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SPC560B50L3B6E0X

STMicroelectronics

SPC560B50L3B6E0X by STMicroelectronics

STMicroelectronics SPC560B50L3B6E0X is a 32-bit microcontroller with 524288 ROM words, 64K data EEPROM, and 32768 RAM bytes. It features 28 ADC channels, PWM(25), RTC, and DMA peripherals. Ideal for industrial applications requiring CAN, I2C, LIN, SCI, and SPI connectivity at a max clock frequency of 16 MHz.

Median Price

$5.627

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$5.627

100+ parts

-

1k+ parts

-

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650

$5.627

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Vyrian

USA . 10,463 parts In-Stock

1+ parts

-

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10,463

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Digiode

USA . 2,261 parts In-Stock

1+ parts

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2,261

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Anansix

USA . 1,504 parts In-Stock

1+ parts

-

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1,504

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,184 parts In-Stock

1+ parts

$4.940

100+ parts

-

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1,184

$4.940

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Continental Prestige Electronics

USA . 2,929 parts In-Stock

1+ parts

$5.627

100+ parts

-

1k+ parts

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10k+ parts

$5.514

2,929

$5.627

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-

$5.514

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.627

100+ parts

-

1k+ parts

$5.345

10k+ parts

$5.233

2,000

$5.627

-

$5.345

$5.233

AZTECH Wire

Italy . 302 parts In-Stock

1+ parts

$6.561

100+ parts

-

1k+ parts

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10k+ parts

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302

$6.561

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-

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Microchip USA

USA . 3,212 parts In-Stock

1+ parts

$15.754

100+ parts

-

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3,212

$15.754

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Semicontronic

India . 1,318 parts In-Stock

1+ parts

$19.000

100+ parts

$18.525

1k+ parts

$18.430

10k+ parts

-

1,318

$19.000

$18.525

$18.430

-

Ampacity Inc.

Singapore . 674 parts In-Stock

1+ parts

$28.000

100+ parts

-

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674

$28.000

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IDEA Electronic Components Group

UK . 1,217 parts In-Stock

1+ parts

$30.412

100+ parts

-

1k+ parts

$27.371

10k+ parts

-

1,217

$30.412

-

$27.371

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Aztec Data Supply Inc.

USA . 247 parts In-Stock

1+ parts

$52.110

100+ parts

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247

$52.110

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MKK Technologies

India . 1,046 parts In-Stock

1+ parts

$57.189

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1,046

$57.189

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DigiPath Technology Company

USA . 1,046 parts In-Stock

1+ parts

$57.189

100+ parts

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1,046

$57.189

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Component Stockers USA

USA . 782 parts In-Stock

1+ parts

$78.450

100+ parts

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782

$78.450

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Corohmni

South Africa . 273 parts In-Stock

1+ parts

$83.959

100+ parts

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273

$83.959

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Parana Technologies

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$36.363

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2,000

-

$36.363

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Corphita

USA . 1,535 parts In-Stock

1+ parts

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1,535

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Argo Parts USA

USA . 730 parts In-Stock

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730

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Futuretech Components

Singapore . 200 parts In-Stock

1+ parts

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200

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Overview

Enhance your electronic projects with the high-quality SPC560B50L3B6E0X microcontroller by STMicroelectronics. With a reputation for excellence, STMicroelectronics delivers top-notch products that guarantee reliability and performance. This microcontroller is versatile, offering a wide range of applications in various industries. Experience seamless integration, efficient operations, and cutting-edge technology with the SPC560B50L3B6E0X. Upgrade your projects today and unlock endless possibilities with this exceptional product!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, increasing its versatility.

Package Shape: SQUARE

The square package shape offers a compact design, optimizing space efficiency in electronics projects.

Bit Size: 32

The 32-bit architecture provides high processing power and performance capabilities for demanding applications.

Power Supplies: 3.3/5 V

The dual power supply options offer flexibility in voltage requirements, making it adaptable to different power sources.

No. of Terminals: 100

The large number of terminals allows for extensive connectivity options, enabling complex circuit designs.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a slim profile and precise terminal alignment, ensuring reliable connections and optimal performance.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 105 °C

The high operating temperature range allows for reliable performance in harsh environments or industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in extreme cold conditions.

ADC Channels: YES

The built-in analog-to-digital converters enable accurate conversion of analog signals, making it suitable for sensor applications.

DMA Channels: YES

The integrated Direct Memory Access channels enhance data transfer efficiency, reducing the workload on the CPU.

Terminal Position: QUAD

The quad terminal position ensures secure connections and easy integration into circuit layouts.

ROM Words: 524288

The large ROM capacity allows for extensive program storage, accommodating complex code requirements.

Maximum Seated Height: 1.6 mm

The low seated height saves space and allows for slim device profiles in compact electronic designs.

Width: 14 mm

The moderate width offers a balance between compactness and accessibility for handling and installation.

Data EEPROM Size: 64K

The generous EEPROM size allows for storing and retrieving data efficiently, enhancing data storage capabilities.

Peripherals: DMA, POR, PWM, RTC, TIMER, WDT

The various peripheral options provide additional functionality for diverse applications, enhancing overall performance.

Maximum Clock Frequency: 16 MHz

The high clock frequency enables rapid data processing and execution of commands, ideal for time-sensitive applications.

Length: 14 mm

The moderate length ensures a balanced form factor, suitable for various PCB layouts and space restrictions.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance ensures reliable operation in rugged industrial environments or outdoor settings.

Peripheral IC Type: MICROCONTROLLER

The microcontroller design offers integrated processing, memory, and I/O capabilities, making it a versatile solution for embedded systems.

RAM Bytes: 32768

The ample RAM capacity supports efficient data manipulation and processing, enhancing performance in memory-intensive applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered devices and noise-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections, ensuring reliable electrical contact in various operating conditions.

Analog To Digital Convertors: 28-Ch 10-Bit

The multiple analog-to-digital converters support simultaneous conversion of multiple input channels, enabling efficient signal processing.

Maximum Supply Current: 140 mA

The moderate supply current consumption ensures efficient power usage, prolonging battery life in portable devices.

Nominal Supply Voltage: 3.3 V

The stable nominal supply voltage ensures consistent and reliable operation within the recommended voltage range.

PWM Channels: YES

The Pulse Width Modulation (PWM) channels enable precise control of analog signals, suitable for applications requiring variable output signals.

Connectivity: CAN, I2C, LIN, SCI, SPI

The various connectivity options allow for communication with different devices and systems, enhancing compatibility and versatility.

ROM Programmability: FLASH

The flash ROM programmability offers flexibility in updating firmware and applications, facilitating software development and maintenance.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density packaging and compact PCB layouts, saving space and enhancing design flexibility.

Speed: 64 rpm

The high speed capability supports rapid data processing and execution, ideal for real-time applications and high-performance computing tasks.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM enhances memory efficiency and supports fast access to program data.

No. of I/O Lines: 79

The numerous I/O lines provide extensive connectivity options for interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers SPC560B50L3B6E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

79

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN(4), SCI(4), SPI(3)

Peripherals:

DMA, POR, PWM(25), RTC, TIMER(28), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

SPC560B50L3B6E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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