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SPC560B50L3C6E0Y

STMicroelectronics

SPC560B50L3C6E0Y by STMicroelectronics

STMicroelectronics SPC560B50L3C6E0Y is a 32-bit microcontroller with 524288 ROM words and 64K data EEPROM size. Ideal for automotive applications, it features 28 ADC channels, 28 DMA channels, and peripherals like PWM(25) and RTC. Operating temperature ranges from -40 to 125 °C with a max clock frequency of 16 MHz.

Median Price

$10.070

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 489 parts In-Stock

1+ parts

$10.070

100+ parts

$6.250

1k+ parts

$5.350

10k+ parts

$5.020

489

$10.070

$6.250

$5.350

$5.020

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 99 parts In-Stock

1+ parts

$6.886

100+ parts

-

1k+ parts

-

10k+ parts

-

99

$6.886

-

-

-

Digiode

USA . 4,581 parts In-Stock

1+ parts

$7.923

100+ parts

-

1k+ parts

-

10k+ parts

-

4,581

$7.923

-

-

-

Vyrian

USA . 8,560 parts In-Stock

1+ parts

-

100+ parts

-

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8,560

-

-

-

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Anansix

USA . 1,731 parts In-Stock

1+ parts

-

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-

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1,731

-

-

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ComSIT Distribution GmbH

Germany . 690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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690

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$5.390

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$5.390

-

-

-

AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$6.450

100+ parts

-

1k+ parts

-

10k+ parts

-

429

$6.450

-

-

-

Continental Prestige Electronics

USA . 3,522 parts In-Stock

1+ parts

$6.886

100+ parts

-

1k+ parts

-

10k+ parts

$6.749

3,522

$6.886

-

-

$6.749

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$6.886

100+ parts

$6.749

1k+ parts

-

10k+ parts

-

2,000

$6.886

$6.749

-

-

Semicontronic

India . 219 parts In-Stock

1+ parts

$7.090

100+ parts

$6.913

1k+ parts

$6.877

10k+ parts

-

219

$7.090

$6.913

$6.877

-

Ampacity Inc.

Singapore . 156 parts In-Stock

1+ parts

$7.090

100+ parts

-

1k+ parts

-

10k+ parts

-

156

$7.090

-

-

-

Corphita

USA . 3,057 parts In-Stock

1+ parts

$7.506

100+ parts

-

1k+ parts

-

10k+ parts

-

3,057

$7.506

-

-

-

Microchip USA

USA . 2,839 parts In-Stock

1+ parts

$18.432

100+ parts

-

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-

10k+ parts

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2,839

$18.432

-

-

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Corohmni

South Africa . 234 parts In-Stock

1+ parts

$63.300

100+ parts

-

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234

$63.300

-

-

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Aztec Data Supply Inc.

USA . 1,229 parts In-Stock

1+ parts

$67.280

100+ parts

-

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1,229

$67.280

-

-

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IDEA Electronic Components Group

UK . 2,017 parts In-Stock

1+ parts

$72.648

100+ parts

-

1k+ parts

$65.383

10k+ parts

-

2,017

$72.648

-

$65.383

-

Component Stockers USA

USA . 1,737 parts In-Stock

1+ parts

$77.950

100+ parts

-

1k+ parts

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10k+ parts

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1,737

$77.950

-

-

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MKK Technologies

India . 200 parts In-Stock

1+ parts

$136.609

100+ parts

-

1k+ parts

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10k+ parts

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200

$136.609

-

-

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DigiPath Technology Company

USA . 200 parts In-Stock

1+ parts

$136.609

100+ parts

-

1k+ parts

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10k+ parts

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200

$136.609

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 16,523 parts In-Stock

1+ parts

-

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16,523

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Lixinc

USA . 16,379 parts In-Stock

1+ parts

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16,379

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Argo Parts USA

USA . 864 parts In-Stock

1+ parts

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864

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Parana Technologies

USA . 315 parts In-Stock

1+ parts

-

100+ parts

$86.862

1k+ parts

-

10k+ parts

-

315

-

$86.862

-

-

Overview

Unlock the potential of your next project with the SPC560B50L3C6E0Y microcontroller by STMicroelectronics. This high-quality device offers unmatched reliability and performance, making it perfect for a wide range of applications in the automotive industry. With advanced features like ADC channels, DMA support, and a variety of connectivity options, this microcontroller provides exceptional value and flexibility to customers. Trust STMicroelectronics for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options, making it versatile for different applications.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers higher processing capability and performance compared to lower bit sizes.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages enables compatibility with a wide range of devices and systems.

No. of Terminals: 100

Having a high number of terminals allows for more connectivity options and interfaces, enhancing the microcontroller's functionality.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities in data acquisition.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU overhead, enhancing overall system performance.

ROM Words: 524288

Large ROM capacity allows for extensive program storage and firmware updates, accommodating complex software requirements.

Maximum Clock Frequency: 16 MHz

A high clock frequency supports fast data processing and execution speed, making the microcontroller suitable for real-time applications.

Technical Specifications

Microcontrollers SPC560B50L3C6E0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

79

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN(4), SCI(4), SPI(3)

Peripherals:

DMA, POR, PWM(25), RTC, TIMER(28), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

SPC560B50L3C6E0Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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