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M74HC4851TTR

STMicroelectronics

M74HC4851TTR by STMicroelectronics

M74HC4851TTR by STMicroelectronics is an 8-channel CMOS multiplexer with a max supply voltage of 6V and low on-state resistance of 280Ω. It operates in extreme temps from -55 °C to 125 °C, making it ideal for military applications. Its compact design features a thin profile and gull-wing terminals for efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,592 parts In-Stock

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Digiode

USA . 2,230 parts In-Stock

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Anansix

USA . 1,043 parts In-Stock

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Semi Source

USA . 506 parts In-Stock

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IDEA Electronic Components Group

UK . 1,801 parts In-Stock

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$18.064

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$16.258

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$18.064

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$16.258

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AZTECH Wire

Italy . 1,054 parts In-Stock

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$18.280

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$18.280

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MKK Technologies

India . 853 parts In-Stock

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$33.969

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DigiPath Technology Company

USA . 853 parts In-Stock

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$33.969

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Component Stockers USA

USA . 710 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 19,732 parts In-Stock

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Perfect Parts

USA . 17,460 parts In-Stock

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Microchip USA

USA . 7,686 parts In-Stock

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Corphita

USA . 2,885 parts In-Stock

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Parana Technologies

USA . 37 parts In-Stock

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$21.598

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Overview

Unlock unparalleled performance with the M74HC4851TTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality multiplexer excels in demanding applications, offering exceptional reliability and efficiency in a compact design. Built to withstand extreme temperatures and featuring low power consumption, it ensures seamless operation across various electronics, enhancing your projects' value and longevity while simplifying integration. Choose ST for unmatched quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Being a surface mount component allows for compact design and easy integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCB and enhances layout flexibility.

Nominal Supply Voltage (Vsup): 3 V

A nominal supply voltage of 3 V is ideal for low-power applications, ensuring energy efficiency.

Power Supplies (V): 2/6

Supports a wide power supply range, providing versatility for various circuit requirements.

No. of Terminals: 16

With 16 terminals, this device can accommodate multiple connections, enhancing functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save space on the PCB while allowing for high-density designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in demanding environments.

Minimum Operating Temperature: -55 °C

The ability to function in low temperatures makes this product suitable for extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances conductivity and protects against oxidation, ensuring longevity.

Terminal Position: DUAL

Dual terminal positioning facilitates better signal integrity and can improve overall circuit performance.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for compact designs, allowing for better space management on PCBs.

Width: 4.4 mm

A narrow width enables the component to fit into tight spaces while maintaining functionality.

Other IC type: SINGLE-ENDED MULTIPLEXER

This single-ended configuration simplifies design while providing efficient switching capabilities.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2 V adds flexibility, allowing it to work in diverse electronic applications.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum peak reflow time of 40 seconds indicates compatibility with various PCB soldering processes.

Peak Reflow Temperature: 260 °C

The ability to withstand high peak reflow temperatures ensures robustness during manufacturing.

Maximum On-state Resistance (Ron): 280 ohm

Low on-state resistance improves signal quality and reduces power loss in applications.

Maximum Switch-on Time: 90 ns

Fast switch-on time enhances the circuit's responsiveness, making it suitable for high-speed applications.

Length: 5 mm

A compact length allows integration into space-constrained designs without compromising connectivity.

Maximum Switch-off Time: 90 ns

Fast switch-off time is crucial for preventing signal ghosting and ensuring precise circuit control.

Temperature Grade: MILITARY

A military-grade designation indicates high reliability and performance under extreme conditions.

Maximum Supply Current (Isup): 0.04 mA

Extremely low supply current contributes to the energy efficiency of the entire system.

No. of Channels: 8

With 8 channels, it allows for multiplexing multiple signals, enhancing its versatility in applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity for reliable performance.

Terminal Form: GULL WING

Gull wing terminals facilitate better soldering and mechanical stability on PCB mounts.

Terminal Pitch: 0.65 mm

A fine terminal pitch enables high-density designs, fitting more components in smaller spaces.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reasonable moisture resistance, allowing for reflow soldering without special handling.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6 V allows this component to be utilized in a variety of applications requiring higher voltage levels.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching mechanism minimizes short-circuit risks, ensuring safe operation.

Nominal On-state Resistance Match: 2 ohm

The close nominal on-state resistance match ensures consistent performance across multiple channels.

Technical Specifications

Multiplexers & Switches M74HC4851TTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal On-state Resistance Match:

2 ohm

Maximum On-state Resistance (Ron):

280 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

90 ns

Maximum Switch-on Time:

90 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4.4 mm

Trade Compliance

M74HC4851TTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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