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M24C32M-FCU6T/TF

STMicroelectronics

M24C32M-FCU6T/TF by STMicroelectronics

M24C32M-FCU6T/TF by STMicroelectronics is a 32Kb EEPROM with I2C interface, ideal for industrial applications. It operates at a supply voltage of 1.7V to 5.5V and features a max clock frequency of 1 MHz. Its compact design ensures efficient use in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,595 parts In-Stock

1+ parts

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6,595

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Cyclops Electronics Ltd

UK . 2,856 parts In-Stock

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2,856

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Anansix

USA . 2,817 parts In-Stock

1+ parts

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2,817

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Digiode

USA . 1,575 parts In-Stock

1+ parts

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1,575

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J2 Sourcing AB

Sweden . 95 parts In-Stock

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95

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 816 parts In-Stock

1+ parts

$4.509

100+ parts

-

1k+ parts

$4.058

10k+ parts

-

816

$4.509

-

$4.058

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Microchip USA

USA . 197 parts In-Stock

1+ parts

$5.980

100+ parts

-

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197

$5.980

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MKK Technologies

India . 1,131 parts In-Stock

1+ parts

$8.479

100+ parts

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1,131

$8.479

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DigiPath Technology Company

USA . 1,131 parts In-Stock

1+ parts

$8.479

100+ parts

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1,131

$8.479

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AZTECH Wire

Italy . 1,082 parts In-Stock

1+ parts

$19.710

100+ parts

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1,082

$19.710

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Corphita

USA . 3,521 parts In-Stock

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3,521

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Parana Technologies

USA . 2,168 parts In-Stock

1+ parts

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$5.391

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2,168

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$5.391

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Overview

Unlock the potential of your designs with the M24C32M-FCU6T/TF EEPROM from STMicroelectronics. Renowned for exceptional quality and reliability, STMicroelectronics ensures your projects benefit from durable performance across diverse applications—from industrial automation to consumer electronics. With a compact design and low power consumption, this memory solution enhances efficiency and offers robust data retention, making it the ideal choice for engineers seeking innovation without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection and reliability, making this EEPROM suitable for various applications.

Surface Mount: YES

Surface mount capability ensures easy integration into modern PCB designs, saving space and allowing for automated assembly.

Package Shape: RECTANGULAR

The rectangular shape is well-suited for dense layouts, optimizing board space for compact applications.

Operating Mode: SYNCHRONOUS

Synchronous operation improves data transfer rates and system efficiency, making this EEPROM ideal for high-performance applications.

Nominal Supply Voltage (Vsup): 2.5 V

A nominal supply voltage of 2.5V is energy-efficient, reducing power consumption for battery-powered applications.

No. of Terminals: 4

With only 4 terminals, this EEPROM simplifies circuit design and reduces the likelihood of connection issues.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch help in achieving a compact design, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C enables reliable functionality in a wide range of industrial environments.

Organization: 4KX8

This organization format provides a decent memory structure for efficient data storage and retrieval.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures makes this EEPROM suitable for harsh environments, such as outdoor applications.

Terminal Position: BOTTOM

Bottom terminal position enhances thermal performance and optimizes space on the PCB.

Maximum Seated Height: 0.345 mm

A low seated height ensures compatibility with low-profile designs and helps in fitting compact assemblies.

Maximum Clock Frequency (fCLK): 1 MHz

Supports clock frequencies up to 1 MHz, allowing for fast data access and improved system performance.

Width: 0.674 mm

A narrow width assists in tighter PCB layouts, making it ideal for miniaturized electronic devices.

Minimum Supply Voltage (Vsup): 1.7 V

The minimum supply voltage of 1.7V enhances versatility in different operational conditions while maintaining low power usage.

Length: 0.795 mm

A compact length contributes to efficient design and helps meet space constraints in modern electronics.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure reliability in demanding conditions, suitable for industrial and commercial applications.

Technology: CMOS

CMOS technology enables lower power consumption and higher density, thus enhancing overall performance.

Parallel or Serial: SERIAL

Serial communication provides a simpler connection with fewer wires, reducing design complexity.

Terminal Form: BALL

Ball terminals facilitate easier assembly and soldering processes, enhancing manufacturability.

No. of Words: 4096 words

With a capacity of 4096 words, this EEPROM provides ample storage for a variety of applications.

Memory Width: 8

An 8-bit memory width caters well to standard data formats, enabling efficient data handling.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for denser layouts, making it compatible with high-density PCB designs.

No. of Words Code: 4K

The 4K words code signifies a practical data capacity for versatile applications, from simple to more complex data handling.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for compatibility with a variety of power sources and enhances operational flexibility.

Serial Bus Type: I2C

I2C communication enables easy connectivity and integration with other devices, improving system interoperability.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms ensures quicker programming, improving overall system efficiency.

Memory Density: 32768 bit

A density of 32768 bits provides sufficient storage capacity for a wide range of applications.

Memory IC Type: EEPROM

This EEPROM type is non-volatile, ensuring data retention even when power is removed, making it crucial for critical memory applications.

Technical Specifications

EEPROM M24C32M-FCU6T/TF attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

R-PBGA-B4

Length:

.795 mm

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

4

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.345 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.674 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24C32M-FCU6T/TF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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