Loading...

M24C32S-FCU6T/T

STMicroelectronics

M24C32S-FCU6T/T by STMicroelectronics

M24C32S-FCU6T/T by STMicroelectronics is a 32Kb EEPROM with a 1.8V nominal voltage and operates in synchronous mode. It features a very thin profile, I2C serial bus, and supports temperatures from -40 °C to 85 °C. Ideal for industrial applications requiring compact memory solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 6,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,500

-

-

-

-

ComSIT Distribution GmbH

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Vyrian

USA . 4,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,738

-

-

-

-

Digiode

USA . 3,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,692

-

-

-

-

Anansix

USA . 379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

379

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 50,124 parts In-Stock

1+ parts

$2.370

100+ parts

-

1k+ parts

-

10k+ parts

-

50,124

$2.370

-

-

-

IDEA Electronic Components Group

UK . 1,411 parts In-Stock

1+ parts

$2.927

100+ parts

-

1k+ parts

$2.635

10k+ parts

-

1,411

$2.927

-

$2.635

-

MKK Technologies

India . 2,035 parts In-Stock

1+ parts

$5.505

100+ parts

-

1k+ parts

-

10k+ parts

-

2,035

$5.505

-

-

-

DigiPath Technology Company

USA . 2,035 parts In-Stock

1+ parts

$5.505

100+ parts

-

1k+ parts

-

10k+ parts

-

2,035

$5.505

-

-

-

AZTECH Wire

Italy . 613 parts In-Stock

1+ parts

$12.630

100+ parts

-

1k+ parts

-

10k+ parts

-

613

$12.630

-

-

-

Microchip USA

USA . 414 parts In-Stock

1+ parts

$38.751

100+ parts

-

1k+ parts

-

10k+ parts

-

414

$38.751

-

-

-

RC Electronics

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,121 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,121

-

-

-

-

Alle Elektronik GmbH

Germany . 4,747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,747

-

-

-

-

Corphita

USA . 4,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,223

-

-

-

-

GreenTree Electronics

Israel . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Kepictronics

USA . 2,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,390

-

-

-

-

Parana Technologies

USA . 1,105 parts In-Stock

1+ parts

-

100+ parts

$3.500

1k+ parts

-

10k+ parts

-

1,105

-

$3.500

-

-

Overview

Unlock the potential of your designs with the M24C32S-FCU6T/T EEPROM from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers reliable data storage solutions ideal for a range of applications, from consumer electronics to industrial automation. This compact, high-performance chip ensures efficient data management while operating seamlessly in challenging conditions, giving you peace of mind and driving your projects forward with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliable performance and longevity in various applications.

Surface Mount: YES

Allows for compact PCB designs and easy integration into modern electronic devices.

Package Shape: SQUARE

Efficient use of board space, making it suitable for densely packed layouts.

Operating Mode: SYNCHRONOUS

Faster data access and improved performance in applications requiring high-speed operations.

Nominal Supply Voltage / Vsup: 1.8 V

Low power consumption enhances energy efficiency, making it ideal for battery-operated devices.

No. of Terminals: 4

Fewer terminals simplify circuit design and reduce space on the PCB.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact package design contributes to smaller device footprints and makes it suitable for multi-layer PCBs.

Maximum Operating Temperature: 85 °C

Suitable for high-temperature environments, increasing application versatility in industrial settings.

Organization: 4KX8

Offers a balanced memory structure for efficient data storage and retrieval.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold conditions, making it reliable for outdoor and automotive applications.

Terminal Position: BOTTOM

Facilitates a more compact assembly process on printed circuit boards.

Maximum Seated Height: 0.3 mm

Low profile design minimizes space requirements, ideal for slim devices.

Maximum Clock Frequency (fCLK): 1 MHz

Adequate speed for numerous low to moderate speed applications, providing flexibility in design.

Width: 0.833 mm

Narrow profile accommodates various PCB layouts without compromising performance.

Minimum Supply Voltage (Vsup): 1.7 V

Allows for low-voltage applications, broadening the range of compatible devices.

Length: 0.833 mm

Compact dimensions help in achieving a small overall product size.

Temperature Grade: INDUSTRIAL

Ensures reliability and durability in harsh environments, making it suitable for industrial applications.

Technology: CMOS

Offers low power consumption and high noise immunity, which are critical for embedded applications.

Parallel or Serial: SERIAL

Simplifies communication and reduces pin count, beneficial for modern electronics.

Terminal Form: BALL

Improves soldering efficiency and thermal performance on PCBs.

No. of Words: 4096 words

Provides adequate storage capacity for many embedded applications.

Memory Width: 8

Offers a straightforward data storage format facilitating easy integration with microcontrollers.

Terminal Pitch: 0.4 mm

Fine pitch allows for high-density placements on the PCB without sacrificing performance.

No. of Words Code: 4K

Enables substantial coding space for various applications, enhancing product versatility.

Maximum Supply Voltage (Vsup): 5.5 V

Flexibility in power supply options supports a wide variety of applications.

Serial Bus Type: I2C

Popular communication protocol allows for easy integration with many microcontrollers and devices.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time improves data logging and real-time application performance.

Memory Density: 32768 bit

Provides a significant amount of storage for data-intensive applications in compact designs.

Memory IC Type: EEPROM

Non-volatile memory type ensures data retention even when power is lost, ideal for critical applications.

Technical Specifications

EEPROM M24C32S-FCU6T/T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

S-PBGA-B4

Length:

.833 mm

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

4

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.3 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.833 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24C32S-FCU6T/T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20