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SPC560B50L3C4E0X

STMicroelectronics

SPC560B50L3C4E0X by STMicroelectronics

STMicroelectronics SPC560B50L3C4E0X is a 32-bit microcontroller with 524288 ROM words, 64K data EEPROM, and 32768 RAM bytes. Ideal for automotive applications, it features 28 ADC channels, DMA support, and PWM with 25 channels. Operating temperature ranges from -40 to 125 °C with a max clock frequency of 16 MHz.

Median Price

$5.210

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.210

100+ parts

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100

$5.210

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Vyrian

USA . 10,541 parts In-Stock

1+ parts

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10,541

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Digiode

USA . 2,752 parts In-Stock

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2,752

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Anansix

USA . 1,381 parts In-Stock

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1,381

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Distributors (Availability)

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Vigor

Singapore . 2,262 parts In-Stock

1+ parts

$4.940

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2,262

$4.940

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Continental Prestige Electronics

USA . 1,926 parts In-Stock

1+ parts

$5.210

100+ parts

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$5.106

1,926

$5.210

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$5.106

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.210

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100

$5.210

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Microchip USA

USA . 1,979 parts In-Stock

1+ parts

$15.754

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1,979

$15.754

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AZTECH Wire

Italy . 207 parts In-Stock

1+ parts

$16.619

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207

$16.619

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Corohmni

South Africa . 43 parts In-Stock

1+ parts

$17.609

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43

$17.609

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Aztec Data Supply Inc.

USA . 1,768 parts In-Stock

1+ parts

$18.880

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1,768

$18.880

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Ampacity Inc.

Singapore . 376 parts In-Stock

1+ parts

$23.000

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376

$23.000

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Semicontronic

India . 1,558 parts In-Stock

1+ parts

$32.000

100+ parts

$31.200

1k+ parts

$31.040

10k+ parts

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1,558

$32.000

$31.200

$31.040

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IDEA Electronic Components Group

UK . 1,551 parts In-Stock

1+ parts

$67.842

100+ parts

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$61.058

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1,551

$67.842

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$61.058

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MKK Technologies

India . 861 parts In-Stock

1+ parts

$127.572

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861

$127.572

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DigiPath Technology Company

USA . 861 parts In-Stock

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$127.572

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861

$127.572

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Argo Parts USA

USA . 2,882 parts In-Stock

1+ parts

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2,882

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Parana Technologies

USA . 1,676 parts In-Stock

1+ parts

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$81.115

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1,676

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$81.115

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Corphita

USA . 250 parts In-Stock

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250

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Overview

Discover the cutting-edge SPC560B50L3C4E0X microcontroller by STMicroelectronics, a leader in the industry known for its top-quality products. Ideal for automotive applications, this advanced device offers unparalleled performance and reliability. With features like multiple ADC and DMA channels, along with a wide range of peripherals including PWM and RTC, this microcontroller provides value and flexibility to customers. Trust STMicroelectronics to deliver a superior product that meets all your needs in a compact, low-profile package. Elevate your projects with the SPC560B50L3C4E0X and experience the benefits of innovative technology at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power inputs, providing flexibility in design.

Package Shape: SQUARE

The square package shape is efficient for space-saving on PCBs and allows for easier routing of traces.

Bit Size: 32

The 32-bit architecture of this microcontroller enables fast and efficient processing of data, making it suitable for complex applications.

Power Supplies (V): 3.3/5

Supporting multiple power supply options (3.3V/5V) allows for compatibility with a wide range of components and systems.

No. of Terminals: 100

With 100 terminals, this microcontroller offers ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures a compact form factor, making it suitable for space-constrained designs.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures reliable operation even in low-power situations, enhancing the versatility of this microcontroller.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this microcontroller can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40°C allows for use in cold environments without risk of malfunction.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to convert analog signals to digital data, expanding its functionality for a wider range of applications.

DMA Channels: YES

Having DMA channels helps in offloading data transfer tasks from the CPU, improving overall system performance and efficiency.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and mounting onto PCBs, simplifying the manufacturing process.

ROM Words: 524288

With a ROM size of 524288 words, this microcontroller can store a large amount of program data, suitable for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6mm allows for a slim profile, making this microcontroller suitable for compact electronic devices.

Width: 14 mm

The 14mm width ensures compatibility with standard PCB design practices, enhancing ease of integration into various projects.

Data EEPROM Size: 64K

The large EEPROM size of 64K provides ample storage for non-volatile data, allowing for customization and calibration in applications.

Peripherals: DMA, POR, PWM(25), RTC, TIMER(28), WDT

The inclusion of various peripherals such as DMA, PWM, RTC, and timers adds functionality and flexibility to this microcontroller, enhancing its versatility.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz allows for fast processing speeds, making this microcontroller suitable for applications requiring real-time operation.

Length: 14 mm

With a length of 14mm, this microcontroller's compact size makes it suitable for space-constrained designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets the stringent temperature and performance requirements of the industry.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller device, this product offers integrated processing, memory, and I/O capabilities in a single package, ideal for embedded systems.

RAM Bytes: 32768

Featuring 32768 bytes of RAM, this microcontroller provides sufficient memory for data storage and manipulation, enhancing its processing capabilities.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and ensures secure connections, enhancing the reliability of this microcontroller.

Analog To Digital Convertors: 28-Ch 10-Bit

With 28 channels of 10-bit ADCs, this microcontroller can accurately convert analog signals to digital data, suitable for sensor interfacing applications.

Maximum Supply Current: 140 mA

The maximum supply current of 140mA ensures stable operation under load conditions, making this microcontroller reliable in various scenarios.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides stable power delivery, ensuring consistent performance of the microcontroller.

PWM Channels: YES

Featuring PWM channels, this microcontroller can generate precise pulse-width modulated signals, suitable for motor control and LED dimming applications.

Connectivity: CAN(3), I2C, LIN(4), SCI(4), SPI(3)

With various connectivity options such as CAN, I2C, LIN, SCI, and SPI, this microcontroller can easily communicate with external devices and networks.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and quick updating of firmware, enabling efficient development and maintenance of applications.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm saves space on PCBs and enables high-density mounting, making this microcontroller suitable for compact designs.

Speed: 64 rpm

With a speed rating of 64 rpm, this microcontroller can handle tasks swiftly, enhancing the overall performance and responsiveness of the system.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits enables efficient storage and execution of program instructions, enhancing the processing capabilities of the microcontroller.

No. of I/O Lines: 79

With 79 I/O lines, this microcontroller offers ample interface options for connecting to peripherals and external devices, expanding its versatility.

Technical Specifications

Microcontrollers SPC560B50L3C4E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

79

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN(4), SCI(4), SPI(3)

Peripherals:

DMA, POR, PWM(25), RTC, TIMER(28), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

SPC560B50L3C4E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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