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SN260QT

STMicroelectronics

SN260QT by STMicroelectronics

SN260QT by STMicroelectronics is a low-power serial communication controller with a max supply voltage of 1.9V and operates in extreme temperatures from -40 °C to 85°C. It features a compact 40-terminal chip carrier design and supports async communication at up to 24 MHz. Ideal for industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,103 parts In-Stock

1+ parts

-

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6,103

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Digiode

USA . 3,718 parts In-Stock

1+ parts

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3,718

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Anansix

USA . 2,787 parts In-Stock

1+ parts

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2,787

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 122 parts In-Stock

1+ parts

$21.750

100+ parts

-

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122

$21.750

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IDEA Electronic Components Group

UK . 949 parts In-Stock

1+ parts

$30.570

100+ parts

-

1k+ parts

$27.513

10k+ parts

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949

$30.570

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$27.513

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MKK Technologies

India . 920 parts In-Stock

1+ parts

$57.484

100+ parts

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920

$57.484

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DigiPath Technology Company

USA . 920 parts In-Stock

1+ parts

$57.484

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920

$57.484

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Corphita

USA . 1,294 parts In-Stock

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1,294

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Parana Technologies

USA . 37 parts In-Stock

1+ parts

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$36.551

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37

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$36.551

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Overview

Elevate your designs with the SN260QT from STMicroelectronics, a leader in innovative solutions for serial communication. This compact controller excels in low power consumption while delivering robust performance in demanding environments. With its wide temperature range and exceptional reliability, the SN260QT is perfect for industrial applications, ensuring seamless connectivity in your projects. Choose quality, choose STMicroelectronics, and unlock endless possibilities!

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for a compact design and easier integration into modern PCB layouts.

Maximum Supply Voltage: 1.9 V

A maximum supply voltage of 1.9 V ensures compatibility with low-voltage applications, reducing power consumption.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, enabling a more efficient circuit design.

Power Supplies (V): 1.8

Designed for 1.8 V power supplies, this product can efficiently operate in low voltage environments.

No. of Terminals: 40

With 40 terminals, the product supports a wide range of connections and functionalities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

This package style offers better thermal conduction, which is crucial for maintaining performance in demanding applications.

Minimum Supply Voltage: 1.7 V

A minimum supply voltage of 1.7 V allows for flexible power supply options and enhances design versatility.

Maximum Operating Temperature: 85 °C

Operating at a maximum of 85 °C makes this product suitable for industrial applications where environmental conditions can vary.

Minimum Operating Temperature: -40 °C

The ability to function down to -40 °C expands its applicability in extreme temperature environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and resistance to oxidation, ensuring reliability.

Terminal Position: QUAD

Quad terminal positioning allows for uniform distribution of electrical and thermal load, enhancing performance.

Maximum Seated Height: 1.9 mm

A low seated height facilitates compact designs, enabling more dense PCB layouts.

Width: 6 mm

A width of 6 mm makes it suitable for applications where space is at a premium.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication protocols, allowing for flexible integration in diverse applications.

Maximum Clock Frequency: 24 MHz

A high maximum clock frequency of 24 MHz enables fast data processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time at peak reflow temperature of 30 seconds provides assurance during assembly processes.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of 260 °C ensures compatibility with modern soldering techniques.

Length: 6 mm

A compact length of 6 mm aids in reducing overall PCB footprint.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in harsh environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

As a peripheral IC type, it is well-suited for serial communication and LAN applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated applications.

Terminal Form: NO LEAD

No-lead terminal form aids in miniaturization and reduces PCB real estate usage.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8 V supports energy-efficient designs.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch provides a good balance between density and manufacturability.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate resistance to moisture, suitable for controlled manufacturing environments.

Low Power Mode: YES

The low power mode enhances energy efficiency, making it a great choice for battery-powered applications.

Technical Specifications

Serial Communication Controllers SN260QT attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Address Bus Width:

0

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Communication Protocol:

ASYNC, BIT

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

SN260QT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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