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M74HC299RM13TR

STMicroelectronics

M74HC299RM13TR by STMicroelectronics

M74HC299RM13TR by STMicroelectronics is an 8-bit digital shift register with a propagation delay of 300 ns and a max frequency of 20 MHz. It operates at a nominal voltage of 4.5V, suitable for military-grade applications requiring true output polarity and positive edge trigger type in a small outline package.

Median Price

$2.010

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 3,315 parts In-Stock

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$2.010

100+ parts

$2.110

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$1.990

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3,315

$2.010

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Digiode

USA . 4,655 parts In-Stock

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EPE Components Inc.

USA . 3,232 parts In-Stock

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Bristol Electronics

USA . 3,232 parts In-Stock

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Vyrian

USA . 2,517 parts In-Stock

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Anansix

USA . 767 parts In-Stock

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Atlantic Semiconductor

USA . 748 parts In-Stock

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R&J Components

USA . 621 parts In-Stock

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Cogito LLC

Ukraine . 578 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 429 parts In-Stock

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$2.658

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429

$2.658

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AZTECH Wire

Italy . 582 parts In-Stock

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$9.550

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$9.550

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IDEA Electronic Components Group

UK . 1,964 parts In-Stock

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$26.962

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$24.265

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MKK Technologies

India . 619 parts In-Stock

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$50.699

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619

$50.699

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DigiPath Technology Company

USA . 619 parts In-Stock

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$50.699

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Perfect Parts

USA . 22,404 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,766 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,844 parts In-Stock

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Parana Technologies

USA . 1,726 parts In-Stock

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$32.237

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Corphita

USA . 1,497 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Overview

Enhance your digital designs with the M74HC299RM13TR by STMicroelectronics, a top-tier manufacturer known for its cutting-edge technology. This 8-bit digital shift register offers seamless integration and high performance in various applications. With its small outline package and true output polarity, this product ensures reliability and efficiency in your projects. Experience the value and benefits of this quality component, providing customers with superior results and unmatched advantages. Elevate your electronic creations with STMicroelectronic's M74HC299RM13TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and simplifying assembly.

No. of Bits: 8

With 8 bits, this shift register offers sufficient capacity for various data processing tasks.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V provides a good balance between performance and power efficiency.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility in the control of connected devices by enabling three output states: high, low, and high-impedance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product supports reliable and robust soldering processes during assembly.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of digital circuits.

Minimum fmax: 24 MHz

The minimum frequency at maximum supply voltage (fmax) of 24 MHz indicates high-speed operation, making the product suitable for demanding applications.

Technical Specifications

Digital Shift Registers M74HC299RM13TR attributes and parameters. Explore more Digital Shift Registers devices from STMicroelectronics

Specs

Additional Features:

HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

24 MHz

Trade Compliance

M74HC299RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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