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SPC560B60L3C6E0Y

STMicroelectronics

SPC560B60L3C6E0Y by STMicroelectronics

STMicroelectronics SPC560B60L3C6E0Y is a 32-bit microcontroller with 1048576 ROM words, 64K data EEPROM, and 81920 RAM bytes. Ideal for automotive applications, it features 26-Ch 10-Bit ADCs, CAN(6), I2C, IRDA connectivity, and operates at up to 16 MHz clock frequency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,269 parts In-Stock

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4,269

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Digiode

USA . 3,096 parts In-Stock

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3,096

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Anansix

USA . 2,541 parts In-Stock

1+ parts

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2,541

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Nova Conductors

Japan . 10 parts In-Stock

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-

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,083 parts In-Stock

1+ parts

$2.000

100+ parts

-

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1,083

$2.000

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Vigor

Singapore . 3,000 parts In-Stock

1+ parts

$6.600

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-

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3,000

$6.600

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Corohmni

South Africa . 253 parts In-Stock

1+ parts

$6.603

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-

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253

$6.603

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AZTECH Wire

Italy . 356 parts In-Stock

1+ parts

$10.494

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-

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356

$10.494

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Microchip USA

USA . 1,148 parts In-Stock

1+ parts

$19.441

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1,148

$19.441

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Semicontronic

India . 767 parts In-Stock

1+ parts

$21.000

100+ parts

$20.475

1k+ parts

$20.370

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767

$21.000

$20.475

$20.370

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IDEA Electronic Components Group

UK . 1,881 parts In-Stock

1+ parts

$33.725

100+ parts

-

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$30.353

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1,881

$33.725

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$30.353

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

1+ parts

$59.810

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300

$59.810

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MKK Technologies

India . 997 parts In-Stock

1+ parts

$63.418

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997

$63.418

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DigiPath Technology Company

USA . 997 parts In-Stock

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$63.418

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997

$63.418

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Continental Prestige Electronics

USA . 6,108 parts In-Stock

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Corphita

USA . 4,681 parts In-Stock

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4,681

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Argo Parts USA

USA . 3,170 parts In-Stock

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3,170

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Parana Technologies

USA . 833 parts In-Stock

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$40.324

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833

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$40.324

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Perfect Parts

USA . 706 parts In-Stock

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706

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Overview

Elevate your product performance with the SPC560B60L3C6E0Y by STMicroelectronics. From its cutting-edge technology to its robust design, this microcontroller is a game-changer in the automotive industry. With advanced features like multiple ADC channels, DMA capabilities, and high clock frequency, this device offers unparalleled speed and precision for all your applications. Trust in STMicroelectronics' reputation for quality and innovation, and unlock a world of possibilities with the SPC560B60L3C6E0Y. Elevate your product performance with the SPC560B60L3C6E0Y by STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Bit Size: 32

The 32-bit architecture allows for faster processing and calculations compared to lower bit sizes, making this microcontroller suitable for complex tasks.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, enhancing its versatility in different applications.

DMA Channels: YES

DMA channels enable direct memory access for efficient data transfer, reducing the load on the CPU and improving overall performance.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, making it ideal for battery-powered and noise-sensitive applications.

Connectivity: CAN(6), I2C, IRDA, LIN(4), SCI(4), SPI(3)

The variety of connectivity options such as CAN, I2C, SPI, etc., ensure compatibility with multiple communication protocols and devices, enhancing the microcontroller's connectivity capabilities.

Technical Specifications

Microcontrollers SPC560B60L3C6E0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

77

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

81920

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6), I2C, IRDA, LIN(4), SCI(4), SPI(3)

Peripherals:

DMA(16), POR, PWM(37), RTC, TIMER(37), WDT

Analog To Digital Convertors:

26-Ch 10-Bit, 24-Ch 12-Bit

Trade Compliance

SPC560B60L3C6E0Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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