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SCTH50N120-7

STMicroelectronics

SCTH50N120-7 by STMicroelectronics

SCTH50N120-7 by STMicroelectronics is a powerful N-channel FET designed for switching applications, featuring a 1200V breakdown voltage and 65A max drain current. It operates in enhancement mode with a low on-resistance of 0.069Ω. Ideal for high-efficiency power management in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,566 parts In-Stock

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Digiode

USA . 2,796 parts In-Stock

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2,796

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Anansix

USA . 1,480 parts In-Stock

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1,480

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 354 parts In-Stock

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$0.744

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$0.670

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354

$0.744

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$0.670

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MKK Technologies

India . 347 parts In-Stock

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$1.400

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347

$1.400

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DigiPath Technology Company

USA . 347 parts In-Stock

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$1.400

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347

$1.400

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$1.417

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$1.289

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$1.162

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50

$1.417

$1.289

$1.162

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AZTECH Wire

Italy . 405 parts In-Stock

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$12.070

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405

$12.070

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Alle Elektronik GmbH

Germany . 4,230 parts In-Stock

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Corphita

USA . 2,351 parts In-Stock

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Parana Technologies

USA . 1,654 parts In-Stock

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$0.890

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$0.890

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Microchip USA

USA . 202 parts In-Stock

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Overview

Unlock unparalleled performance with the SCTH50N120-7 from STMicroelectronics, your go-to solution in Power FET technology. Designed for superior switching capabilities, this N-channel transistor ensures exceptional efficiency and reliability for demanding applications. With a robust 1200V breakdown voltage and impressive thermal management, it thrives in harsh conditions. Trust STMicroelectronics, a leader in innovation, to deliver quality that drives your projects forward effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package ensures durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel technology typically offers lower on-resistance and higher efficiency compared to P-channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in improving performance during switching applications, reducing component count.

Transistor Application: SWITCHING

Designed for switching applications, this transistor enables efficient control of power in circuits.

Surface Mount: YES

Surface mount capability allows for more compact designs and automated assembly processes.

Minimum DS Breakdown Voltage: 1200 V

A high breakdown voltage of 1200 V ensures reliability and safety in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape aids in space optimization on PCB layouts, facilitating compact design.

Terminal Form: GULL WING

Gull wing leads provide excellent mechanical stability and facilitate easy soldering on PCBs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower gate drive requirements, enhancing efficiency.

Maximum Pulsed Drain Current (IDM): 130 A

A maximum pulsed drain current of 130 A supports high power transient conditions, making it suitable for demanding applications.

No. of Terminals: 7

The 7-terminal design allows for versatile circuit connectivity and functionality in various applications.

Maximum Power Dissipation (Abs): 270 W

With a power dissipation capability of 270 W, this FET can handle substantial heat without compromising performance.

Package Style (Meter): SMALL OUTLINE

Small outline packaging contributes to reduced footprint on PCB while maintaining thermal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables lower power losses and faster switching speeds compared to other transistor technologies.

Maximum Operating Temperature: 175 °C

Operating at high temperatures (up to 175 °C) allows for use in extreme environments without reliability concerns.

Transistor Element Material: SILICON CARBIDE

Silicon carbide construction provides superior thermal conductivity and high voltage tolerance, enhancing overall performance.

Minimum Operating Temperature: -55 °C

The wide operating temperature range (-55 °C to 175 °C) ensures reliability in varied environmental conditions.

Maximum Drain Current (ID): 65 A

A maximum drain current rating of 65 A allows for significant load control in power applications.

Maximum Drain-Source On Resistance: 0.069 ohm

Low on resistance minimizes power losses during operation, enhancing energy efficiency.

Terminal Position: SINGLE

Single terminal positioning simplifies circuit design and layout, making integration easier.

Case Connection: DRAIN

Direct connection to the drain ensures optimal coupling and minimizes parasitic effects in the circuit.

Maximum Feedback Capacitance (Crss): 30 pF

Low feedback capacitance supports high-speed switching, critical for applications requiring rapid signal changes.

Technical Specifications

Power Field Effect Transistors (FET) SCTH50N120-7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

BULK: 1000

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.069 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

30 pF

JESD-30 Code:

R-PSSO-G7

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

130 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

SCTH50N120-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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