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M74HC4852RM13TR

STMicroelectronics

M74HC4852RM13TR by STMicroelectronics

M74HC4852RM13TR by STMicroelectronics is a CMOS differential multiplexer with a 3V nominal voltage and operates b/w -55 °C to 125 °C. It features a max on-state resistance of 280Ω and supports up to 4 channels. Ideal for military applications, it offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,698 parts In-Stock

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8,698

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Digiode

USA . 3,491 parts In-Stock

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Anansix

USA . 2,811 parts In-Stock

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2,811

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Microchip USA

USA . 370 parts In-Stock

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$3.787

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370

$3.787

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IDEA Electronic Components Group

UK . 785 parts In-Stock

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$8.115

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$7.304

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785

$8.115

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$7.304

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AZTECH Wire

Italy . 128 parts In-Stock

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$9.040

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128

$9.040

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MKK Technologies

India . 1,250 parts In-Stock

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$15.260

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1,250

$15.260

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DigiPath Technology Company

USA . 1,250 parts In-Stock

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$15.260

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$15.260

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Corphita

USA . 4,138 parts In-Stock

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Parana Technologies

USA . 330 parts In-Stock

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$9.703

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Overview

Unlock unparalleled performance with the M74HC4852RM13TR from STMicroelectronics, a leader in innovation and reliability. This high-quality differential multiplexer is engineered for versatility, making it ideal for demanding applications across communications, automotive, and industrial sectors. With its robust temperature range and efficient power management, this component ensures seamless operation while boosting system efficiency. Trust in STMicroelectronics to elevate your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials enhance longevity and increase versatility in various applications.

Surface Mount: YES

Surface mount technology allows for higher density circuit designs and efficient use of board space.

Package Shape: RECTANGULAR

Rectangular shapes typically provide efficient layout options for PCB design.

Nominal Supply Voltage (Vsup): 3 V

Optimized for low-voltage operation, improving energy efficiency in portable devices.

Power Supplies (V): 2/6

Flexible voltage supply options accommodate a wide range of applications.

No. of Terminals: 16

Sufficient terminals offer versatile connection points for various input and output configurations.

Package Style (Meter): SMALL OUTLINE

Small outline packaging reduces footprint and allows for compact circuit designs.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliability in demanding environments.

Minimum Operating Temperature: -55 °C

Wide temperature tolerance makes the product suitable for extreme temperature conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Quality finish enhances conductivity and provides excellent corrosion resistance.

Terminal Position: DUAL

Dual terminal positions facilitate easier and more efficient PCB layout.

Maximum Seated Height: 1.75 mm

Low profile design promotes space savings on the circuit board.

Width: 3.9 mm

Compact width fits easily into tight spaces on modern PCBs.

Other IC type: DIFFERENTIAL MULTIPLEXER

Differential multiplexing allows for improved noise immunity and signal integrity.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage enhances compatibility with various low-power devices.

Maximum Time At Peak Reflow Temperature: 30 s

Optimized reflow time ensures minimal thermal stress on the component.

Peak Reflow Temperature: 260 °C

High reflow temperature capability supports a wide range of soldering processes.

Maximum On-state Resistance (Ron): 280 ohm

Lower on-state resistance minimizes power loss during operation, improving efficiency.

Maximum Switch-on Time: 90 ns

Fast switching increases overall system responsiveness and performance.

Length: 9.9 mm

Compact length allows for versatile placement on circuit boards.

Maximum Switch-off Time: 90 ns

Quick switch-off time enhances timing accuracy in signal applications.

Temperature Grade: MILITARY

Military grade specification guarantees robust performance in critical applications.

Maximum Supply Current (Isup): 0.04 mA

Ultra-low supply current contributes to energy savings and extended battery life.

No. of Channels: 4

Four channels provide flexibility to design complex switching configurations.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve reliability in assembly.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows compatibility with various PCB manufacturing processes.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reliability under normal handling conditions, making it suitable for various environments.

Maximum Supply Voltage (Vsup): 6 V

Broader supply voltage range provides flexibility in system design.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching prevents short circuits, enhancing system reliability.

Nominal On-state Resistance Match: 2 ohm

Tight on-state resistance matching improves signal fidelity across channels.

Technical Specifications

Multiplexers & Switches M74HC4852RM13TR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

16

Nominal On-state Resistance Match:

2 ohm

Maximum On-state Resistance (Ron):

280 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

90 ns

Maximum Switch-on Time:

90 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

M74HC4852RM13TR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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