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CD74ACT299MG4

Texas Instruments

CD74ACT299MG4 by Texas Instruments

CD74ACT299MG4 by Texas Instruments is an 8-bit digital shift register with a propagation delay of 14.5 ns and a max frequency of 90 MHz. It operates at a supply voltage range of 4.5V to 5.5V, making it suitable for military-grade applications requiring fast data shifting capabilities in compact electronic systems. The device features positive edge triggering and 3-state output characteristics, ideal for bidirectional count direction control in high-speed communication circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,742 parts In-Stock

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Digiode

USA . 1,425 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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AZTECH Wire

Italy . 828 parts In-Stock

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$18.629

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828

$18.629

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Semicontronic

India . 871 parts In-Stock

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$22.000

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$21.450

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$21.340

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871

$22.000

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$21.340

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Parana Technologies

USA . 1,739 parts In-Stock

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$24.540

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$25.207

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Corohmni

South Africa . 522 parts In-Stock

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$25.669

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522

$25.669

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ChromeModa Solutions

Germany . 1,016 parts In-Stock

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$27.573

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$22.610

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$27.573

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IDEA Electronic Components Group

UK . 874 parts In-Stock

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$27.573

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$26.194

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$24.816

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874

$27.573

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$24.816

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Ampacity Inc.

Singapore . 383 parts In-Stock

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$40.000

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One Stop Electronics

USA . 163 parts In-Stock

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$43.000

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Corphita

USA . 3,421 parts In-Stock

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Argo Parts USA

USA . 2,097 parts In-Stock

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DigiPath Technology Company

USA . 1,257 parts In-Stock

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$24.860

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 861 parts In-Stock

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861

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Overview

Enhance your digital shift register applications with the Texas Instruments CD74ACT299MG4. Manufactured with top-quality materials, this 8-bit shift register offers superb performance and reliability. With a wide operating temperature range and military-grade technology, this product ensures seamless operation in any environment. Experience fast propagation delay and true output polarity while enjoying the convenience of surface mount installation. Trust in Texas Instruments to deliver cutting-edge solutions for your electronics projects. Elevate your designs with the CD74ACT299MG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Bits: 8

Offers a sufficient capacity for controlling and storing digital information in various applications.

Propagation Delay (tpd): 14.5 ns

Provides fast processing speed, making it suitable for time-sensitive applications.

Maximum Operating Temperature: 125 °C

Can operate efficiently in high-temperature environments, increasing the versatility of the product.

Output Characteristics: 3-STATE

Allows for multiple output states, providing flexibility in controlling external devices or circuits.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity.

Technical Specifications

Digital Shift Registers CD74ACT299MG4 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

90000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

90 MHz

Trade Compliance

CD74ACT299MG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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