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M24C32-FCU6TP/TF

STMicroelectronics

M24C32-FCU6TP/TF by STMicroelectronics

M24C32-FCU6TP/TF by STMicroelectronics is a 32Kb EEPROM with I2C serial bus, ideal for industrial applications. It operates b/w -40 °C to 85 °C and features a very thin profile (0.345mm height) with a max clock frequency of 400kHz. Its compact design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,507 parts In-Stock

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7,507

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Digiode

USA . 2,437 parts In-Stock

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2,437

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Anansix

USA . 1,542 parts In-Stock

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1,542

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Cyclops Electronics Ltd

UK . 1,234 parts In-Stock

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1,234

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,410 parts In-Stock

1+ parts

$4.135

100+ parts

-

1k+ parts

$3.722

10k+ parts

-

1,410

$4.135

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$3.722

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MKK Technologies

India . 2,055 parts In-Stock

1+ parts

$7.776

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2,055

$7.776

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DigiPath Technology Company

USA . 2,055 parts In-Stock

1+ parts

$7.776

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2,055

$7.776

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AZTECH Wire

Italy . 40 parts In-Stock

1+ parts

$21.150

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40

$21.150

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QUARKTWIN TECHNOLOGY LTD

USA . 9,808 parts In-Stock

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Microchip USA

USA . 5,170 parts In-Stock

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5,170

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 2,301 parts In-Stock

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2,301

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Parana Technologies

USA . 271 parts In-Stock

1+ parts

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$4.944

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271

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$4.944

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Overview

Unlock the potential of your designs with the M24C32-FCU6TP/TF EEPROM from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a powerful solution perfect for industrial applications, ensuring reliability even in extreme temperatures. With its compact, thin-profile design and efficient I2C interface, this EEPROM integrates seamlessly into your projects, providing exceptional performance and data integrity that empowers your creations. Experience the advantage of choosing a trusted brand that prioritizes customer satisfaction and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body ensures durability and resistance to environmental stress, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs, which is ideal for space-constrained applications.

Package Shape: RECTANGULAR

A rectangular shape provides a stable form factor that fits well in standard PCB layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances speed and efficiency, allowing for quicker data transfers.

No. of Terminals: 4

Having only four terminals simplifies the PCB design and reduces manufacturing costs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This style is ideal for high-density applications and supports advanced packaging technologies.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C makes this EEPROM suitable for industrial and harsh environment applications.

Organization: 4KX8

The 4Kx8 organization ensures efficient data storage capacity and retrieval for a variety of applications.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the EEPROM to function effectively in extreme environments.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates effective heat dissipation and improves reliability in performance.

Maximum Seated Height: 0.345 mm

A low seated height enables compatibility with modern slim devices and reduces overall profile.

Maximum Clock Frequency (fCLK): 0.4 MHz

The operational frequency of 0.4 MHz is sufficient for many embedded systems, ensuring reliable data communication.

Width: 0.674 mm

A narrow width is excellent for space-saving designs while maintaining functionality.

Minimum Supply Voltage (Vsup): 1.6 V

A low minimum supply voltage contributes to energy efficiency, making it suitable for battery-powered devices.

Length: 0.795 mm

Short length provides flexibility in tight spaces, accommodating various design requirements.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure reliability for critical applications where performance is essential.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it suitable for a range of applications.

Parallel or Serial: SERIAL

Serial communication simplifies connections and reduces pin count, facilitating easier integration.

Terminal Form: BALL

Ball terminals enhance soldering reliability and enable efficient assembly processes.

No. of Words: 4096 words

The 4096 words of storage provide ample space for data in many applications without requiring more complex setups.

Memory Width: 8

An 8-bit memory width is standard for many microcontrollers, allowing seamless integration and compatibility.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch supports high-density designs and is compatible with modern PCB manufacturing standards.

No. of Words Code: 4K

This code indicates that the product is well-suited for tasks requiring moderate data storage capacity.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V offers a higher operational ceiling, allowing for versatile applications.

Serial Bus Type: I2C

I2C bus compatibility makes the EEPROM easy to connect with multiple devices in a serial communication setup.

Maximum Write Cycle Time (tWC): 5 ms

A write cycle time of 5 ms supports efficient data writing, which is essential for real-time applications.

Memory Density: 32768 bit

The 32768 bit memory density allows for sufficient storage in various embedded systems, balancing size and performance.

Memory IC Type: EEPROM

As an EEPROM, this memory IC provides non-volatile storage, essential for saving data even when power is lost.

Technical Specifications

EEPROM M24C32-FCU6TP/TF attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

R-PBGA-B4

Length:

.795 mm

Memory Density:

32768 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

4

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.345 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.674 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24C32-FCU6TP/TF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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