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NAND256W3A2BN6E

Micron Technology

NAND256W3A2BN6E by Micron Technology

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;

Median Price

$3.424

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.311

100+ parts

-

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100

$2.311

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Vyrian

USA . 5,802 parts In-Stock

1+ parts

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5,802

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Digiode

USA . 5,635 parts In-Stock

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5,635

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Chip Stock

USA . 4,645 parts In-Stock

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4,645

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Dynamic Solutions

Germany . 4,000 parts In-Stock

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4,000

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Cyclops Electronics Ltd

UK . 510 parts In-Stock

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510

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Anansix

USA . 254 parts In-Stock

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Martec Srl

Italy . 218 parts In-Stock

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Quantum Digital Technology

USA . 196 parts In-Stock

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PC Components Company LLC

USA . 54 parts In-Stock

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Bristol Electronics

USA . 36 parts In-Stock

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36

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Component Sense

UK . 11 parts In-Stock

1+ parts

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100+ parts

$4.537

1k+ parts

$4.537

10k+ parts

$4.537

11

-

$4.537

$4.537

$4.537

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 88 parts In-Stock

1+ parts

$2.311

100+ parts

$2.195

1k+ parts

$2.086

10k+ parts

$2.057

88

$2.311

$2.195

$2.086

$2.057

Continental Prestige Electronics

USA . 4,365 parts In-Stock

1+ parts

$2.311

100+ parts

-

1k+ parts

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10k+ parts

$2.265

4,365

$2.311

-

-

$2.265

Argo Parts USA

USA . 2,545 parts In-Stock

1+ parts

$2.311

100+ parts

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2,545

$2.311

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Semicontronic

India . 1,100 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

10k+ parts

-

1,100

$3.000

$2.925

$2.910

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Aztec Data Supply Inc.

USA . 1,285 parts In-Stock

1+ parts

$3.041

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1,285

$3.041

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Corohmni

South Africa . 243 parts In-Stock

1+ parts

$3.656

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243

$3.656

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IDEA Electronic Components Group

UK . 1,258 parts In-Stock

1+ parts

$5.103

100+ parts

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$4.593

10k+ parts

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1,258

$5.103

-

$4.593

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AZTECH Wire

Italy . 354 parts In-Stock

1+ parts

$5.520

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354

$5.520

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Microchip USA

USA . 7,868 parts In-Stock

1+ parts

$6.120

100+ parts

$6.083

1k+ parts

$6.083

10k+ parts

$6.083

7,868

$6.120

$6.083

$6.083

$6.083

MKK Technologies

India . 81 parts In-Stock

1+ parts

$9.596

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81

$9.596

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DigiPath Technology Company

USA . 81 parts In-Stock

1+ parts

$9.596

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81

$9.596

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Component Stockers USA

USA . 291 parts In-Stock

1+ parts

$99.990

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291

$99.990

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RC Electronics

USA . 35,312 parts In-Stock

1+ parts

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100+ parts

$2.360

1k+ parts

$2.150

10k+ parts

$2.090

35,312

-

$2.360

$2.150

$2.090

QUARKTWIN TECHNOLOGY LTD

USA . 23,472 parts In-Stock

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Kepictronics

USA . 15,637 parts In-Stock

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Perfect Parts

USA . 15,388 parts In-Stock

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Corphita

USA . 4,603 parts In-Stock

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Metaverse IC Inc.

Canada . 3,395 parts In-Stock

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3,395

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 2,137 parts In-Stock

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$6.102

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Infinite Electronics LLP (Excess)

. 396 parts In-Stock

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396

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Ashlea Components Ltd (Excess)

UK . 88 parts In-Stock

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88

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Component Connect

USA . 88 parts In-Stock

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88

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Computer Components Inc. - USA

USA . 3 parts In-Stock

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3

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Technical Specifications

Flash Memory NAND256W3A2BN6E attributes and parameters. Explore more Flash Memory devices from Micron Technology

Specs

Maximum Access Time:

35 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Sectors/Size:

2K

No. of Terminals:

48

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Page Size (words):

512

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

16K

Maximum Standby Current:

.00005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Toggle Bit:

NO

Type:

SLC NAND TYPE

Width:

12 mm

Trade Compliance

NAND256W3A2BN6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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