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MP23AB01DHTR

STMicroelectronics

MP23AB01DHTR by STMicroelectronics

MP23AB01DHTR by STMicroelectronics is a compact consumer IC designed for industrial applications, operating b/w -40 °C and 85 °C. It features a rectangular chip carrier package with 4 terminals and supports supply voltages from 2.3V to 3.6V. Ideal for space-constrained designs, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,729 parts In-Stock

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6,729

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Digiode

USA . 3,322 parts In-Stock

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3,322

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Anansix

USA . 2,018 parts In-Stock

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2,018

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$0.208

100+ parts

$0.189

1k+ parts

$0.171

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-

200

$0.208

$0.189

$0.171

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IDEA Electronic Components Group

UK . 788 parts In-Stock

1+ parts

$2.113

100+ parts

-

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$1.902

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788

$2.113

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$1.902

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MKK Technologies

India . 79 parts In-Stock

1+ parts

$3.974

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79

$3.974

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DigiPath Technology Company

USA . 79 parts In-Stock

1+ parts

$3.974

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79

$3.974

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AZTECH Wire

Italy . 275 parts In-Stock

1+ parts

$17.400

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275

$17.400

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Legend Electronics Inc. (Excess)

USA . 100,300 parts In-Stock

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Perfect Parts

USA . 22,400 parts In-Stock

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22,400

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QUARKTWIN TECHNOLOGY LTD

USA . 18,039 parts In-Stock

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18,039

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Futuretech Components

Singapore . 4,042 parts In-Stock

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4,042

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Corphita

USA . 1,356 parts In-Stock

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1,356

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Parana Technologies

USA . 1,113 parts In-Stock

1+ parts

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100+ parts

$2.527

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1,113

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$2.527

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Kepictronics

USA . 98 parts In-Stock

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98

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Overview

Unlock the potential of your projects with the MP23AB01DHTR from STMicroelectronics. Renowned for its quality and innovation, STMicroelectronics delivers a versatile consumer integrated circuit that excels in diverse applications, from industrial sensors to smart devices. With a robust design operating in extreme temperatures, the MP23AB01DHTR ensures reliability and efficiency, allowing you to create cutting-edge solutions that stand out in today’s competitive market.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic devices, making it ideal for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape ensures efficient use of circuit board space and simplifies layout design.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, it is optimized for common electronic applications, providing reliability and performance.

No. of Terminals: 4

With only 4 terminals, the IC minimizes complexity in the circuit design while maintaining essential functionalities.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for better thermal management and surface mount compatibility.

Maximum Operating Temperature: 85 °C

Capable of operating at up to 85 °C, this IC is suitable for a wide range of consumer applications, even in warmer environments.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C ensures reliable performance in harsh environmental conditions.

Terminal Position: BOTTOM

Bottom terminal positioning allows for direct soldering onto the PCB, which can improve electrical performance and thermal dissipation.

Maximum Seated Height: 1.08 mm

A low seated height enables this IC to fit into ultra-thin devices, enhancing design flexibility.

Width: 2.5 mm

A compact width helps optimize board space, making it suitable for miniature electronic devices.

Minimum Supply Voltage (Vsup): 2.3 V

With a low minimum supply voltage, the IC is perfect for battery-operated devices where power conservation is critical.

Length: 3.35 mm

Its small length further contributes to space savings on the PCB, allowing for more design options in densely populated boards.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this IC is built to withstand more demanding environments, ensuring durability and longevity.

Terminal Form: NO LEAD

The no lead design reduces the risk of solder joint failure and contributes to better reliability in manufacturing and operation.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V allows for compatibility with a wide range of power sources, enhancing versatility.

Technical Specifications

Other Function Consumer ICs MP23AB01DHTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-XBCC-N4

Length:

3.35 mm

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

1.08 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

2.5 mm

Trade Compliance

MP23AB01DHTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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