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M74HC4094RM13TR

STMicroelectronics

M74HC4094RM13TR by STMicroelectronics

M74HC4094RM13TR by STMicroelectronics is an 8-bit digital shift register with a propagation delay of 300 ns. It operates at a supply voltage range of 2-6V and has a max frequency of 24 MHz. Ideal for military-grade applications, this CMOS technology-based IC features a small outline package with surface mount capability.

Median Price

$0.189

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 32 parts In-Stock

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$0.189

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32

$0.189

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Chip Stock

USA . 79,941 parts In-Stock

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Sensible Micro Corp

USA . 6,260 parts In-Stock

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Vyrian

USA . 5,820 parts In-Stock

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5,820

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J2 Sourcing AB

Sweden . 4,650 parts In-Stock

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4,650

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ComSIT Distribution GmbH

Germany . 2,290 parts In-Stock

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Anansix

USA . 2,205 parts In-Stock

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2,205

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Pegasus Components GmbH

Germany . 1,500 parts In-Stock

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Rebound Electronics

UK . 1,000 parts In-Stock

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Elcom Components

USA . 200 parts In-Stock

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200

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Digiode

USA . 183 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 155 parts In-Stock

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$2.505

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155

$2.505

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IDEA Electronic Components Group

UK . 293 parts In-Stock

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$11.392

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$10.253

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293

$11.392

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$10.253

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AZTECH Wire

Italy . 1,058 parts In-Stock

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$20.880

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$20.880

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MKK Technologies

India . 1,708 parts In-Stock

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$21.423

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$21.423

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DigiPath Technology Company

USA . 1,708 parts In-Stock

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$21.423

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Component Stockers USA

USA . 374 parts In-Stock

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$99.990

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374

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Perfect Parts

USA . 6,913 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,821 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,547 parts In-Stock

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Kepictronics

USA . 1,026 parts In-Stock

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Parana Technologies

USA . 930 parts In-Stock

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$13.621

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930

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Corphita

USA . 425 parts In-Stock

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Infinite Electronics LLP (Excess)

. 422 parts In-Stock

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Overview

Unlock the power of seamless digital data transfer with the M74HC4094RM13TR by STMicroelectronics. This top-of-the-line 8-bit digital shift register boasts unparalleled quality and reliability, thanks to the renowned manufacturer's cutting-edge technology and expertise. Ideal for a wide range of applications, this versatile component offers customers unmatched value and benefits. Experience faster, more efficient data processing and seamless integration like never before with the M74HC4094RM13TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the shift register, making it suitable for various environments.

No. of Bits: 8

Offers a sufficient number of bits for digital data storage and processing, suitable for many applications.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage that ensures reliable operation without drawing too much power.

Propagation Delay (tpd): 300 ns

Fast propagation delay ensures quick data transfer, important in time-sensitive applications.

Output Characteristics: 3-STATE

Allows the outputs to be in a high impedance state, providing flexibility in connecting multiple devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the shift register efficient and reliable.

Maximum Frequency At Nominal Supply: 24 MHz

Capable of handling high-frequency operations, suitable for applications requiring fast data processing.

Technical Specifications

Digital Shift Registers M74HC4094RM13TR attributes and parameters. Explore more Digital Shift Registers devices from STMicroelectronics

Specs

Additional Features:

PARALLEL OUTPUT IS LATCHED

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

24000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

NEGATIVE EDGE

Width:

3.9 mm

Minimum fmax:

24 MHz

Trade Compliance

M74HC4094RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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