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M5451DIE1

STMicroelectronics

M5451DIE1 by STMicroelectronics

M5451DIE1 by STMicroelectronics is a segment display driver designed for LED applications. It operates in a temperature range of -25 °C to 85°C, supports serial data input, and features 35 segments with a min frequency of 0.5 MHz. Ideal for compact designs, it comes as an unencased chip for surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,410 parts In-Stock

1+ parts

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100+ parts

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4,410

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Digiode

USA . 1,743 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,743

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Anansix

USA . 92 parts In-Stock

1+ parts

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92

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 459 parts In-Stock

1+ parts

$6.155

100+ parts

-

1k+ parts

$5.539

10k+ parts

-

459

$6.155

-

$5.539

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MKK Technologies

India . 466 parts In-Stock

1+ parts

$11.574

100+ parts

-

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10k+ parts

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466

$11.574

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DigiPath Technology Company

USA . 466 parts In-Stock

1+ parts

$11.574

100+ parts

-

1k+ parts

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466

$11.574

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-

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Corphita

USA . 4,463 parts In-Stock

1+ parts

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4,463

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Parana Technologies

USA . 266 parts In-Stock

1+ parts

-

100+ parts

$7.359

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266

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$7.359

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Overview

Elevate your display projects with the M5451DIE1 from STMicroelectronics—an industry leader known for exceptional quality and innovation. This versatile graphics display driver excels in a range of applications, from consumer electronics to industrial displays, ensuring seamless visual experiences. With its compact, reliable design and robust temperature tolerance, the M5451DIE1 offers unmatched performance and efficiency, empowering you to create stunning visuals while reducing energy costs.

Feature Benefit Bullets

Display Mode: SEGMENT

The SEGMENT display mode ensures clear and precise visual output, making it ideal for applications requiring well-defined lighting characteristics.

Data Input Mode: SERIAL

The SERIAL data input mode simplifies the connection to microcontrollers, reducing wiring complexity and providing efficient data transfer.

Surface Mount: YES

Surface mount capability allows for compact design and better performance in space-constrained applications, enhancing overall reliability.

Package Shape: RECTANGULAR

The RECTANGULAR package shape facilitates easy integration into various PCB designs, promoting versatile application use.

Package Style (Meter): UNCASED CHIP

An UNCASED CHIP package style allows for further customizations and modifications, making it perfect for specialized applications.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature ensures the product can function reliably in warm environments, suitable for various industrial applications.

Minimum Operating Temperature: -25 °C

With a low minimum operating temperature, this product can work effectively in cold climates, expanding its range of applications.

Terminal Position: UPPER

The UPPER terminal position can simplify the assembly process, making integration into designs more efficient.

Temperature Grade: COMMERCIAL EXTENDED

Having a COMMERCIAL EXTENDED temperature grade means this product is reliable for a wider range of environmental conditions, enhancing its usability.

Technology: NMOS

NMOS technology provides faster switching speeds and lower power consumption, making it ideal for battery-powered and energy-efficient devices.

Terminal Form: NO LEAD

The NO LEAD terminal form enhances thermal performance and space-saving designs, making it suitable for modern electronic applications.

No. of Segments: 35

With 35 segments, this product offers detailed and versatile display capabilities, suitable for complex visual information needs.

Minimum fmax: 0.5 MHz

A minimum fmax of 0.5 MHz allows for effective operation in applications requiring moderate speed, ensuring reliability in data handling.

Interface IC Type: LED DISPLAY DRIVER

As an LED DISPLAY DRIVER, this IC is specifically designed to handle and control LED displays efficiently, ensuring optimal performance in display applications.

Technical Specifications

Graphics Display Drivers M5451DIE1 attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-XUUC-N

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

35

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Technology:

NMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Minimum fmax:

.5 MHz

Trade Compliance

M5451DIE1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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