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M24C32-FMB5TG

STMicroelectronics

M24C32-FMB5TG by STMicroelectronics

M24C32-FMB5TG by STMicroelectronics is a 32Kb EEPROM with I2C interface, ideal for automotive applications due to its AEC-Q100 screening. It operates at a nominal voltage of 1.8V and supports up to 1M write/erase cycles. Its compact design features an ultra-thin profile of just 0.6mm height.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,969 parts In-Stock

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4,969

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Anansix

USA . 2,801 parts In-Stock

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2,801

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Digiode

USA . 1,802 parts In-Stock

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1,802

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,481 parts In-Stock

1+ parts

$4.504

100+ parts

-

1k+ parts

$4.054

10k+ parts

-

1,481

$4.504

-

$4.054

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Microchip USA

USA . 210 parts In-Stock

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$4.690

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210

$4.690

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MKK Technologies

India . 1,160 parts In-Stock

1+ parts

$8.470

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1,160

$8.470

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DigiPath Technology Company

USA . 1,160 parts In-Stock

1+ parts

$8.470

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1,160

$8.470

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AZTECH Wire

Italy . 218 parts In-Stock

1+ parts

$14.680

100+ parts

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218

$14.680

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A-Z Elektronik GmbH

Germany . 5,682 parts In-Stock

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5,682

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Alle Elektronik GmbH

Germany . 3,788 parts In-Stock

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3,788

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Corphita

USA . 3,605 parts In-Stock

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3,605

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Parana Technologies

USA . 711 parts In-Stock

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$5.386

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711

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$5.386

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Elevate your designs with the M24C32-FMB5TG EEPROM from STMicroelectronics—trusted for its unparalleled quality and reliability. This compact, high-performance memory solution is perfect for automotive and industrial applications, delivering robust data retention and endurance up to 1 million write/erase cycles. Benefit from its low power consumption and I2C interface, ensuring seamless integration into your next project while enhancing overall efficiency and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures structural integrity and reliability in various environments.

Surface Mount: YES

Facilitates easier assembly and production, allowing for compact designs and reduced PCB space.

Screening Level: AEC-Q100

This qualification ensures the EEPROM meets stringent automotive performance standards, making it suitable for automotive applications.

Package Shape: RECTANGULAR

A rectangular package shape is versatile, allowing for optimal layout on PCB and efficient space usage.

Operating Mode: SYNCHRONOUS

Reduces latency and improves data transfer rates, enhancing overall system performance.

Nominal Supply Voltage / Vsup: 1.8V

Low operating voltage helps in power savings, making this product ideal for battery-operated devices.

Power Supplies: 1.8/5V

Dual supply voltage allows flexibility in application design, accommodating various system requirements.

No. of Terminals: 8

Compact size with fewer terminals simplifies integration into existing designs and enhances reliability.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Thin profile design maximizes board space efficiency and allows for easy stacking in tight spaces.

Maximum Operating Temperature: 85 °C

Supports a wide temperature range, ensuring reliability in high-temperature environments.

Organization: 4KX8

A well-structured memory organization allows efficient data management and access, enhancing performance.

Minimum Operating Temperature: -20 °C

Ensures functionality in low-temperature conditions, ideal for outdoor or extreme applications.

I2C Control Byte: 1010DDDR

Simplifies communications protocol and enhances integration with various microcontrollers and devices.

Terminal Position: DUAL

Provides flexibility in PCB layout and facilitates better thermal management.

Write Protection: HARDWARE

Hardware-based write protection enhances data security, preventing accidental data corruption during operations.

Maximum Seated Height: 0.6 mm

Low height profile enables placement in compact devices without compromising on performance.

Maximum Clock Frequency (fCLK): 0.4 MHz

Allows for sufficient speed for typical EEPROM applications, ensuring quick data transactions.

Width: 2 mm

Compact width promotes design flexibility and is suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.7V

Supports low voltage operation, optimizing power consumption in battery-powered devices.

Length: 3 mm

Short length allows for space-efficient PCB designs, especially in compact electronic devices.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, ideal for energy-sensitive applications.

Parallel or Serial: SERIAL

Serial data transfer reduces pin count and simplifies connections, making it easier to integrate into multiple systems.

Terminal Form: NO LEAD

No-lead design promotes modern assembly techniques and enhances reliability against PCB delamination.

Maximum Supply Current: 3 mA

Low current draw minimizes heat generation and prolongs battery life in portable applications.

No. of Words: 4096 words

Offers ample storage capacity for a variety of applications, accommodating various data needs.

Memory Width: 8

8-bit memory width allows efficient data handling and compatibility with common data formats.

Minimum Data Retention Time: 40 years

Long data retention time ensures that stored data remains intact over long periods, enhancing reliability.

Terminal Pitch: 0.5 mm

Fine pitch enables higher density mounting, optimizing PCB layout.

No. of Words Code: 4K

Provides efficient data organization, suitable for applications requiring moderate storage capacity.

Maximum Supply Voltage (Vsup): 5.5V

Versatile voltage range accommodates various system designs, ensuring compatibility with different components.

Endurance: 1,000,000 Write/Erase Cycles

High endurance makes this EEPROM ideal for applications that require frequent data updates.

Serial Bus Type: I2C

I2C compatibility allows for easy multi-device communication and integration into existing data lines.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle times enhance performance, allowing for quicker data updates and improved user experience.

Memory Density: 32768 bit

Adequate memory density supports a variety of applications, balancing size and capacity effectively.

Memory IC Type: EEPROM

Reliable non-volatile memory ensures data retention without power, making it suitable for critical data storage.

Maximum Standby Current: 0.000001 Amp

Ultra-low standby current significantly reduces overall power consumption, ideal for energy-efficient designs.

Technical Specifications

EEPROM M24C32-FMB5TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-N8

Length:

3 mm

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

4KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C32-FMB5TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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