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M5450C7

STMicroelectronics

M5450C7 by STMicroelectronics

STMicroelectronics' M5450C7 is a Graphics Display Driver with 34 segments, operating b/w -25 °C to 85°C. It features a 44-terminal chip carrier package, MOS technology, and supports segment display mode. Ideal for applications requiring a surface-mountable driver with power supplies ranging from 4.75V to 13.2V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,874 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,874

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-

-

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Digiode

USA . 1,319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,319

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Anansix

USA . 190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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190

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 123 parts In-Stock

1+ parts

$8.779

100+ parts

-

1k+ parts

$7.901

10k+ parts

-

123

$8.779

-

$7.901

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MKK Technologies

India . 1,872 parts In-Stock

1+ parts

$16.508

100+ parts

-

1k+ parts

-

10k+ parts

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1,872

$16.508

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DigiPath Technology Company

USA . 1,872 parts In-Stock

1+ parts

$16.508

100+ parts

-

1k+ parts

-

10k+ parts

-

1,872

$16.508

-

-

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Parana Technologies

USA . 1,986 parts In-Stock

1+ parts

-

100+ parts

$10.496

1k+ parts

-

10k+ parts

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1,986

-

$10.496

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Corphita

USA . 923 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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923

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Overview

Enhance your display projects with the M5450C7 by STMicroelectronics, a top-tier manufacturer known for its superior quality and innovation. This Graphics Display Driver is perfect for a wide range of applications, offering seamless integration and exceptional performance. With a durable plastic/epoxy body and 44 terminals, this chip carrier package ensures reliability and longevity. Whether you're designing a digital clock or a smart appliance, the M5450C7 provides unmatched value, benefits, and advantages to elevate your creations to the next level. Experience the difference with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external elements, making the product suitable for a variety of environments.

Display Mode: SEGMENT

Segment display mode offers clear and distinct visual representation, making it ideal for displaying numerical and alphanumeric information.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and facilitating assembly processes.

Power Supplies (V): 4.75/13.2

Wide range of power supply options allows for compatibility with different voltage requirements, offering versatility in various applications.

No. of Terminals: 44

Having a high number of terminals enables connectivity with multiple components, enhancing the functionality and potential applications of the product.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers efficient thermal dissipation and compact design, optimizing the performance and size of the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding conditions, increasing the product's durability and lifespan.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows for usage in cold environments, making the product versatile and suitable for various temperature conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and conductivity, ensuring secure connections and stable performance of the product.

Technology: MOS

MOS technology offers high speed and low power consumption, optimizing the efficiency and performance of the product.

No. of Segments: 34

Having 34 segments allows for detailed and customizable display options, enhancing the visual output and usability of the product.

Terminal Pitch: 1.27 mm

Narrow terminal pitch enables high-density mounting and precise connections, improving the overall compactness and reliability of the product.

Technical Specifications

Graphics Display Drivers M5450C7 attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Additional Features:

COMMON-ANODE

Display Mode:

SEGMENT

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

No. of Segments:

34

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

4.75/13.2

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

M5450C7 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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