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M95256-RMN6P

STMicroelectronics

M95256-RMN6P by STMicroelectronics

M95256-RMN6P by STMicroelectronics is a 32Kx8 EEPROM with a synchronous operating mode and SPI serial bus type. It operates b/w 1.8V to 5.5V, supports up to 2 MHz clock frequency, and offers hardware/software write protection. Ideal for industrial applications requiring reliable data retention at extreme temperatures (-40 °C to 85 °C).

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,174 parts In-Stock

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3,174

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Anansix

USA . 2,603 parts In-Stock

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2,603

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Cyclops Electronics Ltd

UK . 1,870 parts In-Stock

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1,870

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Digiode

USA . 360 parts In-Stock

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360

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IDEA Electronic Components Group

UK . 734 parts In-Stock

1+ parts

$2.734

100+ parts

-

1k+ parts

$2.461

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734

$2.734

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$2.461

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MKK Technologies

India . 2,160 parts In-Stock

1+ parts

$5.142

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$5.142

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DigiPath Technology Company

USA . 2,160 parts In-Stock

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$5.142

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2,160

$5.142

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AZTECH Wire

Italy . 804 parts In-Stock

1+ parts

$10.940

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804

$10.940

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Microchip USA

USA . 339 parts In-Stock

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$14.800

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339

$14.800

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A-Z Elektronik GmbH

Germany . 5,016 parts In-Stock

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Corphita

USA . 4,827 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,344 parts In-Stock

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Kepictronics

USA . 1,870 parts In-Stock

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1,870

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Parana Technologies

USA . 1,607 parts In-Stock

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$3.269

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$3.269

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Perfect Parts

USA . 1,253 parts In-Stock

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Overview

Unlock the potential of your designs with the M95256-RMN6P EEPROM from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This compact, high-performance memory offers exceptional reliability and endurance, ensuring data integrity in demanding environments. Ideal for consumer electronics, industrial applications, and automotive systems, its seamless synchronous operation and advanced write protection features empower you to create robust, efficient devices that stand out in today's competitive market. Experience the quality and versatility that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and resistance to environmental factors, ensuring the reliability of the EEPROM in various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient PCB layout, making it suitable for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space and facilitates easier integration into various electronic assemblies.

Operating Mode: SYNCHRONOUS

Synchronous operation offers higher data transfer rates and improved performance, making it suitable for applications requiring fast memory access.

Nominal Supply Voltage / Vsup: 2.5 V

Operating at 2.5 V ensures compatibility with low-voltage circuits, reducing power consumption in battery-operated devices.

Power Supplies (V): 2/5

The ability to operate at both 2 V and up to 5 V provides flexibility in design and easy integration with various systems.

No. of Terminals: 8

With 8 terminals, this EEPROM balances simple connectivity with adequate functionality for different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures minimal space usage on PCBs, allowing for more efficient designs and potentially lower production costs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows this EEPROM to function reliably in a range of industrial environments.

Organization: 32KX8

The 32K x 8 organization makes it suitable for a variety of data storage needs, providing sufficient capacity for many applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this EEPROM is well-suited for demanding environments, including automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and improves solderability for reliable connections.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and enhances connectivity options, contributing to easier integration.

Write Protection: HARDWARE/SOFTWARE

Dual write protection mechanisms ensure data integrity, safeguarding critical information from accidental overwrites.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75 mm helps in maintaining a slim profile for compact electronic devices.

Maximum Clock Frequency (fCLK): 2 MHz

With a maximum clock frequency of 2 MHz, this EEPROM supports high-speed data transfer, which is essential for performance-oriented applications.

Width: 3.9 mm

A width of 3.9 mm allows for tight spacing in designs, optimizing real estate on PCBs without sacrificing performance.

Minimum Supply Voltage (Vsup): 1.8 V

The ability to operate at a minimum supply voltage of 1.8 V extends its usability in low-power systems, enhancing battery life.

Length: 4.9 mm

The compact length of 4.9 mm is ideal for space-constrained designs, enabling integration into a variety of devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures that this EEPROM can withstand harsh operating conditions, making it reliable in various settings.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making it ideal for modern electronic devices.

Parallel or Serial: SERIAL

The serial communication simplifies connection requirements and is commonly used in various applications, ensuring wide compatibility.

Terminal Form: GULL WING

Gull wing terminals enhance the ease of soldering and provide a reliable connection, important for maintaining signal integrity.

Maximum Supply Current: 3 mA

A maximum supply current of only 3 mA implies low power consumption, making it suitable for battery-operated devices.

No. of Words: 32768 words

This high word count provides flexibility for data storage, accommodating a wide range of applications while ensuring ample space.

Memory Width: 8

An 8-bit memory width aligns well with standard data bus sizes, ensuring compatibility with many microcontrollers and processors.

Minimum Data Retention Time: 40 years

A minimum data retention time of 40 years ensures long-term reliability, essential for applications where data preservation is crucial.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch provides a balance between spacing and ease of soldering, ensuring compatibility with typical PCB designs.

No. of Words Code: 32K

A capacity of 32K words meets a variety of storage needs, making it highly versatile for different use cases.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, this EEPROM can be readily used in higher voltage circuits, enhancing design flexibility.

Endurance: 1000000 Write/Erase Cycles

High endurance ratings indicate that this EEPROM can withstand frequent updates, making it ideal for applications requiring regular data modification.

Serial Bus Type: SPI

The SPI serial bus type guarantees faster data transfer rates and simpler connection methods, enhancing overall system performance.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle times of 5 ms ensure quick data updates, important for time-sensitive applications.

Memory Density: 262144 bit

A high memory density of 262144 bits offers significant storage capability without increasing physical size, optimizing space on PCBs.

Memory IC Type: EEPROM

As an EEPROM type memory IC, it combines non-volatility with flexibility in programming, making it useful for a range of applications.

Maximum Standby Current: 0.000003 Amp

With a very low maximum standby current, this EEPROM is energy efficient, making it ideal for applications with extended battery life requirements.

Technical Specifications

EEPROM M95256-RMN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000003 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95256-RMN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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