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SPC560B54L5C6E0Y

STMicroelectronics

SPC560B54L5C6E0Y by STMicroelectronics

SPC560B54L5C6E0Y by STMicroelectronics is a 32-bit microcontroller with 786432 ROM words, 64K data EEPROM, and 65536 RAM bytes. Ideal for automotive applications, it features 34-Ch 10-Bit ADCs, CAN(6) connectivity, and operates at up to 16 MHz clock frequency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,751 parts In-Stock

1+ parts

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3,751

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Vyrian

USA . 3,521 parts In-Stock

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3,521

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Anansix

USA . 1,139 parts In-Stock

1+ parts

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1,139

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 531 parts In-Stock

1+ parts

$11.000

100+ parts

-

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531

$11.000

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AZTECH Wire

Italy . 935 parts In-Stock

1+ parts

$18.310

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935

$18.310

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Microchip USA

USA . 1,477 parts In-Stock

1+ parts

$27.316

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1,477

$27.316

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IDEA Electronic Components Group

UK . 537 parts In-Stock

1+ parts

$54.682

100+ parts

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$49.214

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537

$54.682

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$49.214

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MKK Technologies

India . 1,650 parts In-Stock

1+ parts

$102.826

100+ parts

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1,650

$102.826

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DigiPath Technology Company

USA . 1,650 parts In-Stock

1+ parts

$102.826

100+ parts

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1,650

$102.826

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Vigor

Singapore . 7,390 parts In-Stock

1+ parts

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7,390

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Corphita

USA . 1,312 parts In-Stock

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1,312

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Parana Technologies

USA . 185 parts In-Stock

1+ parts

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$65.381

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185

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$65.381

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Overview

Unlock the power of innovation with the SPC560B54L5C6E0Y from STMicroelectronics. As a leader in the microcontroller industry, STMicroelectronics sets the standard for quality and reliability. This versatile microcontroller is perfect for automotive applications, offering advanced features such as ADC channels, DMA channels, and PWM capabilities. With a wide range of connectivity options and a high clock frequency, the SPC560B54L5C6E0Y provides unmatched performance and value for customers looking to take their projects to the next level. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources.

Package Shape: SQUARE

Square package shape helps optimize space utilization on the PCB layout.

Bit Size: 32

32-bit architecture provides higher processing power and performance compared to lower bit microcontrollers.

No. of Terminals: 144

Having a higher number of terminals allows for more connectivity options and integration with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures a compact design for space-constrained applications.

Minimum Supply Voltage: 3 V

Low minimum supply voltage enables power-saving operation and compatibility with various power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising performance.

Technical Specifications

Microcontrollers SPC560B54L5C6E0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

121

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6), I2C, IRDA, LIN(8), SCI(8), SPI(3)

Peripherals:

DMA(16), POR, PWM(64), RTC, TIMER(64), WDT

Analog To Digital Convertors:

34-Ch 10-Bit, 24-Ch 12-Bit

Trade Compliance

SPC560B54L5C6E0Y Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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