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MP23AB01DH

STMicroelectronics

MP23AB01DH by STMicroelectronics

MP23AB01DH by STMicroelectronics is a compact consumer IC designed for industrial applications, operating b/w -40 °C and 85 °C. It features a rectangular chip carrier package with 4 terminals and supports supply voltages from 2.3V to 3.6V. Ideal for space-constrained designs, it measures just 2.5mm x 3.35mm with a max height of 1.08mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,043 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,043

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-

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Digiode

USA . 2,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,986

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-

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Anansix

USA . 2,259 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,259

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 374 parts In-Stock

1+ parts

$1.194

100+ parts

-

1k+ parts

$1.075

10k+ parts

-

374

$1.194

-

$1.075

-

MKK Technologies

India . 441 parts In-Stock

1+ parts

$2.246

100+ parts

-

1k+ parts

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10k+ parts

-

441

$2.246

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DigiPath Technology Company

USA . 441 parts In-Stock

1+ parts

$2.246

100+ parts

-

1k+ parts

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10k+ parts

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441

$2.246

-

-

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Corphita

USA . 3,732 parts In-Stock

1+ parts

-

100+ parts

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3,732

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Parana Technologies

USA . 1,680 parts In-Stock

1+ parts

-

100+ parts

$1.428

1k+ parts

-

10k+ parts

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1,680

-

$1.428

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Overview

Unlock superior audio performance with the MP23AB01DH from STMicroelectronics, a leader in innovative semiconductor solutions. This compact, surface-mount consumer circuit is designed for diverse applications, delivering exceptional sound quality while ensuring reliability in demanding environments. With a temperature range of -40 °C to 85 °C, you can trust its durability. Elevate your projects with this versatile IC and experience unmatched value and efficiency!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for efficient integration into compact electronic designs, optimizing space and improving manufacturability.

Package Shape: RECTANGULAR

The rectangular package shape is versatile, enabling easy placement on printed circuit boards (PCBs) and accommodating various circuit layouts.

General IC Type: CONSUMER CIRCUIT

Designed specifically as a consumer circuit, this IC is tailored for applications in everyday electronic devices, ensuring relevance in consumer markets.

No. of Terminals: 4

Having 4 terminals simplifies connection, making it easier to integrate into circuits while maintaining a compact footprint.

Package Style (Meter): CHIP CARRIER

The chip carrier style provides robustness and durability, making it suitable for a variety of industrial applications where reliability is critical.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is capable of functioning in high-temperature environments, enhancing its versatility.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows this product to perform reliably in extreme cold conditions, suitable for outdoor and industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning ensures optimal contact and better thermal management, which is crucial for maintaining performance in compact spaces.

Maximum Seated Height: 1.08 mm

A low maximum seated height of 1.08 mm makes this product ideal for space-constrained applications, allowing for slim design profiles.

Width: 2.5 mm

A width of 2.5 mm facilitates integration into tight layouts without sacrificing electrical performance or reliability.

Minimum Supply Voltage (Vsup): 2.3 V

Operating down to 2.3 V allows flexibility in power supply choices, accommodating battery-operated and low-power applications.

Length: 3.35 mm

A length of 3.35 mm contributes to a compact design, ideal for miniaturized circuits where space and size are essential.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh conditions, making it suitable for various industrial applications.

Terminal Form: NO LEAD

No lead terminals promote a cleaner factory environment and simplify assembly processes, benefiting manufacturers and end-users alike.

Maximum Supply Voltage (Vsup): 3.6 V

With a supply voltage range up to 3.6 V, this IC supports higher performance without compromising energy efficiency, ideal for modern consumer electronics.

Technical Specifications

Other Function Consumer ICs MP23AB01DH attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-XBCC-N4

Length:

3.35 mm

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

1.08 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

2.5 mm

Trade Compliance

MP23AB01DH General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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