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MP23AB01DM

STMicroelectronics

MP23AB01DM by STMicroelectronics

MP23AB01DM by STMicroelectronics is a compact consumer IC designed for industrial applications, operating b/w -40 °C and 85 °C. It features a rectangular chip carrier package with 4 terminals and supports supply voltages from 2.1V to 3.6V. Ideal for space-constrained designs, it measures just 2.5mm x 3.35mm with a max height of 1.08mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

8,595

-

-

-

-

Anansix

USA . 2,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,370

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-

-

-

Digiode

USA . 1,387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,387

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 969 parts In-Stock

1+ parts

$1.414

100+ parts

-

1k+ parts

$1.273

10k+ parts

-

969

$1.414

-

$1.273

-

MKK Technologies

India . 1,232 parts In-Stock

1+ parts

$2.659

100+ parts

-

1k+ parts

-

10k+ parts

-

1,232

$2.659

-

-

-

DigiPath Technology Company

USA . 1,232 parts In-Stock

1+ parts

$2.659

100+ parts

-

1k+ parts

-

10k+ parts

-

1,232

$2.659

-

-

-

AZTECH Wire

Italy . 168 parts In-Stock

1+ parts

$13.220

100+ parts

-

1k+ parts

-

10k+ parts

-

168

$13.220

-

-

-

Component Stockers USA

USA . 307 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

307

$99.990

-

-

-

Futuretech Components

Singapore . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,000

-

-

-

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Corphita

USA . 1,603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,603

-

-

-

-

Parana Technologies

USA . 646 parts In-Stock

1+ parts

-

100+ parts

$1.691

1k+ parts

-

10k+ parts

-

646

-

$1.691

-

-

Overview

Unlock exceptional audio experiences with the MP23AB01DM from STMicroelectronics, a leader in high-quality semiconductor solutions. This compact and robust consumer IC delivers remarkable performance across a wide range of applications, from portable devices to smart home systems. With its temperature resilience and advanced design, enjoy reliability and efficiency that elevate your products, ensuring you can meet customer demands while staying ahead in innovation!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller and more efficient circuit designs, making this product suitable for compact applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a streamlined footprint, enabling efficient space utilization on PCB layouts.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and optimized performance in everyday devices.

No. of Terminals: 4

With four terminals, this IC offers a simple yet effective configuration for various consumer electronics designs.

Package Style (Meter): CHIP CARRIER

The chip carrier style ensures easy handling and placement, enhancing manufacturing efficiency.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, this IC is robust and reliable for demanding environments.

Minimum Operating Temperature: -40 °C

This wide temperature range guarantees reliable operation in extreme conditions, making it suitable for industrial applications.

Terminal Position: BOTTOM

Bottom-terminal placement optimizes space on the PCB and improves electrical performance through reduced lead inductance.

Maximum Seated Height: 1.08 mm

A low seated height allows for a slim profile, essential for modern, space-constrained electronic designs.

Width: 2.5 mm

Narrow width facilitates integration into tight spaces, making it ideal for portable consumer electronics.

Minimum Supply Voltage (Vsup): 2.1 V

Low minimum supply voltage allows for battery-operated devices, extending battery life and efficiency.

Length: 3.35 mm

Compact length contributes to overall design flexibility, supporting various layout configurations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and longevity in a wide range of environments.

Terminal Form: NO LEAD

No lead design enhances reliability and reduces the risk of mechanical failure, providing a more robust product.

Maximum Supply Voltage (Vsup): 3.6 V

A reasonable maximum supply voltage allows for flexibility in power supply design while maintaining efficient performance.

Technical Specifications

Other Function Consumer ICs MP23AB01DM attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-XBCC-N4

Length:

3.35 mm

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

1.08 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

2.5 mm

Trade Compliance

MP23AB01DM General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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