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M95M04-DWDW3TP/V

STMicroelectronics

M95M04-DWDW3TP/V by STMicroelectronics

STMicroelectronics' M95M04-DWDW3TP/V is an EEPROM with 512KX8 organization, operating at 10 MHz clock frequency. It has a supply voltage range of 2.9V to 5.5V and offers 1000000 Write/Erase cycles endurance. Ideal for automotive applications due to AEC-Q100 screening level and small form factor (4.4mm x 3mm).

Median Price

$4.782

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,642 parts In-Stock

1+ parts

$5.910

100+ parts

$5.090

1k+ parts

$4.690

10k+ parts

$4.140

4,642

$5.910

$5.090

$4.690

$4.140

Avnet

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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4,000

-

-

-

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DigiKey

USA . 3,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$4.448

3,048

-

-

-

$4.448

RS (Exports)

UK . 148 parts In-Stock

1+ parts

-

100+ parts

$4.782

1k+ parts

$4.332

10k+ parts

-

148

-

$4.782

$4.332

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$4.128

100+ parts

-

1k+ parts

-

10k+ parts

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150

$4.128

-

-

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Digiode

USA . 228 parts In-Stock

1+ parts

$4.997

100+ parts

-

1k+ parts

-

10k+ parts

-

228

$4.997

-

-

-

Vyrian

USA . 2,404 parts In-Stock

1+ parts

-

100+ parts

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2,404

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Anansix

USA . 1,037 parts In-Stock

1+ parts

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1,037

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,033 parts In-Stock

1+ parts

$3.616

100+ parts

-

1k+ parts

$3.254

10k+ parts

-

1,033

$3.616

-

$3.254

-

Ampacity Inc.

Singapore . 2,460 parts In-Stock

1+ parts

$4.060

100+ parts

-

1k+ parts

-

10k+ parts

-

2,460

$4.060

-

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Argo Parts USA

USA . 3,176 parts In-Stock

1+ parts

$4.128

100+ parts

-

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3,176

$4.128

-

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Continental Prestige Electronics

USA . 2,276 parts In-Stock

1+ parts

$4.128

100+ parts

-

1k+ parts

-

10k+ parts

$4.046

2,276

$4.128

-

-

$4.046

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.128

100+ parts

-

1k+ parts

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1,000

$4.128

-

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Corphita

USA . 2,371 parts In-Stock

1+ parts

$4.734

100+ parts

-

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2,371

$4.734

-

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MKK Technologies

India . 1,258 parts In-Stock

1+ parts

$6.799

100+ parts

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1k+ parts

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1,258

$6.799

-

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DigiPath Technology Company

USA . 1,258 parts In-Stock

1+ parts

$6.799

100+ parts

-

1k+ parts

-

10k+ parts

-

1,258

$6.799

-

-

-

Microchip USA

USA . 6,309 parts In-Stock

1+ parts

$26.540

100+ parts

$26.380

1k+ parts

$26.300

10k+ parts

$26.220

6,309

$26.540

$26.380

$26.300

$26.220

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,000

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Parana Technologies

USA . 433 parts In-Stock

1+ parts

-

100+ parts

$4.323

1k+ parts

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10k+ parts

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433

-

$4.323

-

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Overview

Unlock a world of possibilities with the M95M04-DWDW3TP/V EEPROM by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality products that are designed to exceed expectations. This versatile EEPROM is perfect for a wide range of applications, offering reliable performance and durability. Experience the value and benefits of this product firsthand, whether you're looking to enhance your electronics or streamline your operations. Trust STMicroelectronics to provide cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides a durable and cost-effective solution for the EEPROM.

Surface Mount: YES

The surface mount capability allows for easy integration into PCBs, saving space and simplifying the assembly process.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this EEPROM ideal for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard PCB layouts, making installation hassle-free.

Operating Mode: SYNCHRONOUS

The synchronous operation mode allows for efficient data transfer, enhancing overall performance.

Nominal Supply Voltage: 3.6V

The 3.6V supply voltage provides a stable power source for reliable operation of the EEPROM.

No. of Terminals: 8

With 8 terminals, this EEPROM offers versatile connectivity options for diverse applications.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style minimizes space requirements, perfect for compact designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in a range of environmental conditions.

Organization: 512KX8

The 512KX8 organization allows for efficient data storage and retrieval, catering to various memory requirements.

Minimum Operating Temperature: -40 °C

The EEPROM's ability to operate at temperatures as low as -40°C ensures suitability for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and connection options for enhanced usability.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2mm, this EEPROM can fit into tight spaces without compromising performance.

Maximum Clock Frequency: 10 MHz

The high maximum clock frequency allows for fast data transfer speeds, improving overall system efficiency.

Width: 3 mm

The compact 3mm width of the EEPROM contributes to space-saving and efficient PCB layout designs.

Minimum Supply Voltage: 2.9V

The 2.9V minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature: 30s

The EEPROM can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering during assembly.

Peak Reflow Temperature: 260C

The peak reflow temperature of 260°C allows for effective soldering processes without damaging the EEPROM.

Length: 4.4 mm

The 4.4mm length of the EEPROM makes it suitable for compact electronic devices and applications.

Technology: CMOS

The CMOS technology used in this EEPROM offers low power consumption and high speed operation.

Parallel or Serial: SERIAL

The serial data transfer capability simplifies communication with the EEPROM, making it easier to interface with other components.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy installation during PCB assembly.

Maximum Supply Current: 3 mA

With a low maximum supply current of 3mA, this EEPROM helps conserve energy and reduce operating costs.

No. of Words: 524288 words

The EEPROM's storage capacity of 524,288 words allows for ample data storage and retrieval capabilities.

Memory Width: 8

The 8-bit memory width supports efficient data handling and processing.

Minimum Data Retention Time: 10

The minimum data retention time of 10 years ensures long-term data integrity and reliability.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density PCB layouts and compact design implementations.

No. of Words Code: 512K

The 512K words code indicates the EEPROM's substantial memory capacity for storing large amounts of data.

Maximum Supply Voltage: 5.5V

The high maximum supply voltage of 5.5V provides flexibility in power source compatibility for various applications.

Endurance: 1000000 Write/Erase Cycles

With an endurance of 1,000,000 write/erase cycles, this EEPROM offers robust data storage capabilities for frequent updates.

Serial Bus Type: SPI

The SPI serial bus type allows for simple and efficient communication with other devices, enhancing system integration.

Maximum Write Cycle Time: 4 ms

The fast maximum write cycle time of 4ms ensures quick data storage and retrieval operations.

Memory Density: 4194304 bit

The high memory density of 4,194,304 bits provides ample storage capacity for various applications.

Memory IC Type: EEPROM

As an EEPROM, this product offers non-volatile memory storage with reliable data retention capabilities.

Maximum Standby Current: 0.00003 Amp

The ultra-low maximum standby current consumption of 0.00003A helps minimize power usage in standby mode, ideal for energy-efficient designs.

Technical Specifications

EEPROM M95M04-DWDW3TP/V attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

10

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00003 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.9 V

Nominal Supply Voltage / Vsup (V):

3.6

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Maximum Write Cycle Time (tWC):

4 ms

Trade Compliance

M95M04-DWDW3TP/V Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.1

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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