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NAND256W3A2BN6E

STMicroelectronics

NAND256W3A2BN6E by STMicroelectronics

STMicroelectronics NAND256W3A2BN6E is a 32MX8 SLC NAND flash memory with 2K sectors and 512-word page size. Operating at 3V, it offers industrial-grade temperature range of -40 to 85°C. Suitable for applications requiring high memory density and fast access times in compact designs.

Median Price

$3.424

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.311

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.311

-

-

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Vyrian

USA . 5,802 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

5,802

-

-

-

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Digiode

USA . 5,635 parts In-Stock

1+ parts

-

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5,635

-

-

-

-

Chip Stock

USA . 4,645 parts In-Stock

1+ parts

-

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4,645

-

-

-

-

Dynamic Solutions

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,000

-

-

-

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Cyclops Electronics Ltd

UK . 510 parts In-Stock

1+ parts

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510

-

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Anansix

USA . 254 parts In-Stock

1+ parts

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254

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Martec Srl

Italy . 218 parts In-Stock

1+ parts

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218

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Quantum Digital Technology

USA . 196 parts In-Stock

1+ parts

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196

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PC Components Company LLC

USA . 54 parts In-Stock

1+ parts

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54

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Bristol Electronics

USA . 36 parts In-Stock

1+ parts

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36

-

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Component Sense

UK . 11 parts In-Stock

1+ parts

-

100+ parts

$4.537

1k+ parts

$4.537

10k+ parts

$4.537

11

-

$4.537

$4.537

$4.537

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 88 parts In-Stock

1+ parts

$2.311

100+ parts

$2.195

1k+ parts

$2.086

10k+ parts

$2.057

88

$2.311

$2.195

$2.086

$2.057

Continental Prestige Electronics

USA . 4,365 parts In-Stock

1+ parts

$2.311

100+ parts

-

1k+ parts

-

10k+ parts

$2.265

4,365

$2.311

-

-

$2.265

Argo Parts USA

USA . 2,545 parts In-Stock

1+ parts

$2.311

100+ parts

-

1k+ parts

-

10k+ parts

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2,545

$2.311

-

-

-

Semicontronic

India . 1,100 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

10k+ parts

-

1,100

$3.000

$2.925

$2.910

-

Aztec Data Supply Inc.

USA . 1,285 parts In-Stock

1+ parts

$3.041

100+ parts

-

1k+ parts

-

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1,285

$3.041

-

-

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Corohmni

South Africa . 243 parts In-Stock

1+ parts

$3.656

100+ parts

-

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243

$3.656

-

-

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IDEA Electronic Components Group

UK . 1,258 parts In-Stock

1+ parts

$5.103

100+ parts

-

1k+ parts

$4.593

10k+ parts

-

1,258

$5.103

-

$4.593

-

AZTECH Wire

Italy . 354 parts In-Stock

1+ parts

$5.520

100+ parts

-

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-

10k+ parts

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354

$5.520

-

-

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Microchip USA

USA . 7,868 parts In-Stock

1+ parts

$6.120

100+ parts

$6.083

1k+ parts

$6.083

10k+ parts

$6.083

7,868

$6.120

$6.083

$6.083

$6.083

MKK Technologies

India . 81 parts In-Stock

1+ parts

$9.596

100+ parts

-

1k+ parts

-

10k+ parts

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81

$9.596

-

-

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DigiPath Technology Company

USA . 81 parts In-Stock

1+ parts

$9.596

100+ parts

-

1k+ parts

-

10k+ parts

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81

$9.596

-

-

-

Component Stockers USA

USA . 291 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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291

$99.990

-

-

-

RC Electronics

USA . 35,312 parts In-Stock

1+ parts

-

100+ parts

$2.360

1k+ parts

$2.150

10k+ parts

$2.090

35,312

-

$2.360

$2.150

$2.090

QUARKTWIN TECHNOLOGY LTD

USA . 23,472 parts In-Stock

1+ parts

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23,472

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Kepictronics

USA . 15,637 parts In-Stock

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15,637

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Perfect Parts

USA . 15,388 parts In-Stock

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15,388

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Corphita

USA . 4,603 parts In-Stock

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4,603

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Metaverse IC Inc.

Canada . 3,395 parts In-Stock

1+ parts

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3,395

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-

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

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3,000

-

-

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S.R.D Solutions

India . 3,000 parts In-Stock

1+ parts

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3,000

-

-

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Futuretech Components

Singapore . 2,500 parts In-Stock

1+ parts

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2,500

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Parana Technologies

USA . 2,137 parts In-Stock

1+ parts

-

100+ parts

$6.102

1k+ parts

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2,137

-

$6.102

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

-

-

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Infinite Electronics LLP (Excess)

. 396 parts In-Stock

1+ parts

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100+ parts

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396

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Ashlea Components Ltd (Excess)

UK . 88 parts In-Stock

1+ parts

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100+ parts

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88

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Component Connect

USA . 88 parts In-Stock

1+ parts

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100+ parts

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88

-

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Computer Components Inc. - USA

USA . 3 parts In-Stock

1+ parts

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3

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-

Overview

Experience the cutting-edge technology of STMicroelectronics with the NAND256W3A2BN6E Flash Memory. With a powerful memory density of 268435456 bits and reliable CMOS technology, this SLC NAND Type memory offers unparalleled performance for industrial applications. Its compact design and low power consumption make it perfect for embedded systems, IoT devices, and automotive electronics. Trust in STMicroelectronics to provide high-quality components that deliver exceptional value and efficiency to meet your project's demands. Elevate your design with the NAND256W3A2BN6E and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the flash memory, making it a reliable choice for storage needs.

Surface Mount: YES

The ability to be surface mounted allows for easy installation and integration into a variety of electronic devices.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, saving space within the device for other components.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexibility in data transfer, enhancing the efficiency of the flash memory.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of electronic devices.

Power Supplies (V): 3/3.3

The availability of multiple power supply options gives flexibility in powering the flash memory, making it versatile for various applications.

No. of Terminals: 48

The high number of terminals provides multiple connection points, ensuring stable and secure data transfer.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small and thin profile of the package style allows for easy integration into compact devices without sacrificing performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this flash memory can withstand harsh environmental conditions without compromising functionality.

Organization: 32MX8

The specific organization of 32 megabits by 8 bits allows for efficient data storage and retrieval, optimizing performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold conditions.

No. of Sectors/Size: 2K

The presence of multiple sectors with a size of 2K allows for efficient data organization and management within the flash memory.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and connection options, enhancing usability.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2 mm allows for easy placement within a device, optimizing space utilization.

Width: 12 mm

The compact width of 12 mm enables the flash memory to fit into tight spaces while maintaining high performance.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage ensures energy efficiency and compatibility with a range of power sources.

Technical Specifications

Flash Memory NAND256W3A2BN6E attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

12000 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3/e6

Length:

18.4 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

2K

No. of Terminals:

48

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Page Size (words):

512

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

16K

Maximum Standby Current:

.00005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

NO

Type:

SLC NAND TYPE

Width:

12 mm

Trade Compliance

NAND256W3A2BN6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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