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SPC560B50L1C6E0Y

STMicroelectronics

SPC560B50L1C6E0Y by STMicroelectronics

STMicroelectronics SPC560B50L1C6E0Y is a 32-bit microcontroller with 64K data EEPROM, 12 ADC channels, and 45 I/O lines. Ideal for automotive applications, it features CAN, I2C, LIN, SCI, and SPI connectivity options. Operating at up to 16 MHz with a temperature range of -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,925 parts In-Stock

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Digiode

USA . 3,802 parts In-Stock

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3,802

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Anansix

USA . 1,435 parts In-Stock

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1,435

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Distributors (Availability)

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AZTECH Wire

Italy . 400 parts In-Stock

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$16.810

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400

$16.810

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IDEA Electronic Components Group

UK . 686 parts In-Stock

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$62.872

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$56.585

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686

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$56.585

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Component Stockers USA

USA . 567 parts In-Stock

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$99.990

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567

$99.990

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MKK Technologies

India . 898 parts In-Stock

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$118.226

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898

$118.226

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DigiPath Technology Company

USA . 898 parts In-Stock

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$118.226

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898

$118.226

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QUARKTWIN TECHNOLOGY LTD

USA . 23,899 parts In-Stock

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Microchip USA

USA . 3,809 parts In-Stock

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3,809

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Parana Technologies

USA . 2,129 parts In-Stock

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$75.173

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$75.173

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Vigor

Singapore . 2,000 parts In-Stock

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2,000

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Corphita

USA . 372 parts In-Stock

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Overview

Unleash the power of innovation with the SPC560B50L1C6E0Y microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers top-quality products that meet the highest standards. Ideal for automotive applications, this microcontroller offers exceptional performance and reliability. With advanced features such as DMA channels, PWM capabilities, and connectivity options like CAN and SPI, this versatile device empowers you to bring your designs to life. Experience the value and benefits of the SPC560B50L1C6E0Y and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring safe operation.

Bit Size: 32

Offers a good balance between performance and complexity for various applications.

ADC Channels: YES

Enables analog to digital conversion, essential for sensor interfacing and data acquisition.

ROM Words: 524288

Provides ample storage for program memory, accommodating complex algorithms and functions.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications with a wide operating temperature range.

Connectivity: CAN(3), I2C, LIN(4), SCI(4), SPI(2)

Offers multiple communication interfaces, increasing compatibility with various devices and systems.

RAM Bytes: 32768

Sufficient RAM size for data storage and processing, enhancing overall performance.

Technical Specifications

Microcontrollers SPC560B50L1C6E0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

45

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN(4), SCI(4), SPI(2)

Peripherals:

DMA, POR, PWM(12), RTC, TIMER(12), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

SPC560B50L1C6E0Y Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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