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M74HC4066RM13TR

STMicroelectronics

M74HC4066RM13TR by STMicroelectronics

M74HC4066RM13TR by STMicroelectronics is a CMOS SPST switch with 4 functions, ideal for signal routing in compact designs. It operates b/w 2V and 12V, features low on-state resistance of 170Ω, and withstands temperatures from -55 °C to 125 °C. Its small outline package ensures efficient space utilization in electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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Bristol Electronics

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Inventory MP

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ComSIT Distribution GmbH

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Mil-Aero Solutions, Inc.

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Resion

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Vyrian

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Cyclops Electronics Ltd

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Digiode

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Ashlea Components Ltd

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SIE Connect GmbH - GreenChips

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Electronic Expediters

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ACDS - Activité Composants Distribution Service

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Rebound Electronics

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PC Components Company LLC

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Anansix

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Martec Srl

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Microfarads

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Connector Distribution Corp

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Right Parts Inc.

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Corel Iberica Componentes, S.L.

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Prism Electronics

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Microchip USA

USA . 109 parts In-Stock

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IDEA Electronic Components Group

UK . 2,092 parts In-Stock

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AZTECH Wire

Italy . 431 parts In-Stock

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MKK Technologies

India . 1,616 parts In-Stock

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DigiPath Technology Company

USA . 1,616 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 425 parts In-Stock

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Overview

Unlock innovation with the M74HC4066RM13TR from STMicroelectronics, a trusted leader in semiconductor excellence. This versatile multiplexer/switch delivers unmatched performance and reliability, making it perfect for applications ranging from audio systems to data routing. With its compact design and superior thermal stability, it ensures seamless operation in diverse environments. Choose STMicroelectronics for quality that empowers your projects and elevates your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the product's durability and protects against environmental factors.

Surface Mount: YES

Surface mount capability allows for compact designs, making it suitable for modern electronic assemblies.

No. of Functions: 4

With four functions, this multiplexer/switch offers versatile signal routing options for various applications.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and easy to integrate into diverse circuit layouts.

Nominal Supply Voltage (Vsup): 4.5 V

A nominal supply voltage of 4.5 V ensures compatibility with standard logic levels in many circuits.

Power Supplies (V): 2/12

Supports both low (2V) and higher voltage (12V) power supplies, allowing flexibility in application.

No. of Terminals: 14

The 14 terminals ensure ample connections for complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space, making it ideal for compact applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature enhances reliability in demanding environmental conditions.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this device is suited for use in extreme climates.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal position contributes to reduced parasitic capacitance and enhanced switching performance.

Output (V): SEPARATE OUTPUT

Separate output allows for more flexible signal management, catering to diverse application needs.

Maximum Seated Height: 1.75 mm

A low seated height is advantageous for low-profile designs and effective heat dissipation.

Width: 3.9 mm

Narrow width facilitates placement in tight spaces and intricate board layouts.

Other IC type: SPST

Being a Single Pole Single Throw (SPST) switch type allows for straightforward control in simple circuits.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V ensures compatibility with low-power applications, promoting energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

A peak reflow time of 40 seconds ensures reliability during assembly without component damage.

Peak Reflow Temperature °C: 260

Supports a peak reflow temperature up to 260 °C, making it suitable for lead-free soldering processes.

Maximum On-state Resistance (Ron): 170 ohm

Low on-state resistance helps minimize power loss during operation, enhancing overall efficiency.

Maximum Switch-on Time: 20 ns

A fast switch-on time (20 ns) enables high-speed signal switching, crucial for high-frequency applications.

Length: 8.65 mm

The compact length contributes to a smaller overall footprint, essential for modern electronics.

Maximum Switch-off Time: 23 ns

Quick switch-off time (23 ns) ensures reliable operation in fast-paced electronics.

Temperature Grade: MILITARY

Designed under military-grade standards guarantees robustness and durability for challenging environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide secure solder joints and facilitate easier automated assembly.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with standard PCB layouts and improves assembly precision.

Maximum Supply Voltage (Vsup): 12 V

The maximum supply voltage of 12V provides flexibility for integration into different systems.

Nominal Off-state Isolation: 60 dB

High off-state isolation (60 dB) helps reduce signal crosstalk between channels, improving overall signal integrity.

Nominal On-state Resistance Match: 10 ohm

A low on-state resistance match of 10 ohm optimizes the performance of simultaneous channels for better signal quality.

Technical Specifications

Multiplexers & Switches M74HC4066RM13TR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

60 dB

Nominal On-state Resistance Match:

10 ohm

Maximum On-state Resistance (Ron):

170 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

23 ns

Maximum Switch-on Time:

20 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

M74HC4066RM13TR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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