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M24C64T-FCU6T/TF

STMicroelectronics

M24C64T-FCU6T/TF by STMicroelectronics

M24C64T-FCU6T/TF by STMicroelectronics is a 64Kb EEPROM with I2C interface, operating from 1.7V to 5.5V. It features a max clock frequency of 1MHz and operates in temperatures from -40 °C to 85 °C. Ideal for industrial applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,993 parts In-Stock

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4,993

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Vyrian

USA . 4,653 parts In-Stock

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4,653

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Anansix

USA . 1,840 parts In-Stock

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1,840

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Distributors (Availability)

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Microchip USA

USA . 238 parts In-Stock

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$2.502

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238

$2.502

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Component Stockers USA

USA . 21,284 parts In-Stock

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$3.070

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21,284

$3.070

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IDEA Electronic Components Group

UK . 265 parts In-Stock

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$4.998

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$4.499

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265

$4.998

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$4.499

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AZTECH Wire

Italy . 360 parts In-Stock

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$8.170

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360

$8.170

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MKK Technologies

India . 1,898 parts In-Stock

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$9.399

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1,898

$9.399

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DigiPath Technology Company

USA . 1,898 parts In-Stock

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$9.399

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$9.399

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Parana Technologies

USA . 1,582 parts In-Stock

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$5.976

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$5.976

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Corphita

USA . 1,197 parts In-Stock

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Overview

Unlock the potential of your designs with the M24C64T-FCU6T/TF from STMicroelectronics, a leader in innovative semiconductor solutions. This robust EEPROM is perfect for applications that demand reliability and efficiency, delivering exceptional performance in extreme temperatures. Its compact, thin-profile design ensures seamless integration into any project, providing a dependable memory solution that enhances functionality while minimizing space. Choose quality and innovation – elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers excellent protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easier integration into compact circuit designs, optimizing space usage on PCBs.

Package Shape: SQUARE

The square shape facilitates uniformity in layout and simplifies the design process for engineers.

Operating Mode: SYNCHRONOUS

Synchronous operation results in faster data transfer rates, enhancing overall performance in communication applications.

Nominal Supply Voltage / Vsup (V): 1.8

A low nominal supply voltage improves power efficiency, ideal for battery-operated devices and energy-sensitive applications.

No. of Terminals: 4

The compact configuration with only 4 terminals simplifies soldering and reduces potential points of failure.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch of the grid array package enable high-density mounting and save PCB real estate.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this EEPROM suitable for industrial applications where thermal management is critical.

Organization: 8KX8

With an 8Kx8 organization, this EEPROM efficiently manages data storage, allowing for easier data manipulation.

Minimum Operating Temperature: -40 °C

The extended temperature range ensures reliable operation in harsh environments, particularly in outdoor or industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for direct heat dissipation and enhances the thermal performance of the device.

Maximum Seated Height: 0.33 mm

A low seated height aids in creating a thinner profile in designs, ideal for applications where every millimeter counts.

Maximum Clock Frequency (fCLK): 1 MHz

A 1 MHz clock frequency supports efficient data transmission rates within the typical operational limits of numerous microcontrollers.

Width: 0.833 mm

The narrow width allows for high-density layouts, accommodating more components in a limited space.

Minimum Supply Voltage (Vsup): 1.7 V

A minimum supply voltage of 1.7V supports a wide range of applications, ensuring compatibility with various systems and power supplies.

Length: 0.833 mm

The compact length contributes to a small footprint, which is essential in modern electronic designs that prioritize miniaturization.

Temperature Grade: INDUSTRIAL

Classified as industrial-grade, this EEPROM device is designed for reliability and longevity in challenging conditions.

Technology: CMOS

Utilizing CMOS technology allows for lower power consumption and higher performance, enhancing operational efficiency.

Parallel or Serial: SERIAL

The serial interface simplifies connections and reduces pin counts, making it ideal for space-constrained applications.

Terminal Form: BALL

The ball terminal form offers reliable connections and improved solderability compared to traditional lead forms.

No. of Words: 8192 words

The substantial number of words enables ample data storage capacity for a variety of use cases.

Memory Width: 8

An 8-bit memory width allows for efficient data handling, making it suitable for microcontroller interfacing.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch allows for a compact design while maintaining ease of manufacturing and assembly.

No. of Words Code: 8K

An 8K word count indicates sufficient memory capacity for moderate applications, providing flexibility in design.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage tolerance ensures compatibility with a wide range of electronic systems.

Serial Bus Type: I2C

The I2C serial bus type facilitates easy integration with various microcontrollers and simplifies communication protocols.

Maximum Write Cycle Time (tWC): 5 ms

The quick write cycle time of 5 ms ensures efficient data updates, crucial for real-time applications.

Memory Density: 65536 bit

With a memory density of 65536 bits, this device provides a good amount of storage for medium-scale applications.

Memory IC Type: EEPROM

As an EEPROM, the product offers non-volatile memory retention, perfect for applications requiring data persistence.

Technical Specifications

EEPROM M24C64T-FCU6T/TF attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

S-PBGA-B4

Length:

.833 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Maximum Seated Height:

.33 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

.833 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24C64T-FCU6T/TF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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