+ parts

-

1,062

$134.660

-

-

-

DigiPath Technology Company

USA . 1,062 parts In-Stock

1+ parts

$134.660

100+ parts

-

1k+ parts

-

10k+ parts

-

1,062

$134.660

-

-

-

Authorized Procurement Solutions

USA . 32,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

32,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

Kepictronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Futuretech Components

Singapore . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Lixinc

USA . 3,899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,899

-

-

-

-

Parana Technologies

USA . 1,754 parts In-Stock

1+ parts

-

100+ parts

$85.622

1k+ parts

-

10k+ parts

-

1,754

-

$85.622

-

-

Argo Parts USA

USA . 1,621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,621

-

-

-

-

Overview

Elevate your projects with the SPC560B64L3B6E0X microcontroller from STMicroelectronics. As a leader in the industry, STMicroelectronics ensures top quality and reliability in all their products. This microcontroller offers a wide range of applications in various industries, providing customers with unmatched value and benefits. With advanced features and high performance, this product is designed to meet your needs and exceed your expectations. Experience seamless connectivity, efficient power management, and reliable operation with the SPC560B64L3B6E0X microcontroller. Upgrade your projects today and unleash your creativity with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

This feature allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power options for the product.

Package Shape: SQUARE

The square package shape makes it easy to position and align on the PCB.

Bit Size: 32

The 32-bit architecture offers high processing power and performance.

No. of Terminals: 100

The large number of terminals allows for connectivity to various external components.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style enhances thermal and mechanical performance.

Minimum Supply Voltage: 3 V

The low minimum supply voltage helps in power efficiency.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes the product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation in extreme conditions.

ADC Channels: YES

The presence of ADC channels allows for accurate analog-to-digital conversion.

DMA Channels: YES

The availability of DMA channels enhances data transfer efficiency.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and routing.

ROM Words: 1572864

The large ROM size provides ample space for program and data storage.

Maximum Seated Height: 1.6 mm

The low seated height saves space in compact designs.

Width: 14 mm

The compact width makes the product suitable for small form factor applications.

Data EEPROM Size: 64K

The large EEPROM size allows for storing and retrieving data efficiently.

Peripherals: DMA(16), POR, PWM(37), RTC, TIMER(37), WDT

The numerous peripherals enhance the product's functionality and versatility.

Maximum Clock Frequency: 16 MHz

The high clock frequency enables swift data processing.

Length: 14 mm

The compact length complements the overall small footprint of the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability in harsh operating environments.

Peripheral IC Type: MICROCONTROLLER

The product's microcontroller type provides programmability and flexibility.

RAM Bytes: 98304

The large RAM size enables efficient data storage and retrieval during operation.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and handling.

Analog To Digital Convertors: 26-Ch 10-Bit, 24-Ch 12-Bit

The variety of ADC options cater to different resolution requirements.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent performance.

PWM Channels: YES

The presence of PWM channels allows for precise control of output signals.

Connectivity: CAN(6), I2C, IRDA, LIN(4), SCI(4), SPI(3)

The diverse connectivity options support integration with various communication protocols.

ROM Programmability: FLASH

The Flash programmability enables easy and quick updates to the program memory.

Terminal Pitch: 0.5 mm

The small terminal pitch facilitates high-density PCB designs.

Speed: 64 rpm

The high speed capability suits applications requiring quick data processing.

On Chip Program ROM Width: 8

The wide on-chip ROM width accommodates larger firmware code.

No. of I/O Lines: 77

The ample number of I/O lines offer flexibility in interfacing with external devices.

Technical Specifications

Microcontrollers SPC560B64L3B6E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

77

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

98304

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6), I2C, IRDA, LIN(4), SCI(4), SPI(3)

Peripherals:

DMA(16), POR, PWM(37), RTC, TIMER(37), WDT

Analog To Digital Convertors:

26-Ch 10-Bit, 24-Ch 12-Bit

Trade Compliance

SPC560B64L3B6E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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