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M95M01-RMW6TG

STMicroelectronics

M95M01-RMW6TG by STMicroelectronics

M95M01-RMW6TG by STMicroelectronics is an EEPROM with 128KX8 organization, SPI serial bus type, and 1000000 write/erase cycles endurance. It operates at a max clock frequency of 5 MHz and has a memory density of 1048576 bit. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact small outline package.

Median Price

$0.703

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,008 parts In-Stock

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7,008

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Anansix

USA . 2,339 parts In-Stock

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2,339

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Digiode

USA . 1,291 parts In-Stock

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1,291

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M&R Communications

USA . 1,246 parts In-Stock

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1,246

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A2Z Electronics, Inc.

USA . 773 parts In-Stock

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773

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Bristol Electronics

USA . 748 parts In-Stock

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$0.703

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$0.487

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748

-

$0.703

$0.487

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

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650

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Semtec, LLC

USA . 58 parts In-Stock

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58

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,262 parts In-Stock

1+ parts

$2.892

100+ parts

-

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1,262

$2.892

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$2.916

100+ parts

-

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$2.625

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2,087

$2.916

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$2.625

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Corohmni

South Africa . 378 parts In-Stock

1+ parts

$5.174

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378

$5.174

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MKK Technologies

India . 1,194 parts In-Stock

1+ parts

$5.484

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1,194

$5.484

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DigiPath Technology Company

USA . 1,194 parts In-Stock

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$5.484

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$5.484

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Microchip USA

USA . 165 parts In-Stock

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$6.824

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165

$6.824

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AZTECH Wire

Italy . 771 parts In-Stock

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$13.298

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771

$13.298

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Ampacity Inc.

Singapore . 1,277 parts In-Stock

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$16.000

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Perfect Parts

USA . 7,840 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,500 parts In-Stock

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Argo Parts USA

USA . 2,932 parts In-Stock

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Continental Prestige Electronics

USA . 2,059 parts In-Stock

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Corphita

USA . 1,095 parts In-Stock

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1,095

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Parana Technologies

USA . 938 parts In-Stock

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$3.487

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938

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$3.487

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock unparalleled quality and reliability with the M95M01-RMW6TG EEPROM by STMicroelectronics. As a leader in semiconductor manufacturing, STMicroelectronics delivers cutting-edge technology that guarantees optimal performance and durability. Ideal for a wide range of applications, this EEPROM offers seamless data storage solutions with easy hardware/software write protection and a high endurance of 1,000,000 write/erase cycles. Experience the value and benefits of this product, providing customers with exceptional functionality and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the EEPROM, making it suitable for various environments.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and more efficient communication with other devices in the system.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage ensures stable and reliable performance of the EEPROM.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this EEPROM can withstand high temperature environments.

Write Protection: HARDWARE/SOFTWARE

The option for hardware/software write protection adds an extra layer of security to the data stored in the EEPROM.

Maximum Clock Frequency (fCLK): 5 MHz

The high clock frequency of 5 MHz enables fast data transfer and communication speeds with other components in the system.

Endurance: 1000000 Write/Erase Cycles

With a high endurance of 1 million write/erase cycles, this EEPROM has a long lifespan and can handle frequent data read/write operations.

Memory Density: 1048576 bit

The EEPROM has a high memory density of 1048576 bits, allowing for storage of large amounts of data in a compact package.

Technical Specifications

EEPROM M95M01-RMW6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000003 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95M01-RMW6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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