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M24C64S-FCU6T/TF

STMicroelectronics

M24C64S-FCU6T/TF by STMicroelectronics

M24C64S-FCU6T/TF by STMicroelectronics is a 64Kb EEPROM with a synchronous I2C interface, ideal for industrial applications. It operates b/w -40 °C to 85 °C and supports a max clock frequency of 1 MHz. Its compact design features a very thin profile, making it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,931 parts In-Stock

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7,931

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Digiode

USA . 1,725 parts In-Stock

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1,725

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Anansix

USA . 908 parts In-Stock

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908

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IDEA Electronic Components Group

UK . 1,985 parts In-Stock

1+ parts

$2.787

100+ parts

-

1k+ parts

$2.508

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1,985

$2.787

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$2.508

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MKK Technologies

India . 407 parts In-Stock

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$5.240

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407

$5.240

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DigiPath Technology Company

USA . 407 parts In-Stock

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$5.240

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407

$5.240

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Microchip USA

USA . 157 parts In-Stock

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$13.239

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157

$13.239

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AZTECH Wire

Italy . 875 parts In-Stock

1+ parts

$18.980

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875

$18.980

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RC Electronics

USA . 65,329 parts In-Stock

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65,329

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Kepictronics

USA . 10,000 parts In-Stock

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Authorized Procurement Solutions

USA . 4,916 parts In-Stock

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4,916

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Corphita

USA . 2,884 parts In-Stock

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2,884

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Parana Technologies

USA . 551 parts In-Stock

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$3.332

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551

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$3.332

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Overview

Unlock unparalleled data retention and efficiency with the M24C64S-FCU6T/TF from STMicroelectronics. Renowned for their high-quality semiconductor solutions, STMicroelectronics delivers this robust EEPROM designed for diverse industrial applications. With its ultra-thin profile and exceptional temperature range, this memory chip offers enhanced performance, reliability, and longevity. Elevate your designs with a dependable partner that ensures optimal data integrity, even in the most demanding environments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier assembly, ideal for efficient automated manufacturing processes.

Package Shape: SQUARE

A square package shape optimizes space on PCB layouts, allowing for better component density and layout flexibility.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster and more efficient data transfer, enhancing performance in high-speed applications.

Nominal Supply Voltage (Vsup): 1.8 V

The low nominal supply voltage reduces power consumption, making this EEPROM suitable for battery-powered devices and energy-sensitive applications.

No. of Terminals: 4

With a compact terminal count, this EEPROM simplifies PCB design and minimizes space requirements while maintaining functionality.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch allow for high-density mounting, making this product ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures reliability in industrial environments, extending the product's range of applications.

Organization: 8KX8

The 8Kx8 organization provides sufficient storage capabilities for a variety of applications, striking a balance between capacity and performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this EEPROM suitable for harsh and extreme environments.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient heat dissipation and allows for better soldering in surface mount configurations.

Maximum Seated Height: 0.33 mm

The low seated height contributes to a slim profile, making it perfect for applications where height is a critical factor.

Maximum Clock Frequency (fCLK): 1 MHz

A 1 MHz clock frequency supports reliable and fast data transfers, enhancing performance in applications that require quick read/write operations.

Width: 0.833 mm

The compact width allows for high-density layouts, optimizing space usage on printed circuit boards.

Minimum Supply Voltage (Vsup): 1.7 V

A minimum supply voltage of 1.7 V guarantees versatility in various power environments while maintaining operational integrity.

Length: 0.833 mm

The compact length aligns with the overall small footprint of the device, ideal for integration into portable electronics.

Temperature Grade: INDUSTRIAL

Industrial temperature rating signifies reliability and durability in a wide range of challenging environments.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, making this EEPROM a versatile and efficient choice for many applications.

Parallel or Serial: SERIAL

Serial communication simplifies board design and reduces pin count, which enhances integration and minimizes space requirements.

Terminal Form: BALL

Ball terminal form allows for effective soldering and enhances connectivity, contributing to improved reliability in assembly.

No. of Words: 8192 words

With 8192 words of storage, this EEPROM can handle a variety of applications, making it a flexible and efficient memory solution.

Memory Width: 8

An 8-bit memory width allows for efficient data handling and processing, making it suitable for various data-intensive applications.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch allows for tight packing of components, enabling compact circuit board designs without compromising performance.

No. of Words Code: 8K

With a coding capability of 8K words, this EEPROM offers a versatile solution for data storage and retrieval requirements.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides robustness in different power supply environments, ensuring reliable performance.

Serial Bus Type: I2C

I2C serial bus type enables easy multi-device communication, streamlining system integration and connectivity for complex applications.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms supports efficient data updating, making the device suitable for time-sensitive applications.

Memory Density: 65536 bit

With a memory density of 65536 bits, this EEPROM effectively balances storage capacity with size, fitting various design needs.

Memory IC Type: EEPROM

Being an EEPROM type enables non-volatile storage which retains data without power, ensuring reliability and consistency over time.

Technical Specifications

EEPROM M24C64S-FCU6T/TF attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

S-PBGA-B4

Length:

.833 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Maximum Seated Height:

.33 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

.833 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24C64S-FCU6T/TF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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