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SPC560B40L3B4E0X

STMicroelectronics

SPC560B40L3B4E0X by STMicroelectronics

SPC560B40L3B4E0X by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words and 64K data EEPROM size. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring CAN, I2C, LIN, SCI, and SPI connectivity. With 28 ADC channels and 79 I/O lines, it offers versatile peripheral support including DMA and PWM functions.

Median Price

$5.324

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$5.641

100+ parts

-

1k+ parts

-

10k+ parts

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32

$5.641

-

-

-

IBS Electronics

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.007

10k+ parts

-

14,000

-

-

$5.007

-

Vyrian

USA . 11,640 parts In-Stock

1+ parts

-

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-

1k+ parts

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11,640

-

-

-

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Digiode

USA . 3,830 parts In-Stock

1+ parts

-

100+ parts

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3,830

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-

-

-

Anansix

USA . 2,454 parts In-Stock

1+ parts

-

100+ parts

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2,454

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,931 parts In-Stock

1+ parts

$4.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,931

$4.800

-

-

-

Continental Prestige Electronics

USA . 3,245 parts In-Stock

1+ parts

$5.641

100+ parts

-

1k+ parts

-

10k+ parts

$5.528

3,245

$5.641

-

-

$5.528

Netroflash

USA . 500 parts In-Stock

1+ parts

$5.641

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$5.641

-

-

-

AZTECH Wire

Italy . 273 parts In-Stock

1+ parts

$10.732

100+ parts

-

1k+ parts

-

10k+ parts

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273

$10.732

-

-

-

IDEA Electronic Components Group

UK . 2,162 parts In-Stock

1+ parts

$14.339

100+ parts

-

1k+ parts

$12.905

10k+ parts

-

2,162

$14.339

-

$12.905

-

Microchip USA

USA . 2,247 parts In-Stock

1+ parts

$15.292

100+ parts

-

1k+ parts

-

10k+ parts

-

2,247

$15.292

-

-

-

Semicontronic

India . 1,057 parts In-Stock

1+ parts

$26.000

100+ parts

$25.350

1k+ parts

$25.220

10k+ parts

-

1,057

$26.000

$25.350

$25.220

-

MKK Technologies

India . 694 parts In-Stock

1+ parts

$26.964

100+ parts

-

1k+ parts

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10k+ parts

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694

$26.964

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-

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DigiPath Technology Company

USA . 694 parts In-Stock

1+ parts

$26.964

100+ parts

-

1k+ parts

-

10k+ parts

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694

$26.964

-

-

-

Ampacity Inc.

Singapore . 472 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

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472

$29.000

-

-

-

Corohmni

South Africa . 37 parts In-Stock

1+ parts

$36.102

100+ parts

-

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10k+ parts

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37

$36.102

-

-

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

1+ parts

$76.830

100+ parts

-

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100

$76.830

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Component Connect

USA . 45,845 parts In-Stock

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45,845

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Lixinc

USA . 16,235 parts In-Stock

1+ parts

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16,235

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Kepictronics

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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-

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RC Electronics

USA . 4,456 parts In-Stock

1+ parts

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4,456

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-

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A-Z Elektronik GmbH

Germany . 3,641 parts In-Stock

1+ parts

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100+ parts

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3,641

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Perfect Parts

USA . 3,064 parts In-Stock

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3,064

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Argo Parts USA

USA . 2,166 parts In-Stock

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2,166

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-

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Parana Technologies

USA . 1,924 parts In-Stock

1+ parts

-

100+ parts

$17.145

1k+ parts

-

10k+ parts

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1,924

-

$17.145

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Corphita

USA . 1,637 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,637

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Futuretech Components

Singapore . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,000

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-

Overview

Elevate your projects with the SPC560B40L3B4E0X by STMicroelectronics, a top-tier microcontroller designed for excellence. Crafted by a renowned manufacturer, this gem offers unparalleled quality and reliability in a wide range of applications. With advanced features like DMA channels, PWM capabilities, and an extensive list of peripherals, this microcontroller is a game-changer for industrial-grade projects. Experience seamless connectivity, high-speed performance, and precise control with the SPC560B40L3B4E0X, unlocking a world of possibilities for your creations. Choose excellence, choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

This high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in design.

Package Shape: SQUARE

The square shape makes it easy to integrate the microcontroller into compact designs, saving space in electronic devices.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers enhanced processing power and performance for demanding applications.

Power Supplies (V): 3.3/5

Supports multiple voltage options, providing flexibility for different power requirements in various applications.

No. of Terminals: 100

The abundance of terminals enables versatile connectivity options, allowing for the integration of numerous peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a sleek and compact design, suitable for space-constrained applications.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption, ideal for battery-operated devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller is suitable for harsh industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance in extreme cold conditions, making it ideal for outdoor applications.

ADC Channels: YES

The inclusion of analog-to-digital converter channels allows for precise measurement and monitoring of external signals.

DMA Channels: YES

Direct memory access channels enhance data transfer speeds, improving overall system performance.

Terminal Position: QUAD

The quad terminal position facilitates easy installation and soldering onto circuit boards, streamlining the assembly process.

ROM Words: 262144

With a large ROM capacity, this microcontroller can store extensive program code and data, suitable for complex applications.

Maximum Seated Height: 1.6 mm

The low profile height makes it suitable for slim and compact device designs, ideal for space-constrained applications.

Width: 14 mm

The compact width of the microcontroller allows for seamless integration into small electronic devices, conserving space.

Data EEPROM Size: 64K

Offers ample storage for non-volatile data, enabling the retention of critical information even when the power is off.

Peripherals: DMA, POR, PWM(25), RTC, TIMER(28), WDT

The wide range of built-in peripherals enhances the functionality and versatility of the microcontroller for diverse applications.

Technical Specifications

Microcontrollers SPC560B40L3B4E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

79

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(2), I2C, LIN(3), SCI(3), SPI(3)

Peripherals:

DMA, POR, PWM(25), RTC, TIMER(28), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

SPC560B40L3B4E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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