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SPC560B40L3C6E0X

STMicroelectronics

SPC560B40L3C6E0X by STMicroelectronics

STMicroelectronics SPC560B40L3C6E0X is a 32-bit microcontroller with 262K ROM words, 64K data EEPROM, and 28 ADC channels. Ideal for automotive applications with CAN, I2C, LIN connectivity and peripherals like DMA and PWM. Operating temperature range from -40 to 125°C makes it suitable for harsh environments.

Median Price

$7.331

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 12 parts In-Stock

1+ parts

-

100+ parts

$7.331

1k+ parts

-

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12

-

$7.331

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Distributors (In-Stock)

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$5.841

100+ parts

-

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450

$5.841

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Vyrian

USA . 6,778 parts In-Stock

1+ parts

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6,778

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Digiode

USA . 2,785 parts In-Stock

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2,785

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Anansix

USA . 2,191 parts In-Stock

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2,191

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Distributors (Availability)

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Vigor

Singapore . 1,719 parts In-Stock

1+ parts

$5.080

100+ parts

-

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-

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-

1,719

$5.080

-

-

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Continental Prestige Electronics

USA . 3,897 parts In-Stock

1+ parts

$5.841

100+ parts

-

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-

10k+ parts

$5.724

3,897

$5.841

-

-

$5.724

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.841

100+ parts

$5.724

1k+ parts

-

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-

2,000

$5.841

$5.724

-

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Ampacity Inc.

Singapore . 12 parts In-Stock

1+ parts

$6.990

100+ parts

-

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12

$6.990

-

-

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Semicontronic

India . 12 parts In-Stock

1+ parts

$6.990

100+ parts

$6.815

1k+ parts

$6.780

10k+ parts

-

12

$6.990

$6.815

$6.780

-

Microchip USA

USA . 3,383 parts In-Stock

1+ parts

$16.216

100+ parts

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3,383

$16.216

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AZTECH Wire

Italy . 490 parts In-Stock

1+ parts

$18.740

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490

$18.740

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Corohmni

South Africa . 121 parts In-Stock

1+ parts

$38.366

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121

$38.366

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Aztec Data Supply Inc.

USA . 168 parts In-Stock

1+ parts

$69.730

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168

$69.730

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IDEA Electronic Components Group

UK . 1,320 parts In-Stock

1+ parts

$70.844

100+ parts

-

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$63.759

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1,320

$70.844

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$63.759

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MKK Technologies

India . 638 parts In-Stock

1+ parts

$133.217

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638

$133.217

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DigiPath Technology Company

USA . 638 parts In-Stock

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$133.217

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638

$133.217

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Kepictronics

USA . 15,000 parts In-Stock

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RC Electronics

USA . 7,082 parts In-Stock

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7,082

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Lixinc

USA . 2,958 parts In-Stock

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2,958

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Perfect Parts

USA . 2,234 parts In-Stock

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2,234

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Argo Parts USA

USA . 1,760 parts In-Stock

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1,760

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Parana Technologies

USA . 1,238 parts In-Stock

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$84.704

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1,238

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$84.704

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Corphita

USA . 571 parts In-Stock

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571

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Overview

Get ready to experience top-of-the-line technology with the SPC560B40L3C6E0X microcontroller by STMicroelectronics. With a reputation for unmatched quality and reliability, STMicroelectronics has crafted a product that delivers exceptional performance and efficiency. Ideal for automotive applications, this microcontroller offers advanced features such as DMA channels, PWM capabilities, and a wide range of connectivity options. Trust in STMicroelectronics to provide you with a cutting-edge solution that will elevate your projects to new heights. Elevate your innovation with the SPC560B40L3C6E0X microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable.

Surface Mount: YES

Ease of installation and compact design for space-saving applications.

Maximum Supply Voltage: 3.6 V

Support for a higher supply voltage compared to some other microcontrollers.

Package Shape: SQUARE

Square shape allows for easy mounting and efficient use of PCB space.

Bit Size: 32

High bit size allows for complex calculations and processing capabilities.

Power Supplies (V): 3.3/5

Flexibility in power supply options for different applications.

No. of Terminals: 100

Sufficient number of terminals for connecting peripherals and external components.

Minimum Supply Voltage: 3 V

Support for a low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 125 °C

Wide operating temperature range suitable for various environments.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperature conditions without issues.

ADC Channels: YES

Built-in Analog to Digital Converters for accurate reading of analog signals.

DMA Channels: YES

Support for Direct Memory Access channels for efficient data transfer.

Terminal Position: QUAD

Quad terminal position for easy connectivity and layout design.

ROM Words: 262144

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 14 mm

Compact width for easy integration into PCB designs.

Data EEPROM Size: 64K

Sufficient EEPROM size for storing non-volatile data.

Peripherals: DMA, POR, PWM(25), RTC, TIMER(28), WDT

Diverse set of peripherals for enhanced functionality and interfacing capabilities.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing and response times.

Peak Reflow Temperature °C: 225

Can withstand high reflow temperatures during manufacturing processes.

Length: 14 mm

Compact length for space-efficient designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance for reliable performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Integrated microcontroller IC for all-in-one functionality.

RAM Bytes: 24576

Sufficient RAM capacity for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high efficiency.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and connection reliability.

Analog To Digital Convertors: 28-Ch 10-Bit

Multiple high-resolution ADCs for precise analog signal conversion.

Maximum Supply Current: 140 mA

Low supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable and common supply voltage for consistent performance.

PWM Channels: YES

Support for Pulse Width Modulation channels for precise control of output signals.

Connectivity: CAN(2), I2C, LIN(3), SCI(3), SPI(3)

Various communication interfaces for connecting to different devices and networks.

ROM Programmability: FLASH

Flash ROM for easy programmability and flexibility in updating firmware.

Terminal Pitch: 0.5 mm

Fine pitch terminal spacing for compact PCB layouts.

Speed: 64 rpm

Capable of high-speed processing and response times.

On Chip Program ROM Width: 8

Built-in program ROM with wide data width for efficient data processing.

No. of I/O Lines: 79

Sufficient input/output lines for connecting peripherals and external devices.

Technical Specifications

Microcontrollers SPC560B40L3C6E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

79

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

225

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(2), I2C, LIN(3), SCI(3), SPI(3)

Peripherals:

DMA, POR, PWM(25), RTC, TIMER(28), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

SPC560B40L3C6E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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