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M24M01-DFCS6TP/A

STMicroelectronics

M24M01-DFCS6TP/A by STMicroelectronics

The STMicroelectronics M24M01-DFCS6TP/A is a 128KX8 EEPROM with a serial I2C bus type, operating at up to 1 MHz clock frequency. It has a memory density of 1048576 bits and operates in industrial temperature range (-40 to 85 °C). This thin-profile package is suitable for applications requiring low-power non-volatile memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,964 parts In-Stock

1+ parts

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2,964

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Digiode

USA . 2,065 parts In-Stock

1+ parts

-

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1k+ parts

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2,065

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Anansix

USA . 1,026 parts In-Stock

1+ parts

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1,026

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,730 parts In-Stock

1+ parts

$5.026

100+ parts

-

1k+ parts

$4.523

10k+ parts

-

1,730

$5.026

-

$4.523

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MKK Technologies

India . 765 parts In-Stock

1+ parts

$9.451

100+ parts

-

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765

$9.451

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DigiPath Technology Company

USA . 765 parts In-Stock

1+ parts

$9.451

100+ parts

-

1k+ parts

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10k+ parts

-

765

$9.451

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-

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Parana Technologies

USA . 2,317 parts In-Stock

1+ parts

-

100+ parts

$6.009

1k+ parts

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2,317

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$6.009

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Corphita

USA . 814 parts In-Stock

1+ parts

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814

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Overview

Unlock the power of reliable data storage with the M24M01-DFCS6TP/A EEPROM by STMicroelectronics. Crafted with precision and expertise, this versatile memory solution offers seamless operation in a wide range of applications. Experience peace of mind knowing your data is securely stored with this high-quality product. From industrial settings to consumer electronics, the possibilities are endless with the M24M01-DFCS6TP/A. Trust in STMicroelectronics to deliver top-notch performance and value for all your memory needs. Elevate your projects with this exceptional EEPROM today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM chip, ensuring a longer lifespan.

Surface Mount: YES

Easy installation and space-saving design for efficient PCB layout.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing in data transfers, improving overall performance.

Nominal Supply Voltage (Vsup): 2.5V

Optimal voltage for reliable and stable operation of the EEPROM.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where temperature fluctuations are common.

Memory Density: 1048576 bit

High memory density for storing a large amount of data in a compact chip.

Serial Bus Type: I2C

The I2C serial interface allows for easy communication with other devices, making integration simple.

Technical Specifications

EEPROM M24M01-DFCS6TP/A attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES AT 400KHZ

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

R-PBGA-B8

Length:

3.57 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Maximum Seated Height:

.605 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Position:

BOTTOM

Width:

2.05 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24M01-DFCS6TP/A Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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