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SN74HC166NP3

Texas Instruments

SN74HC166NP3 by Texas Instruments

SN74HC166NP3 by Texas Instruments is an 8-bit digital shift register with a package style of IN-LINE. It operates b/w -40°C to 85°C, suitable for industrial applications. With 16 terminals and CMOS technology, it offers dual terminal positions for efficient data shifting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,046 parts In-Stock

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5,046

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Digiode

USA . 2,481 parts In-Stock

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2,481

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Resion

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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AZTECH Wire

Italy . 304 parts In-Stock

1+ parts

$8.635

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304

$8.635

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One Stop Electronics

USA . 1,089 parts In-Stock

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$18.000

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1,089

$18.000

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Parana Technologies

USA . 407 parts In-Stock

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$18.284

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$18.416

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407

$18.284

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$18.416

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DigiPath Technology Company

USA . 1,677 parts In-Stock

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$20.133

100+ parts

$18.522

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1,677

$20.133

$18.522

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ChromeModa Solutions

Germany . 4,538 parts In-Stock

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$20.544

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$16.846

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4,538

$20.544

$16.846

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IDEA Electronic Components Group

UK . 723 parts In-Stock

1+ parts

$20.544

100+ parts

$19.517

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$18.490

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723

$20.544

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$18.490

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Corphita

USA . 679 parts In-Stock

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679

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Overview

Elevate your digital shift register experience with the SN74HC166NP3 by Texas Instruments. Manufactured with precision and excellence, this product offers unmatched quality and reliability in its category. Whether you're looking to streamline your data processing or enhance your automation systems, this shift register is the perfect solution. With its durable plastic/epoxy body and advanced CMOS technology, it ensures optimal performance even in industrial settings. Trust in Texas Instruments for cutting-edge technology that delivers value, efficiency, and innovation. Upgrade to the SN74HC166NP3 today and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the shift register, making it suitable for a variety of industrial applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and placement on circuit boards, maximizing space efficiency.

No. of Bits: 8

With 8 bits, this shift register offers sufficient capacity for data storage and manipulation in digital circuits.

Power Supplies (V): 2/6

The wide range of power supply options from 2V to 6V provides flexibility in design and compatibility with various voltage systems.

No. of Terminals: 16

The 16 terminals allow for easy connection to external components, enabling versatile input and output configurations.

Terminal Position: DUAL

The dual terminal position offers stability and reliability in connecting the shift register within a circuit, reducing the risk of loose connections.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this shift register can withstand a wide temperature range from -40°C to 85°C, ensuring reliable performance in harsh environments.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the shift register in digital circuits.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy soldering and secure mounting on circuit boards, ensuring stable connections for long-term use.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for standardized spacing, making it compatible with various prototyping and production processes for seamless integration.

Technical Specifications

Digital Shift Registers SN74HC166NP3 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Sub-Category:

Shift Registers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74HC166NP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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