Loading...

M24C64-RDW6P

STMicroelectronics

M24C64-RDW6P by STMicroelectronics

M24C64-RDW6P by STMicroelectronics is a 64Kb EEPROM with I2C interface, ideal for industrial applications. It operates at 1.8V to 5.5V, features a max clock frequency of 400kHz, and offers up to 1M write/erase cycles. Its compact SOIC package ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,279 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,279

-

-

-

-

Digiode

USA . 2,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,485

-

-

-

-

Anansix

USA . 1,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,490

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 271 parts In-Stock

1+ parts

$4.939

100+ parts

-

1k+ parts

$4.446

10k+ parts

-

271

$4.939

-

$4.446

-

Microchip USA

USA . 209 parts In-Stock

1+ parts

$8.120

100+ parts

-

1k+ parts

-

10k+ parts

-

209

$8.120

-

-

-

MKK Technologies

India . 629 parts In-Stock

1+ parts

$9.288

100+ parts

-

1k+ parts

-

10k+ parts

-

629

$9.288

-

-

-

DigiPath Technology Company

USA . 629 parts In-Stock

1+ parts

$9.288

100+ parts

-

1k+ parts

-

10k+ parts

-

629

$9.288

-

-

-

AZTECH Wire

Italy . 601 parts In-Stock

1+ parts

$18.830

100+ parts

-

1k+ parts

-

10k+ parts

-

601

$18.830

-

-

-

Corphita

USA . 1,376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,376

-

-

-

-

Parana Technologies

USA . 415 parts In-Stock

1+ parts

-

100+ parts

$5.906

1k+ parts

-

10k+ parts

-

415

-

$5.906

-

-

Overview

Unlock the potential of your projects with the M24C64-RDW6P EEPROM from STMicroelectronics, a trusted leader in innovation. This compact, reliable memory solution ensures superior performance in diverse applications, from industrial systems to consumer electronics. With exceptional endurance and robust temperature resilience, it delivers unmatched value, enhancing efficiency while minimizing downtime. Choose STMicroelectronics for quality you can depend on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures reliability and longevity in various applications.

Surface Mount: YES

Surface mount design allows for compact PCB layouts and automated assembly.

Package Shape: RECTANGULAR

Rectangular shape optimizes space usage on circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation provides efficient read/write speeds, enhancing performance.

Nominal Supply Voltage / Vsup: 2.5 V

Operating at a low nominal voltage improves energy efficiency.

Power Supplies: 2/5 V

Flexible voltage range to accommodate various system requirements.

No. of Terminals: 8

Compact 8-terminal design simplifies integration into existing systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile design is excellent for space-constrained applications.

Maximum Operating Temperature: 85 °C

High-temperature tolerance makes it suitable for industrial applications.

Organization: 8KX8

Well-organized memory structure allows for efficient data management.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliability in extreme environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish enhances durability and conductivity.

I2C Control Byte: 1010DDDR

Standard I2C control protocol ensures compatibility with a wide array of devices.

Terminal Position: DUAL

Dual terminal position aids in versatile mounting options for circuit design.

Write Protection: HARDWARE

Hardware write protection enhances data integrity and security.

Maximum Seated Height: 1.2 mm

Low seated height is advantageous in slim electronic devices.

Maximum Clock Frequency (fCLK): 0.4 MHz

Sufficient clock frequency meets most standard data throughput needs.

Width: 3 mm

Compact width allows for space-saving designs.

Minimum Supply Voltage (Vsup): 1.8 V

Low minimum supply voltage increases system flexibility and energy savings.

Length: 4.4 mm

Short length contributes to a compact overall design.

Temperature Grade: INDUSTRIAL

Industrial grade certification ensures robustness in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high performance.

Parallel or Serial: SERIAL

Serial communication simplifies wiring and reduces complexity.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly.

Maximum Supply Current: 3 mA

Low supply current minimizes energy consumption, extending battery life.

No. of Words: 8192 words

Ample storage capacity suitable for a wide range of applications.

Memory Width: 8

8-bit memory width aligns with typical data architectures, ensuring compatibility.

Minimum Data Retention Time: 40 years

Long data retention time makes it reliable for long-term applications.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density circuit board designs.

No. of Words Code: 8K

8K word code offers sufficient memory for various data storage needs.

Maximum Supply Voltage (Vsup): 5.5 V

Wide maximum supply voltage ensures compatibility with various power sources.

Endurance: 1,000,000 Write/Erase Cycles

High endurance rating enhances reliability for frequent data operations.

Serial Bus Type: I2C

I2C bus type allows for easy integration into multi-device setups.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time enhances performance for time-sensitive applications.

Memory Density: 65536 bits

High memory density enables efficient data storage solutions.

Memory IC Type: EEPROM

EEPROM technology ensures non-volatile memory storage for critical data.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current contributes to overall energy efficiency.

Technical Specifications

EEPROM M24C64-RDW6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C64-RDW6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20